JPS5515265A - Collet for assembling semiconductor device - Google Patents

Collet for assembling semiconductor device

Info

Publication number
JPS5515265A
JPS5515265A JP8879778A JP8879778A JPS5515265A JP S5515265 A JPS5515265 A JP S5515265A JP 8879778 A JP8879778 A JP 8879778A JP 8879778 A JP8879778 A JP 8879778A JP S5515265 A JPS5515265 A JP S5515265A
Authority
JP
Japan
Prior art keywords
supporter
collet
face
curvature
recession
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8879778A
Other languages
Japanese (ja)
Inventor
Akira Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8879778A priority Critical patent/JPS5515265A/en
Publication of JPS5515265A publication Critical patent/JPS5515265A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To raise a reliability of a device by radiating the heat generated from an element a supporter uniformly, with the element positioned in parallel with the supporter for soldering it to the supporter slidably by providing beforehand a curvature face in a slope face of a collet recession for accommodation the semiconductor element.
CONSTITUTION: A slope face 16 in the recession of a collect 16 provided at the top end of an opening 10 for introduction of vacuum is formed in a curvature state to place thereon a semiconductor element 7. Successively, the element 7 is fixed on a supporter 3 through a solder material 2, but in this case the end 11 of the element 7 moves slidably on the curvature face and the supporter 3 and element 7 are sustained in a parallel condition. Whereby the heat generated from the element 7 is radiated to the supporter 3 uniformly to assure an certain soldering to the element 7.
COPYRIGHT: (C)1980,JPO&Japio
JP8879778A 1978-07-20 1978-07-20 Collet for assembling semiconductor device Pending JPS5515265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8879778A JPS5515265A (en) 1978-07-20 1978-07-20 Collet for assembling semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8879778A JPS5515265A (en) 1978-07-20 1978-07-20 Collet for assembling semiconductor device

Publications (1)

Publication Number Publication Date
JPS5515265A true JPS5515265A (en) 1980-02-02

Family

ID=13952841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8879778A Pending JPS5515265A (en) 1978-07-20 1978-07-20 Collet for assembling semiconductor device

Country Status (1)

Country Link
JP (1) JPS5515265A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242436U (en) * 1988-09-17 1990-03-23
JPWO2013176202A1 (en) * 2012-05-25 2016-01-14 株式会社村田製作所 Vertical cavity surface emitting laser element, vertical cavity surface emitting laser array element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242436U (en) * 1988-09-17 1990-03-23
JPWO2013176202A1 (en) * 2012-05-25 2016-01-14 株式会社村田製作所 Vertical cavity surface emitting laser element, vertical cavity surface emitting laser array element
US9698568B2 (en) 2012-05-25 2017-07-04 Murata Manufacturing Co., Ltd. Vertical-cavity surface-emitting laser device and vertical-cavity surface-emitting laser array device

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