JPS55138853A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS55138853A
JPS55138853A JP4687879A JP4687879A JPS55138853A JP S55138853 A JPS55138853 A JP S55138853A JP 4687879 A JP4687879 A JP 4687879A JP 4687879 A JP4687879 A JP 4687879A JP S55138853 A JPS55138853 A JP S55138853A
Authority
JP
Japan
Prior art keywords
wire
clamper
pawls
bonding apparatus
retarded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4687879A
Other languages
Japanese (ja)
Other versions
JPS5854500B2 (en
Inventor
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP54046878A priority Critical patent/JPS5854500B2/en
Publication of JPS55138853A publication Critical patent/JPS55138853A/en
Publication of JPS5854500B2 publication Critical patent/JPS5854500B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a compact and reliable wire bonding apparatus by employing a linear actuator to reciprocate a wire clamper along the wire feeding direction. CONSTITUTION:A tool 2 is moved to the first bonding point in the state that the gripping pawls 4a, 4b of a wire clamper 4 are closed to bond a wire 3. The pawls 4a, 4b are opened, and the tool 2 is move on the second bonding point. In the meantime, the wire clamper 4 is retarded in the predetermined distances along the wire 3. Then, the wire 3 is bonded, the pawls 4a, 4b are closed to clamp the wire 3 and the wire clamper 4 is retarded in predetermined distance to cut the wire 3.
JP54046878A 1979-04-17 1979-04-17 wire bonding equipment Expired JPS5854500B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54046878A JPS5854500B2 (en) 1979-04-17 1979-04-17 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54046878A JPS5854500B2 (en) 1979-04-17 1979-04-17 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS55138853A true JPS55138853A (en) 1980-10-30
JPS5854500B2 JPS5854500B2 (en) 1983-12-05

Family

ID=12759605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54046878A Expired JPS5854500B2 (en) 1979-04-17 1979-04-17 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS5854500B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222230A (en) * 1985-03-28 1986-10-02 Toshiba Corp Wire bonding method for semiconductor device
JPS636733U (en) * 1986-07-01 1988-01-18
US5971254A (en) * 1997-01-02 1999-10-26 Texas Instruments Incorporated Decoupled xyz stage

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5927098A (en) * 1982-08-06 1984-02-13 シ−アイ化成株式会社 Tunnel waterproof construction method
JPH0431360Y2 (en) * 1985-11-13 1992-07-28

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222230A (en) * 1985-03-28 1986-10-02 Toshiba Corp Wire bonding method for semiconductor device
JPS636733U (en) * 1986-07-01 1988-01-18
JPH0423324Y2 (en) * 1986-07-01 1992-05-29
US5971254A (en) * 1997-01-02 1999-10-26 Texas Instruments Incorporated Decoupled xyz stage

Also Published As

Publication number Publication date
JPS5854500B2 (en) 1983-12-05

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