JPS5694638A - Method and device for bonding of pellet - Google Patents

Method and device for bonding of pellet

Info

Publication number
JPS5694638A
JPS5694638A JP16933079A JP16933079A JPS5694638A JP S5694638 A JPS5694638 A JP S5694638A JP 16933079 A JP16933079 A JP 16933079A JP 16933079 A JP16933079 A JP 16933079A JP S5694638 A JPS5694638 A JP S5694638A
Authority
JP
Japan
Prior art keywords
bonding
pellets
collet
pellet
pockets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16933079A
Other languages
Japanese (ja)
Inventor
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16933079A priority Critical patent/JPS5694638A/en
Publication of JPS5694638A publication Critical patent/JPS5694638A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To raise the working efficiency of pellet bonding by shortening a time required for bonding one pellet even when a time required for bonding operation by a collet can not be shortened. CONSTITUTION:The collet 11 is provided with pellet holders 12 and 12' corresponding to pockets 9 and 9'. These holders are formed monolithically with the collet and at an interval equal to that of lead groups in a lead frame 3. The pellets set in the pockets are attracted respectively and placed on the bonding places of different lead groups in the lead frame to be bonded. Since the conveyance of the pellet 2 by a pickup 5 requires about one second and the conveyance and bonding thereof by the collet 11 about 6sec, two pellets can be conveyed to a positioning saucer 8 during the bonding operation. In line with the operation of the pickup 5, the pockets are moved alternately to set the pellets. When the collet is operated then, the holders 12 and 12' mount the pellets simultaneously on the bonding places in the lead frame, bond the pellets simultaneously, release the same, and return to the starting position. At this time, the subsequent pellets are already set.
JP16933079A 1979-12-27 1979-12-27 Method and device for bonding of pellet Pending JPS5694638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16933079A JPS5694638A (en) 1979-12-27 1979-12-27 Method and device for bonding of pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16933079A JPS5694638A (en) 1979-12-27 1979-12-27 Method and device for bonding of pellet

Publications (1)

Publication Number Publication Date
JPS5694638A true JPS5694638A (en) 1981-07-31

Family

ID=15884542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16933079A Pending JPS5694638A (en) 1979-12-27 1979-12-27 Method and device for bonding of pellet

Country Status (1)

Country Link
JP (1) JPS5694638A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005022607A1 (en) * 2003-08-27 2005-03-10 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and component mounting method
JP2006206212A (en) * 2005-01-26 2006-08-10 Shibuya Kogyo Co Ltd Article transferring device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005022607A1 (en) * 2003-08-27 2005-03-10 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and component mounting method
CN100394538C (en) * 2003-08-27 2008-06-11 松下电器产业株式会社 Component mounting apparatus and component mounting method
US7437818B2 (en) 2003-08-27 2008-10-21 Matsushita Electric Industrial Co., Ltd. Component mounting method
US8001678B2 (en) 2003-08-27 2011-08-23 Panasonic Corporation Component mounting apparatus
JP2006206212A (en) * 2005-01-26 2006-08-10 Shibuya Kogyo Co Ltd Article transferring device
JP4501702B2 (en) * 2005-01-26 2010-07-14 澁谷工業株式会社 Goods transfer device

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