JPH0423324Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a drive mechanism for a wire clamp provided in a wire bonding apparatus.

[Conventional technology]

A wire clamp is provided so as to be reciprocatable along the direction in which the wire is supplied to the bonding tool,
The opening/closing and reciprocation of the wire clamp are related to cutting the wire and feeding out the wire to protrude the length required for the gold ball or stitch from the tool, but the reciprocation of this type of wire clamp is A motor and cam were used as the drive mechanism.

[Problem that the invention attempts to solve]

Therefore, the response speed of the motor and cam is slow, and since the motor with a large mass is mounted on the moving part, the movement response speed of each part is slow, making it impossible to speed up the bonding work, which has become a problem. .

It is also possible to use one solenoid and a spring, but in that case, if one solenoid is provided with two stopping positions, the response time will be longer, and the above-mentioned problems cannot be solved. The magnetic force was insufficient, leading to an increase in the size of the solenoid.

The present invention attempts to solve the above-mentioned conventional problems, and because it has a quick response and is lightweight, the inertial resistance to the movement of each part is small, increasing the response speed of movement, and therefore making bonding work easier. An object of the present invention is to provide a wire clamp drive mechanism that can increase the speed of the wire clamp.

[Means for solving problems]

As a means to solve the above problems, the present invention provides a wire clamp for gripping and releasing the bonding wire supplied to the bonding tool from a predetermined position close to the bonding tool along the supply direction of the bonding wire. A first backward movement for moving the bonding wire a predetermined distance away from the bonding tool in preparation for feeding the bonding wire, and then a second backward movement for moving the bonding wire a predetermined distance further away from the bonding tool for cutting the wire. Next, in a drive mechanism for a wire clamp in a wire bonding apparatus, which moves the bonding wire forward to return it to the predetermined position in order to let it out and protrude from the bonding tool, the wire clamp 5 is attached to a clamp stay 6 on the base. The clamp stay 6 is provided on a frame 7 protruding from the frame 2 via a cross roller guide 8 so as to be able to reciprocate along the bonding wire supply direction with a spring 15. A second lever 14 having an arm 9 in contact with the second solenoid 10 is swingably provided on the frame 2, and the lever 14 is provided with an arm 11 that comes into contact with and leaves the second solenoid 10, and an arm 13 that is connected to the first lever 16. A first lever 16 having an arm 18 that comes into contact with and leaves the arm 13 and an arm 17 that comes into contact with and leaves the first solenoid 12 is swingably provided on the frame 2 so as not to impede the backward movement of the second lever 14. To provide a drive mechanism for a wire clamp in a wire bonding apparatus, characterized in that a second solenoid 10 and a first solenoid 12 are arranged so as to face and be able to attract the arm 13 of the first lever 14 and the arm 17 of the first lever 16, respectively. It is something.

[Effect]

The present invention has the above-described specific configuration, so that when the first solenoid is turned on with the wire clamp gripping the wire, the movable member is moved via the intermediary member, and therefore the wire clamp is moved. A first retraction movement can be performed to prepare for wire payout.

Next, with the wire open, connect the second solenoid as well.
When ON, the movable member is moved further since the intermediate member cannot prevent the second backward movement, so that the wire clamp can perform the second backward movement to cut the wire.

Next, while holding the wire, connect both solenoids.
When turned OFF, the spring moves the wire clamp forward, thus allowing the wire to be fed out and protruded from the bonding tool.

〔Example〕

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a bonding device using the wedge bonding method, which is equipped with a bonding wedge 1 as a bonding tool, and the bonding wedge 1 is provided at the tip of a horn 3 of an ultrasonic generator fixed to a frame 2. . frame 2
is swingably provided on the frame 4, and the frame 4
is mounted on a horizontally movable frame (not shown) using an XY table so as to be movable up and down.

The wire clamp 5 is attached to a clamp stay 6, and the clamp stay 6 is attached to a frame 7 provided protruding from the frame 2 via a cross roller guide 8 along the bonding wire supply direction.
The frame 2 and the frame 7 integrally form a base.

The clamp stay 6 includes an arm 9 that is always in contact with the clamp stay 6, and a second solenoid 1 that will be described below.
Arm 11 and first solenoid 12 that move toward and away from zero
A lever 14 having an arm 13 that indirectly receives the action of the clamp stay 6 and the lever 14 is connected.
and form a movable member. The lever 14 is attached to the frame 2 so as to be rotatable within a predetermined range.

A spring 15, a second solenoid 10, and a first solenoid 12 are provided as driving sources for the above-mentioned movable member.

The spring 15 is a tension spring disposed between the clamp stay 6 and the frame 7, and is provided to urge the wire clamp 5 to a predetermined position close to the bonding wedge 1.

The first solenoid 12 is provided with a lever 16 as a mediating member between it and a movable member.

The lever 16 is swingably attached to the frame 2 and includes an arm 17 that approaches and separates from the first solenoid 12 and an arm 18 that approaches and separates from the arm 13 of the lever 14. At times, the wire clamp 5 is rotated due to the rotation of the lever 14 when the arm 18 presses down the arm 13, and the sliding of the clamp stay 6 due to the rotation of the lever 14.
In other words, the first solenoid 12 is configured to move the movable member via the lever 16 so that the movable member can be moved a required distance away from the bonding wedge 1 in preparation for feeding out the wire. , is provided.

The second solenoid 10 attracts the arm 11 of the lever 14 after the first backward movement and further rotates the lever 14. Therefore, the clamp stay 6 further slides so that the wire clamp 5 can cut the bonding wire. Provision is made so that a second retraction movement can be carried out, which involves a further distance of movement.

Next, the operation will be explained according to FIGS. 2a, b, and c.

In FIG. 2a, both the first and second solenoids 12 and 10 are in the OFF state. The wire clamp 5 has a spring 1 at a predetermined position close to the bonding wedge 1.
At this time, the arm 9 of the lever 14 is in the A position. A counterclockwise spring force also acts on the lever 14.

When only the first solenoid 12 is turned ON in this state, the arm 17 is attracted as shown in Fig. 2b, the lever 16 is rotated counterclockwise, and the lever 14 is rotated clockwise to move the arm 9 from the A position. position, the clamp stay 6 slides away from the bonding wedge 1 against the force of the spring 15, so that the wire clamp 5 makes a first retraction movement from the predetermined position. . At the time of this movement, the wire clamp 5 opens the wire and prepares to feed out the wire. Further, if this movement is performed while the bonding wedge 1 is moving by opening the wire clamp 5 after the first bond is completed, it will help speed up the work.

Next, when the second solenoid 10 is also turned on, the arm 11 is attracted as shown in Figure 2c, the lever 14 further rotates clockwise until the arm 9 moves from the A position to the C position, and the clamp stay 6 is moved to the bonding position. The spring 15 is moved further away from the wedge 1.
slides against the force of the wire clamp 5
performs a second backward movement. During this movement, the wire clamp 5 is in a state of gripping the wire, and as a result of this movement, the wire is torn off and cut.

Note that since the lever 16 does not prevent the lever 14 from rotating clockwise, the second backward movement is performed smoothly without being hindered by the lever 16.

Finally, when both solenoids 10 and 12 are turned OFF, the lever 14 is rotated by the spring 15 until the arm 9 moves from the C position to the A position, returning to the state shown in FIG. , move forward. During this movement, the wire clamp 5 is gripping the wire, and the tip of the wire can be projected from the bonding wedge 1.

In the figure, 19 is a solenoid for opening and closing the wire clamp 5, 20 is a guide provided on the back side of the clamp stay 6, and 21 is a guide 20 provided at the tip of the arm 9.
The roller 22 that is fitted and held in is a wire.

Further, in addition to the bonding apparatus using the wedge bonding method described above, the present invention can be similarly applied to a bonding apparatus using the nail head bonding method.

[Effect of idea]

The present invention includes a second lever that is swingably mounted on the frame and has an arm that is always in contact with the clamp stay, and the lever is provided with an arm that comes into contact with and leaves the second solenoid, and an arm that is connected to the first lever. A first lever having an arm that approaches and separates from the arm and an arm that approaches and separates from the first solenoid is swingably provided on the frame so as not to impede the backward movement of the second lever, and the arm of the second lever and the first lever By installing the second solenoid and the first solenoid so that they can be attracted to each other by facing the arms of the
The swing lever is divided into two stages, and the suction force of each lever's solenoid is not required for operation.
It is possible to downsize the solenoid, and it can be handled only by the tension spring of the clamp stay without requiring a spring for each lever.The inertia resistance is small, allowing for nimble operation, and the response speed is fast.In particular, the moving parts are lightweight and easy to use. Since the drive mechanism for the wire clamp in the wire bonding apparatus can be used in which the movement response speed of each part is fast, the bonding work can be performed at high speed, and a remarkable effect can be produced in practical use.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention; FIG. 1 is a front view, and FIGS. 2a, b, and c are front views illustrating the operation of the drive mechanism. 1... Bonding wedge, 2... Frame, 3... Horn, 4... Frame, 5... Wire clamp, 6... Clamp stay, 7... Frame, 8... Cross roller guide, 9... Arm , 10...second solenoid, 11...arm,
12...First solenoid, 13...Arm, 14
... Lever, 15 ... Spring, 16 ... Lever, 1
7 arm, 18... arm, 19... solenoid, 20... guide, 21... roller, 22...
wire.

Claims (1)

[Claims for Utility Model Registration] A wire clamp 5 that grips and releases a bonding wire 22 supplied to the bonding tool 1 is bonded from a predetermined position close to the bonding tool 1 along the supply direction of the bonding wire 22. A first backward movement of moving the bonding tool 1 a predetermined distance away from the bonding tool 1 in preparation for feeding the wire 22, and then further movement of the bonding tool 1 in order to cut the wire.
A wire in a wire bonding apparatus that performs a second backward movement in which the bonding wire 22 is moved a predetermined distance in a direction away from the bonding tool 1, and then a forward movement in which the bonding wire 22 is returned to the predetermined position in order to be fed out and protruded from the bonding tool 1. In the clamp drive mechanism, the wire clamp 5 is fixed to a clamp stay 6 on the base, and the clamp stay 6 is supplied with the bonding wire by a spring 15 via a cross roller guide 8 to a frame 7 provided protruding from the frame 2. A second lever 14 is swingably provided on the frame 2 and has an arm 9 that is disposed so as to be reciprocally movable along the direction and is always in contact with the clamp stay 6. 11, an arm 13 connected to the first lever 16, an arm 18 that comes into contact with and leaves the arm 13, and an arm 17 that makes contact with and leaves the first solenoid 12. The second solenoid 10 and the first solenoid 12 are provided in the frame 2 so as to be swingable so as not to impede movement, and are arranged so as to face and attract the arm 13 of the second lever 14 and the arm 17 of the first lever 16, respectively. A drive mechanism for a wire clamp in a wire bonding device characterized by: