JPS6084829A - Method for wire bonding - Google Patents

Abstract

PURPOSE:To contrive the wire bonding enabling an easy adjustment such that the timing is easily set without a change of a bonding load due to the action of a clamper and a trouble in a mechanism by providing a means for controlling a position of a wire clamper on a bonding arm and by performing a control of clamper position with separated two driving means. CONSTITUTION:In a wire clamper driving mechanism, one end of it is engaged with a driving cam and a supersonic phone 2 is mounted on a bonding arm 3 provided on another end of it. A slider 4 is arranged in a manner it can slide freely in a longitudinal direction of an upper surface of the bonding arm 3. A movement of the slider 4 along a guide wall 10 is carried out by a wire-cut solenoid 11, a clamper-return solenoid 12 and a tensile spring 15. Opening and closing of clamper jaws 5, 5 are performed by a clamper opening solenoid 7. A quantity of movement of the slider 4, i.e. a wire feed quantity is changed by rotating a feed adjustment micrometer head 13 properly for adjustment.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire clamper drive mechanism, and more particularly to a wire clamper drive mechanism having a unique electric drive means.

A wire clamp technique used in wire bonding is disclosed, for example, in Japanese Patent Laid-Open No. 50-56160.

For example, in an ultrasonic wire bonder, which is one of the equipment for manufacturing semiconductor devices, a wire clamper mechanism is provided on or adjacent to a bonding arm mechanism as a main part of the bonder.

This wire clamper mechanism is closely related to the bonding arm and is used to hold and cut-feed the connection wire supplied to the bonding arm.

Conventionally, this type of wire clamper mechanism has an arm,
Driving force is applied externally via a lever, etc.

However, in such a conventional wire clamper mechanism, if <K, and the clamper is installed on the bonding arm, the bonding load force t acting on the bonding arm is lightweight, for example, about 30y-.
the driving force has an adverse effect on the bonding arm;
This resulted in deterioration of the bonding results.

In addition, the wire clamper mechanism is complicated because it applies the same driving force as the bonding arm mechanism, which is related to the movement of the bonding arm that moves up and down. Ta.

The present invention is intended to eliminate these conventional drawbacks, and its purpose is to prevent the bonding load from changing due to clamper operation, to facilitate timing adjustments, and to avoid mechanical troubles. There is no wire clamp drive to provide an rMJ mechanism.

The basic structure of the present invention for achieving such an object is to bond the position control means of the wire clamper.
It is provided on the arm and controls the position of the clamper during cutting, feeding, and return using two independent drive means.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, this wire clamper drive mechanism 1 is mounted on a bonding arm 3 having one end engaged with a drive cam (not shown) and an ultrasonic horn 2 provided at the other end. 3 so as to be freely slidable along the length direction of the upper surface.

The slider 4 has a pair of clamp jaws 5 provided at one end;
5, a clamper opening/closing solenoid 7 disposed behind the fulcrum 6 for opening and closing the clamp jaws 5, 5, an engaging plate 8 formed by bending the other end of the slider 4 upward, and this engaging plate 8. and a long hole 9 formed between the solenoids 7.

Furthermore, the bonding arm 3 on which the slider 4 is mounted has a guide wall 10 for guiding the slider 4 formed on both ends of the sliding surface 10a, and a wire cutting solenoid 11 is provided on an extension of the guide wall 10. The clamper return solenoids 12 are arranged in parallel, and each solenoid 11
．． Twelve rod engagement portions 11a and 12a are made to correspond in direction to the engagement plate 8.

Furthermore, a feed adjustment micrometer head 13 is provided at a position near the base of the clamper return solenoid 12 in line with the solenoid 12, and the shaft end 13a of this head 13 also corresponds in direction to the engagement plate 8.

Then, a pin 14 protruding from the top of the bonding arm 3 is inserted into the elongated hole 9 drilled in the slider 4, and a tension spring 15 is tensioned between the pin 14 and the engagement plate 8, and the slider 4 is inserted in the direction toward the tip of the horn 2. It gives an urging force.

Further, the clamp jaws 5.5 are bent downward as they approach their tips, and both clamp jaws 5.5 are arranged so as to hold the horn 2.

Next, the operation of such a wire crank drive mechanism will be explained. First, the movement of the slider 4 in the direction along the guide wall 10Vc is performed by a wire cutting solenoid 11, a clamper return solenoid 12, and a tension spring 15.

Further, the opening/closing operation of the clamp jaws 5.5 is performed by a clamp opening/closing solenoid 7.

The amount of movement of the slider 4, that is, the amount of wire feed can be changed by appropriately turning and adjusting the feed adjustment micrometer head 13.

Furthermore, in Figures 2 and 3, the relationship between the clamp, opening/closing operation, wire cutting operation, crank return operation, and bonding arm vertical movement as time changes is as follows: (a) On the first bonding side Feed the wire 16 with the wire 16 clamped (clamper opening/closing solenoid, 0FF) (wire cut solenoid, clamper return solenoid, 0FF)
) That is, it is a feeding step, during which the clamper moves from the third position to the first position.

(b) After bonding on the first bonding side and before starting to move to the second bonding side, open the clamper jaw 5°5 (clamper opening/closing solenoid, ON).

(c) After starting to move to the second pounding side, return the clamper jaws 5, 5 slightly (clamper return solenoid ON).

That is, it is a return step, during which the clamper moves from the first position to the second position in relation to the tool.

(dl Perform the second bonding in the previous state, and during this time, after clamping the wire 16 (clamper opening/closing solenoid,
0FF), cut wire 16 (wire cut solenoid, ON).

That is, this is a cutting process in which the clamper moves from the second position to the third position.

Feed immediately before the end of one cycle (clamper opening/closing solenoid, 0FF).

In this way, the operations (a) to (ω) are repeated to proceed with bonding.

In the above embodiment, an electric solenoid 7°11.12 is used as the drive source of the wire clamper drive mechanism 1, but instead of this, control using a small pulse motor as the drive source, or Needless to say, control may be performed using a small AC (or DC) motor.

FIG. 4 is a schematic enlarged view of the main part of FIG. 1.

In the figure, reference numeral 17 denotes a support unit integrated with the bonding arm, and a clamper driving means, that is, a solenoid 11.
．． 12 is supported. Feed adjustment micrometer/
The head 13 is set in the screw hole of the support body 17 via a screw 13a, and by rotating this head 13, the slider 4 slides forward on the arm 3 when feeding the wire, and Engagement plate 8 is rod end 1
3a The feed length is adjusted by making contact. In addition, solenoid 1'12 for clamper return
When the rod 12a is turned off, the rod 12a returns to the inside of the solenoid 12, and as a result, the engagement plate 8 is moved forward by the force of the spring, so that the relative position of the clamper jaw 5 can be brought forward.

FIG. 5 is a process diagram for explaining the present invention.

That is, the characteristic of the process described in the above embodiment is that the return operation for correcting the difference in the movement amount of the clamper between wire cut and wire feed is performed in the first stage with a relatively sufficient time.
This is performed between the bonding process and the second bonding process.

As is clear from the above description, according to the present invention, the clamper opening/closing operation and sliding operation are separated from the bonding arm operation drive source, and an electric drive means is fully utilized as this drive source. No matter what position K the bonding arm is in, the force of the clamper drive system is not applied to the bonding arm side.

Therefore, the bonding load does not change due to the clamper operation, making it possible to perform stable and highly accurate bonding.

In addition, since it makes full use of electric drive means, it is possible to adjust the timing of each rice cultivation, such as opening and closing the clamper.
A number of effects can be obtained, including being advantageous in terms of maintenance.

Further, according to the present invention, even if the wire is moved to the next first bonding point at high speed after the second bonding is completed, the wire remains clamped during that time, so the wire does not fall off and has the advantage of being gentle. have

[Brief explanation of the drawing]

An operation explanatory diagram used to explain the operation of the mechanism, and FIG. 3 is a time chart diagram used to explain the same operation. FIG. 4 is an enlarged view of the main part of FIG. 1, and FIG. 5 is a process diagram for explaining the present invention. l... Wire clamper drive mechanism, 2... Ultrasonic horn, 3... Bonding arm, 4... Slider,
5... Clamp jaw, 6... Fulcrum, 7... Clamper opening/closing solenoid, 8... Engagement plate, 9... Oblong hole,
10... Guide wall, 10a... Sliding surface, 11...
Wire cutting solenoid, 11a...rod end,
12... Clamper return solenoid, 12a...
・Rod end, 13... Feed adjustment micrometer head, 13a... Shaft end, 14... Pin, 15...
...Tension spring, 16...Wire. Figure 1 Figure 2 (W) '(b) (Cn (d-2 Figure 3 Figure 4 Figure/2 Figure 5

Claims (1)

[Scope of Claims] 1. A wire that is equipped with a tool that is shaped so that the wire can be passed through the tool, and a wire clamper that is provided near the tool and clamps the wire as necessary, and that feeds the wire to the tool for bonding. A bonding device. (a) a first clamper drive means provided on a bonding arm for moving said clamper in an open state from a first position to a second position; and a second clamper drive means provided on the bonding arm for moving the clamper from the first position to the third position to cut the wire, and after cutting the wire, the clamper in the washed and closed state is moved to the first position. ．． A wire pounding device characterized in that the wire is advanced from the third position to substantially the first position by controlling a second clamper driving means to pay out the wire under the tip of the tool. .