JPS5543813A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS5543813A
JPS5543813A JP11579978A JP11579978A JPS5543813A JP S5543813 A JPS5543813 A JP S5543813A JP 11579978 A JP11579978 A JP 11579978A JP 11579978 A JP11579978 A JP 11579978A JP S5543813 A JPS5543813 A JP S5543813A
Authority
JP
Japan
Prior art keywords
pellet
base board
sucker
vacuum
arrow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11579978A
Other languages
Japanese (ja)
Inventor
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11579978A priority Critical patent/JPS5543813A/en
Publication of JPS5543813A publication Critical patent/JPS5543813A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent formation of a gold-silicon eutectoid between rear side of a pellet and a base board by attaching a pellet onto the base board by pressing and vibrating it after it is released once by semiconductor pellet sucker.
CONSTITUTION: A pellet 2 is vacuum-sucked by a vacuum sucker from an indentation on a semicondcutor pellet stacking section 3, conveyed to a prescribed position and placed on a base board in a horizontal position. The vacuum sucker, which has once released the pellet completely, is lowered in the direction of the arrow 6 to again hold and press the pellet 2, vibrate it in the direction of the arrow a and attach it (the semiconductor pellet) onto the base board 4.
COPYRIGHT: (C)1980,JPO&Japio
JP11579978A 1978-09-22 1978-09-22 Bonding device Pending JPS5543813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11579978A JPS5543813A (en) 1978-09-22 1978-09-22 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11579978A JPS5543813A (en) 1978-09-22 1978-09-22 Bonding device

Publications (1)

Publication Number Publication Date
JPS5543813A true JPS5543813A (en) 1980-03-27

Family

ID=14671359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11579978A Pending JPS5543813A (en) 1978-09-22 1978-09-22 Bonding device

Country Status (1)

Country Link
JP (1) JPS5543813A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745250A (en) * 1980-09-01 1982-03-15 Fujitsu Ltd Manufacture of semiconductor device
JPH0496020U (en) * 1991-01-16 1992-08-20

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5745250A (en) * 1980-09-01 1982-03-15 Fujitsu Ltd Manufacture of semiconductor device
JPH0496020U (en) * 1991-01-16 1992-08-20

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