JPS5624941A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5624941A
JPS5624941A JP10099579A JP10099579A JPS5624941A JP S5624941 A JPS5624941 A JP S5624941A JP 10099579 A JP10099579 A JP 10099579A JP 10099579 A JP10099579 A JP 10099579A JP S5624941 A JPS5624941 A JP S5624941A
Authority
JP
Japan
Prior art keywords
stylus
chip
chuck
submount
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10099579A
Other languages
Japanese (ja)
Inventor
Shigeyuki Nitsuta
Kazuto Matsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10099579A priority Critical patent/JPS5624941A/en
Publication of JPS5624941A publication Critical patent/JPS5624941A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To eliminate damage of a semiconductor laser chip at all times and to remove the displacement thereof by positioning the chip using a vacuum attracting stylus cooperative with a support and the chip with each other and a chuck when die bonding the chip through the support onto a heat dissipating unit. CONSTITUTION:A silicon submount 1 is placed at predetermined position on a heat dissipating unit 4 while attracting it with the vacuum attracting stylus 5 to retain under pressure the stylus 5, and is nipped at the side surfaces fixedly using a chuck 6 moving in predetermined positin relation with the stylus 5 in this state. Then, the stylus 5 is separated from the submount 1, the semiconductor laser chip 2 is attracted to be placed on the submount 1 to be retained by the stylus 5, and the chuck 6 is removed to heat to integrate the heat dissipating unit 4, the submount 1 and the chip 2. The stylus 5 and the chuck 6 are thus cooperated to enable the die bond without position displacement nor damage of the chip.
JP10099579A 1979-08-07 1979-08-07 Manufacture of semiconductor device Pending JPS5624941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10099579A JPS5624941A (en) 1979-08-07 1979-08-07 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10099579A JPS5624941A (en) 1979-08-07 1979-08-07 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5624941A true JPS5624941A (en) 1981-03-10

Family

ID=14288876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10099579A Pending JPS5624941A (en) 1979-08-07 1979-08-07 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5624941A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818932A (en) * 1981-07-25 1983-02-03 Nec Corp Die bonding of semiconductor element
JPS5987825A (en) * 1982-11-11 1984-05-21 Toshiba Corp Die-bonding method
JPS60133735A (en) * 1983-12-21 1985-07-16 Fujitsu Ltd Manufacture of semiconductor device
JPS62203394A (en) * 1986-03-04 1987-09-08 Matsushita Electric Ind Co Ltd Bonding for semiconductor laser
JPS6367793A (en) * 1986-09-09 1988-03-26 Matsushita Electric Ind Co Ltd Method and apparatus for bonding semiconductor laser

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818932A (en) * 1981-07-25 1983-02-03 Nec Corp Die bonding of semiconductor element
JPS5987825A (en) * 1982-11-11 1984-05-21 Toshiba Corp Die-bonding method
JPH0554260B2 (en) * 1982-11-11 1993-08-12 Tokyo Shibaura Electric Co
JPS60133735A (en) * 1983-12-21 1985-07-16 Fujitsu Ltd Manufacture of semiconductor device
JPS62203394A (en) * 1986-03-04 1987-09-08 Matsushita Electric Ind Co Ltd Bonding for semiconductor laser
JPS6367793A (en) * 1986-09-09 1988-03-26 Matsushita Electric Ind Co Ltd Method and apparatus for bonding semiconductor laser

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