JPS5553438A - Treatment of semiconductor substrate - Google Patents
Treatment of semiconductor substrateInfo
- Publication number
- JPS5553438A JPS5553438A JP12707678A JP12707678A JPS5553438A JP S5553438 A JPS5553438 A JP S5553438A JP 12707678 A JP12707678 A JP 12707678A JP 12707678 A JP12707678 A JP 12707678A JP S5553438 A JPS5553438 A JP S5553438A
- Authority
- JP
- Japan
- Prior art keywords
- filter
- substrate
- semiconductor substrate
- stage
- dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To enable to perform complete dicing down to the bottom surface of a substrate without causing damage to the dicing blade by using a teflon filter as the support for a semiconductor substrate to be diced.
CONSTITUTION: Bonding wax 22 is coated on the back surface of semiconductor substrate 21 provided with bump 21' on its front surface, and teflon filter 23 is fitted on this surface. Next, filter 23 is fixed on vacuum chucking stage 24 of the dicing device with the surface of filter 23 directed downward, and thereby cutting groove 25, which cuts substrate 21 completely, is formed. Subsequently, filter 23, together with substrate 21 lying on this, is removed form stage 24, and a new teflon filter 26 is mounted on the surface of substrate 21. Then, this is sandwiched by cleaning jig 28, 28', having vacuum-drawing hole 27, and fixed by clips 30, 30'. Next, by using trichloroethylene, wax 22 is removed, filter 26 is removed on stage 31, and the chip is transferred onto adhesive sheet 33.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12707678A JPS5553438A (en) | 1978-10-16 | 1978-10-16 | Treatment of semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12707678A JPS5553438A (en) | 1978-10-16 | 1978-10-16 | Treatment of semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5553438A true JPS5553438A (en) | 1980-04-18 |
Family
ID=14950975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12707678A Pending JPS5553438A (en) | 1978-10-16 | 1978-10-16 | Treatment of semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5553438A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5494549A (en) * | 1992-01-08 | 1996-02-27 | Rohm Co., Ltd. | Dicing method |
-
1978
- 1978-10-16 JP JP12707678A patent/JPS5553438A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5494549A (en) * | 1992-01-08 | 1996-02-27 | Rohm Co., Ltd. | Dicing method |
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