JP2575066B2 - Semiconductor assembly equipment - Google Patents

Description

The present invention relates to a semiconductor integrated circuit (IC) and a large-scale integrated circuit (LS).
The present invention relates to a semiconductor assembling apparatus for assembling a semiconductor component of I).

(Background technology)

Conventionally, an apparatus as shown in FIG. 5 has been known as this type of semiconductor assembly apparatus.

In FIG. 5, an ultrasonic transducer 50 is swingably supported via a pin 52 on a frame 51 mounted on an XY table movable in the X and Y directions. A capillary 63 is attached to a tip of a bonding arm 53 attached to one end of the ultrasonic transducer 50. A lever 54 is provided at the other end of the ultrasonic transducer 50, and a roller 55 is provided at an end of the lever 54. With these configurations, a bonding head is formed. The roller 55 is configured to receive a counterclockwise moment by a spring 57 so as to be in contact with the cam 56. When the cam 56 is rotated by a pulse motor or the like, the capillary 63 moves up and down due to the shape of the cam 56. It is configured to be able to. The wire 64 is wound around the reel 58. The clamp 60 grips and cuts the wire 64, and 59 is a half clamp for pulling up the ball 68 and bringing it into contact with the lower end of the capillary 63. Reference numeral 61 denotes a torch for forming a ball, which is configured to be rotatable around a vertical axis.

A procedure for performing a bonding operation using the above apparatus will be described.

A case where the ball 68 formed at the tip of the wire 64 is bonded to the pad 65 of the pellet 66 using the capillary 63 will be described. First, the frame 51 is moved in the X and Y directions to position the capillary 63 above the torch 61. Then, a wire 64 having a predetermined length is extended from the tip of the capillary 63, and a ball is formed at the tip of the wire 64 by the torch 61. Next, as shown in FIG. 6A, the capillary 63 is moved to a position immediately above the pad 65 and positioned. Next, as shown in FIG. 6B, the capillary 63 is lowered and the ball 68 is padded.
Contact ball 65 and crush ball 68. Ultrasonic vibration or overheating is given simultaneously with the crushing. Thereafter, the capillary 63 is raised and moved in the horizontal direction, positioned above the lead 67 to be bonded, the capillary 63 is lowered as indicated by a two-dot chain line, and the lower end portion crushes a section of the wire 64, thereby flattening the flat portion. The wire is formed and fixed to the lead 67 using ultrasonic waves or overheating. The wire 64 is pulled and cut from the end of the flat portion, and then the capillary 63 is raised to complete one bonding. Thereafter, a ball 68 is formed at the tip of the wire 64 by the torch 61, and the state returns to the state shown in FIG. 6A, where the next bonding is performed.

The wire feed amount determined by the above device is determined by closing the clamp 60 and holding the wire 64 by the bonding timing at the time of rising after the 2'nd bonding connection on the lead 67 side shown in FIG. It is performed by being pulled out and cut. The process of determining the feed amount based on the bonding timing will be described with reference to the timing explanatory diagram of FIG.

(1) FIG. 8 shows a state in which the 2'nd bonding on the lead 67 side has been completed. At this time, the clamp 60 is open, and the distance Δs _a between the clamp 60 and the capillary 63 is shown as _a substantially constant distance in the figure. The vertical movement of the capillary 63, that is, the movement in the Z-axis direction is performed by a bonding arm.
Depending on the movement of 53, the movement speed and position control are digitally controlled by a control circuit (not shown).

(2) Moving to Fig. 8, clamp 60 and capillary
It rises in the Z-axis direction while maintaining a relative relationship with 63.

(3) In FIG. 8, the wire 64 fed out below the capillary 63 rises until the required feed amount f 'is reached,
The clamp 60 is closed during the continuous movement of the Z-axis ascent. When a command to close the clamp 60 is output by a control circuit (not shown), the feed amount f 'is determined.

(4) In FIG. 8, the clamp 64 is raised in the Z-axis direction with the clamp 60 closed, and the wire 64 is cut at the point A.

(5) As shown in FIG. 8, when the capillary 63 is moved up to a predetermined distance from the torch 61 by the bonding arm 53, a ball 68 is formed.

The wire feed amount is determined by the above steps.

[Problems to be solved by the invention]

However, the mechanism configuration for determining the wire feed amount as in the conventional semiconductor assembly apparatus has a drawback that the wire feed amount is varied to be long or short. If a variation such as a long or short wire feed occurs, the torch 61 causes the ball to move.
When the ball 68 is formed, the ball 68 is not formed to a desired size or the like, or the ball 68 is not formed. Thereafter, when the wire 64 is pulled up by the half clamp 59, it is rewound from the tip of the capillary 63 and the wire is cut. Disadvantageously occurs.

Wire breakage occurs during the bonding operation as described above. An operator stops the apparatus, performs a wire-punching operation on the capillary 63, and performs temporary bonding at a location different from other bonding points to form a ball. This temporary bonding is for performing the ball formation by the temporary bonding in the timing of performing the main bonding when the wire is broken or the ball is not formed at the time of the first bonding as described above. This temporary bonding is performed at the end of the lead 67 where no short circuit or conduction occurs, as shown in FIG. 7, since the lead 67 and the pad 65 cannot be used if the regular bonding is performed.

However, the above-described operation of the wire thread requires the skill of the operator, and also requires the operation of performing the temporary bonding and adjusting the timing and the like, and the removal of the wire. .

In view of the above, the present invention has been made in view of the above-described drawbacks of the related art, and can always maintain a constant wire feed amount after 2'nd bonding on the lead side, and can provide various other effects. It is an object of the present invention to provide a semiconductor assembling apparatus that can perform.

[Means for solving the problem]

A semiconductor assembling apparatus according to the present invention includes a bond arm provided with a capillary at a tip thereof, a swing arm for swinging the bonding arm up and down, and a swing arm on and away from the capillary. Displacement-provided wire clamp means, and drive means for displacing the wire clamp means, wherein a predetermined distance between the capillary and the wire clamp means is S, and a wire feed amount from the lower surface of the capillary. Where f is
The wire clamp means is displaced between the wire connection at the bonding point and the second bonding point so that the distance ΔS = S + f. After the wire connection to the second bonding point, the distance is changed during the transition to the next bonding. The wire clamp means is displaced so that ΔS becomes the distance S so that the feed amount of the wire from the lower surface of the capillary becomes f.

〔Example〕

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing a configuration of a semiconductor assembling apparatus according to the present invention.

In FIG. 1, a bonding arm 1 and a swing arm 2 capable of generating ultrasonic vibration are rotatably supported on a shaft 3 supported by a frame of a bonding head that can move in the X and Y directions. An electromagnetic attraction piece 4b is disposed on the bonding arm 1 so as to face the solenoid 4a disposed on the swing arm 2. When the solenoid 4a is energized from a power supply (not shown), an attraction force acts between the solenoid 4a and the electromagnetic attraction piece 4b, and the bonding arm 1 and the swing arm 2 are fixed. The bonding arm 1 is attracted to the solenoid 4a side by the attraction force of the solenoid 4a, but the swing arm 2 is provided with an adjustable stopper 6 composed of a screw or the like so as not to be attracted for a predetermined distance or more. A coil 5b is provided on the bonding arm 1 so as to face the magnet 5a provided on the swing arm 2, and the attraction between the magnet 5a and the coil 5b is provided at the tip of the bonding arm 1 during bonding. This is generated in order to urge the tip of the provided capillary 7 downward with the shaft 3 as a fulcrum.
A clamp arm 9 is attached to the tip of the swing arm 2 via a shaft 8.
The clamp arm 9 is provided with a clamp 9a for gripping and cutting the wire 10 by an opening / closing mechanism (not shown), that is, a wire clamp means. Have been. This clamp 9a
Rotates the clamp arm 9 up and down around the shaft 8 between the clamp 9a and the shaft 8 which are displaced in the direction of coming and going with respect to the capillary 7 by the swing of the clamp arm 9, A linear motor 11 as a driving means for displacing 9a is provided. This linear motor
Reference numeral 11 denotes a coil 11a provided on a support portion above the clamp arm 9 and a magnet 11b provided on a support portion above the swing arm 2. The positioning and moving speed can be controlled by control means (not shown). It is configured as follows.
The clamp arm 9 is controlled between the coil 11a and the magnet 11b so as to be able to swing upward. Also,
An electric torch 12 (electric torch) is provided below the capillary 7 so as to be rotatable on a vertical axis (not shown) by the action of an actuator or the like.
(Including 12 discharge electrodes), and is configured to pivotally move to the lower surface of the capillary 7 by the movement of the bonding arm 1. The electric torch 12 is configured to apply a predetermined voltage so as to form a ball at the tip of the wire 10 and to detect whether or not another wire 10 has touched. This energization detection is configured so that a constant voltage can be applied other than when the electric torch 12 is discharged. Above the clamp 9a, the wire 10 is fixedly supported by a frame (not shown), and a predetermined tension is applied to the wire 10 so that the wire 10 is always kept straight up to the tip of the capillary 7 of the bonding arm 1. A tension clamp 13 that can be opened and closed by an opening and closing mechanism (not shown) is provided, and the wire 10 is further wound around a reel (not shown) via a guide 14.

Next, a mechanism for vertically moving the swing arm 2 will be described.

The arm-side cam follower 15 is rotatably supported on the shaft 15a of the swing arm 2.
The swing base 16a of the swing frame 16 and the swing base 16 are independently rotatably supported by the swing arm 2. A bearing guide 16b is fixed to the swing base 16a, and a preload arm 16d on which a cam follower 17 is supported is rotatably provided on the preload arm pin 16c. A preload spring 16a having a tensile force is stretched between the tip of the swing base 16a. The arm 18 is pressed against the periphery of the cam 18 by an arm-side cam follower 15 and a cam follower 17.
Each contact between the cam follower 15 and the cam follower 17 is configured to sandwich the rotation center of the cam 18. The bearing guide 16b is provided so as to be in contact with the outer surface of the radial bearing 20 provided on the cam shaft 19. Drive motor
The driving force of the cam 21 is transmitted to the cam 18 via the cam shaft 19, and the amount of change by the rotation of the cam 18 and the amount of change in the rotation angle are formed so as to be proportional. Is configured to be digitally controlled by control means (not shown). By controlling the cam 18, the amount of vertical movement of the bonding arm 1 can be controlled. The oscillating arm 2 reciprocates around the shaft 3 based on the movement of the cam 18, and reciprocates on the bonding arm 1 fixed to the oscillating arm 2 by the solenoid 4a and the electromagnetic attraction piece 4b. Let

Next, the operation of determining the wire feed amount using the apparatus having the above configuration will be described. The wire feed amount is determined by the electric torch 12 located below the capillary 7 and the capillary, as shown in FIG. When the wire 10 is fed from the tip of the wire 7 by a predetermined distance, a predetermined gap is required between the wire end and the electric torch 12. In other words, if the gap is not the specified amount as shown in FIGS. 2 (a) and 2 (c), there arise problems such as that a ball of a predetermined size is not formed at the tip of the wire or that the ball cannot be formed at all. is there. Therefore, in this embodiment, the capillary 7 is used.
Is determined so that the feed length of the wire 10 sent out from the tip of the wire is always constant. This will be described with reference to FIGS. 3 and 4.

(1) A step of wire bonding to a pad on a semiconductor pellet shown in FIGS. 3 and 4 or a normal semiconductor pellet is shown. Here, → moves the bonding arm 1 at high speed, and → moves to low speed to perform 1′st bonding. At this time, the clamp 9a of the clamp arm 9 is open, and the clamp 9a and the capillary 7 are closed.
Is a distance s (contract value). In the case of →, the capillary 7 moves up in the Z-axis direction and moves to the lead side which is the second bonding point.

(2) Next, in step (2), the linear motor 11 is excited so that the clamp arm 9 swings by a distance f in the Z-axis direction and stops. The setting of the moving speed and the distance is digitally controlled by a control circuit (not shown), and the distance f is set to be the feed amount of the wire. Then, the distance between the capillary 7 and the clamp 9a is a distance Δs, and this Δs is s + f. Here, the setting of the distance f by the movement of the clamp arm 9 does not have to be at the time when the clamp 9a is open.

(3) Next, during 2'nd bonding or after completion of 2'nd bonding, the clamp 9a is closed and the wire 10 is gripped.

(4) This 2′nd bonding is completed, and the process moves to →, that is, when the capillary 7 rises, the gap Δs between the capillary 7 and the clamp 9a is finally set to s.
The linear motor 11 is excited so as to make the clamp arm 9 swing. By doing so, the wire 10 is fed out to the lower surface of the capillary 7 by the difference f between Δs and s. Therefore, h becomes H + f, and the wire 10 is cut leaving a predetermined feed amount in the process of shifting to the next state. At this time, the downward movement of the clamp arm 9 and the upward movement of the capillary 7 are correlated so that the wire does not sag or stick during the transition from Δs to s.

(5) After the wire 10 is cut as described above, the capillary 7 further rises in the Z-axis direction, and a specified gap is generated between the electric torch 12 and the tip of the wire 10 shown in FIG. Thus, the rotation of the bonding arm 1 is controlled with the shaft 3 as a fulcrum.

Then, the state returns to the state where the ball is formed at the tip of the wire 10 by the electric torch 12, and the process proceeds to the next step.

The above steps are repeated to perform wire bonding.

Further, a cam mechanism may be provided between the clamp arm 9 and the bonding arm 1 instead of the linear motor, and the rotation of the clamp arm 9 may be controlled by the amount of rotation of the cam mechanism.

Other changes can be made within the spirit of the present invention.

〔The invention's effect〕

As described above, in the semiconductor assembling apparatus according to the present invention, the wire clamping means is displaced by the driving means during the transition from the first bonding point to the second bonding point, that is, during the wire looping, and at the second bonding point. The wire is fed out by displacing the wire clamping means in the reverse direction to obtain a desired feed amount.

That is, the feed amount is ensured during the wire looping and is independent of the looping operation, that is, without stopping the looping operation. As described above, since the feed amount is secured at the same time as the wire looping, the required time is shortened, and the speed of the bonding operation is increased.

Further, in the present invention, since the wire clamp means itself can be brought into and out of contact with the capillary on the swing arm with a slight stroke, and is displaced by the driving means, the feed amount is limited by the swing amount. The swing operation of the moving arm and the opening / closing timing of the wire clamp means are independent and can be set with high accuracy.

In addition, according to the present invention, the wire is already connected to the first bonding point when the wire clamping means is opened to secure the feed amount, so that the wire is not wound by the back tension. Therefore, the feed amount can be set by only one wire cutting means for wire cutting, and it is not necessary to provide another clamping means, and the structure of the apparatus is simplified.

Furthermore, as described above, since the wire is cut while securing the feed amount, so-called wire breakage does not occur.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a semiconductor assembling apparatus according to the present invention, and FIGS. 2 (a), 2 (b) and 2 (c) are diagrams illustrating adjustment of a wire length of the semiconductor assembling apparatus according to the present invention. 3 and 4 are explanatory views showing the process of determining the wire feed amount according to the present invention, FIG. 5 is a view showing a conventional semiconductor assembly apparatus, and FIGS. 6 (a) and (b) are bonding steps. FIG. 7 is a diagram for explaining conventional temporary bonding;
FIG. 8 is an explanatory diagram showing a conventional timing for determining the wire feed amount. 1 ... bonding arm, 2 ... swing arm, 3 ...
Shaft, 4a Solenoid, 4b Electromagnetic adsorption piece, 5a Magnet, 5b Coil, 6 Stopper, 7 Capillary, 8 Shaft, 9 Clamp arm, 9a Clamp, 10 ... wire, 11 ... linear motor, 12 ... electric torch, 13 ... tension clamp, 14 ... guide, 16 ...
… Swing frame, 17… Cam follower, 18… Cam.

Claims (2)

(57) [Claims] 1. A bonding arm having a capillary at a tip thereof, a swinging arm for swinging the bonding arm up and down, and a displaceable movable arm on the swinging arm in a direction approaching and separating from the capillary. A wire clamp means provided; and a driving means for displacing the wire clamp means, wherein a predetermined distance between the capillary and the wire clamp means is S, and a feed amount of the wire from the lower surface of the capillary is f. At this time, the wire clamp means is displaced between the wire connection at the first bonding point and the second bonding point so that the distance ΔS = S + f, and the process proceeds to the next bonding after the wire connection to the second bonding point. In the meantime, the wire clamp means is displaced so that the distance ΔS becomes the distance S, and the wire is clamped from the lower surface of the capillary. A semiconductor assembling apparatus characterized in that a feed amount is f. 2. The method according to claim 1, wherein after the second bonding point is connected, the wire clamping means is displaced to secure a feed amount of the wire for cutting.
The semiconductor assembling apparatus according to claim 1.