JPH0242436U - - Google Patents

Info

Publication number
JPH0242436U
JPH0242436U JP12185188U JP12185188U JPH0242436U JP H0242436 U JPH0242436 U JP H0242436U JP 12185188 U JP12185188 U JP 12185188U JP 12185188 U JP12185188 U JP 12185188U JP H0242436 U JPH0242436 U JP H0242436U
Authority
JP
Japan
Prior art keywords
collet
electronic components
utility
scope
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12185188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12185188U priority Critical patent/JPH0242436U/ja
Publication of JPH0242436U publication Critical patent/JPH0242436U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H01L2224/75304—Shape of the pressing surface being curved

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本実施例のコレツトの先端部分と電子
部品の縦断正面図である。第２図は平コレツトが
電子部品を吸着した状態の縦断正面図であつて、
第２図ａは正常時の、第２図ｂは異常時の状態を
示す。第３図ａおよびｄは角錐コレツトがそれぞ
れ正常および異常な電子部品を吸着した状態の縦
断正面図であり、第３図ｂは第３図ａのＸ―Ｘ断
面図、第３図ｃは電子部品がθ°回転して配置さ
れた場合における第３図ａのＸ―Ｘ断面図である
。 ３０……コレツト、３１……吸着面。 FIG. 1 is a longitudinal sectional front view of the tip of the collet and electronic components of this embodiment. FIG. 2 is a longitudinal sectional front view of the flat collet with electronic components adsorbed.
FIG. 2a shows the normal state, and FIG. 2b shows the abnormal state. Figures 3a and 3d are longitudinal sectional front views of the pyramidal collet sucking normal and abnormal electronic components, respectively, Figure 3b is a sectional view taken along line XX in Figure 3a, and Figure 3c is an electronic FIG. 3 is a sectional view taken along the line XX in FIG. 3a when the parts are arranged rotated by θ°; 30...Collection, 31...Adsorption surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ほぼ逆椀状に形成した吸着面を有することを特
徴とするコレツト。 A collet characterized by having a suction surface formed almost in the shape of an inverted bowl.
JP12185188U 1988-09-17 1988-09-17 Pending JPH0242436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12185188U JPH0242436U (en) 1988-09-17 1988-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12185188U JPH0242436U (en) 1988-09-17 1988-09-17

Publications (1)

Publication Number Publication Date
JPH0242436U true JPH0242436U (en) 1990-03-23

Family

ID=31369239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12185188U Pending JPH0242436U (en) 1988-09-17 1988-09-17

Country Status (1)

Country Link
JP (1) JPH0242436U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515265A (en) * 1978-07-20 1980-02-02 Mitsubishi Electric Corp Collet for assembling semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5515265A (en) * 1978-07-20 1980-02-02 Mitsubishi Electric Corp Collet for assembling semiconductor device

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