JPS5583239A - Mounting tip element - Google Patents
Mounting tip elementInfo
- Publication number
- JPS5583239A JPS5583239A JP15637678A JP15637678A JPS5583239A JP S5583239 A JPS5583239 A JP S5583239A JP 15637678 A JP15637678 A JP 15637678A JP 15637678 A JP15637678 A JP 15637678A JP S5583239 A JPS5583239 A JP S5583239A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- tips
- chuck
- vacuum
- lowers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
PURPOSE: To eliminate tip falling during process by changing the side on which tips are mounted from conventional bottom side of substrate to the upper side of substrate and by pressing arranged tips.
CONSTITUTION: A substrate 1 is transferred with the tip-mounting surface facing upward and positioned to the specified location. The pick-and-place device 23 moves through gate-shape route, vacuum-chuck 24 lowers on multi-magazine 4, and after vacuum-sucking numbers of tips 2 on many nozzles at one time, the chuck 24 moves to the positioned substrate 1, lowers on it, and stops. When vacuum is released, tips 2 fall on the substrate 1. Then, compressed air is injected from the nozzles of chuck 24 so that tips 2 are pressed on adhesive-coated substrate 1 and bonded on it. Because the substrate 1 mounts elements 2 arranged in the specified pattern in this manner, the adhesive is prevented from being deposited on undesired area, no tips fall, and smooth mounting can be obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15637678A JPS5583239A (en) | 1978-12-20 | 1978-12-20 | Mounting tip element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15637678A JPS5583239A (en) | 1978-12-20 | 1978-12-20 | Mounting tip element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5583239A true JPS5583239A (en) | 1980-06-23 |
| JPS638640B2 JPS638640B2 (en) | 1988-02-23 |
Family
ID=15626392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15637678A Granted JPS5583239A (en) | 1978-12-20 | 1978-12-20 | Mounting tip element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5583239A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118688A (en) * | 1979-03-07 | 1980-09-11 | Toshiba Seiki Kk | Device for adhering electronic part on printed board |
| JPS5799761A (en) * | 1980-10-20 | 1982-06-21 | Kee Puratsufu Uein | Device for mounting circuit package in socket |
| JPS57106262U (en) * | 1980-12-19 | 1982-06-30 | ||
| JPS58319A (en) * | 1981-06-25 | 1983-01-05 | Fukui Kikai Kk | Tap leading device for coil material |
| JPS58191494A (en) * | 1982-04-21 | 1983-11-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Part placing method and device |
| JP2008263116A (en) * | 2007-04-13 | 2008-10-30 | Denso Corp | Method of manufacturing electronic component built-in board |
-
1978
- 1978-12-20 JP JP15637678A patent/JPS5583239A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118688A (en) * | 1979-03-07 | 1980-09-11 | Toshiba Seiki Kk | Device for adhering electronic part on printed board |
| JPS6316919B2 (en) * | 1979-03-07 | 1988-04-11 | Toshiba Seiki Kk | |
| JPS5799761A (en) * | 1980-10-20 | 1982-06-21 | Kee Puratsufu Uein | Device for mounting circuit package in socket |
| JPS57106262U (en) * | 1980-12-19 | 1982-06-30 | ||
| JPS58319A (en) * | 1981-06-25 | 1983-01-05 | Fukui Kikai Kk | Tap leading device for coil material |
| JPS58191494A (en) * | 1982-04-21 | 1983-11-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | Part placing method and device |
| JP2008263116A (en) * | 2007-04-13 | 2008-10-30 | Denso Corp | Method of manufacturing electronic component built-in board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS638640B2 (en) | 1988-02-23 |
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