JP2627968B2 - Semiconductor assembly equipment - Google Patents

Semiconductor assembly equipment

Info

Publication number
JP2627968B2
JP2627968B2 JP2115102A JP11510290A JP2627968B2 JP 2627968 B2 JP2627968 B2 JP 2627968B2 JP 2115102 A JP2115102 A JP 2115102A JP 11510290 A JP11510290 A JP 11510290A JP 2627968 B2 JP2627968 B2 JP 2627968B2
Authority
JP
Japan
Prior art keywords
wire
capillary
arm
electric
swing arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2115102A
Other languages
Japanese (ja)
Other versions
JPH0412544A (en
Inventor
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP2115102A priority Critical patent/JP2627968B2/en
Publication of JPH0412544A publication Critical patent/JPH0412544A/en
Application granted granted Critical
Publication of JP2627968B2 publication Critical patent/JP2627968B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/8212—Aligning
    • H01L2224/82148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/82169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, e.g. nozzle
    • H01L2224/8218—Translational movements
    • H01L2224/82181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は半導体集積回路（IC）や大規模集積回路（LS
I）の半導体部品の組立を行う半導体組立装置に関す
る。The present invention relates to a semiconductor integrated circuit (IC) and a large-scale integrated circuit (LS).
The present invention relates to a semiconductor assembling apparatus for assembling a semiconductor component of I).

［背景技術］ 従来、この種の半導体組立装置としては第４図に示す
ような装置が知られている。[Background Art] Conventionally, as this type of semiconductor assembly apparatus, an apparatus as shown in FIG. 4 has been known.

第４図において、超音波振動子50はＸ方向及びＹ方向
に移動可能なXYテーブル上に載置されるフレーム51上に
ピン52を介して揺動可能に支持される。この超音波振動
子50の一端に取付けられているボンディングアーム53の
先端にキャピラリー63が取付けられている。また、超音
波振動子50の他端にはレバー54が設けられており、該レ
バー54の端部にはローラ55が設けられている。これらの
構成によりボンディングヘッドが形成される。上記ロー
ラ55はカム56と接触するようにバネ57により反時計方向
のモーメントを受けるように構成されており、パルスモ
ータ等によりカム56が回転されることにより該カム56の
形状によりキャピラリー63が昇降できるように構成され
ている。ワイヤ64はリール58に巻回されている。クワン
プ60はワイヤ64を握持して切断するものであり、59はボ
ール68を引上げてキャピラリー63の下端に接触させるた
めのハーフクランプである。また、61はボールを形成す
るためのトーチであり、垂直軸の回りを回動できるよう
に構成されている。In FIG. 4, an ultrasonic transducer 50 is swingably supported via a pin 52 on a frame 51 mounted on an XY table movable in the X and Y directions. A capillary 63 is attached to a tip of a bonding arm 53 attached to one end of the ultrasonic transducer 50. A lever 54 is provided at the other end of the ultrasonic transducer 50, and a roller 55 is provided at an end of the lever 54. With these configurations, a bonding head is formed. The roller 55 is configured to receive a counterclockwise moment by a spring 57 so as to be in contact with the cam 56. When the cam 56 is rotated by a pulse motor or the like, the capillary 63 moves up and down due to the shape of the cam 56. It is configured to be able to. The wire 64 is wound around the reel 58. The quump 60 grips and cuts the wire 64, and the numeral 59 denotes a half clamp for pulling up the ball 68 and bringing it into contact with the lower end of the capillary 63. Reference numeral 61 denotes a torch for forming a ball, which is configured to be rotatable around a vertical axis.

上記装置を用いてボンディング作業を行う手順につい
て説明する。A procedure for performing a bonding operation using the above apparatus will be described.

キャピラリー63を用い、ワイヤ64の先端に形成された
ボール68をペレット66のパッド65にボンディングする場
合について説明すると、 先ず、フレーム51をＸ、Ｙ方向に移動させキャピラリ
ー63をトーチ61の上方に位置させてキャピラリー63の先
端より所定の長さワイヤ64を伸長させ、このワイヤ64の
先端にトーチ61によりボールを形成する。次に、第５図
（ａ）に示すようにキャピラリー63をパッド65の直上の
高さに移動させて位置させる。次に、第５図（ｂ）に示
すようにキャピラリー63を下降させてボール68をパッド
65に接触させてボール68を押しつぶす。この押しつぶし
と同時に超音波振動又は過熱を与える。その後、キャピ
ラリー63を上昇及び水平方向に移動させ、ボンディング
すべきリード67の上方に位置させ、二点鎖線で示すよう
にキャピラリー63を下降させて下端部によりワイヤ64の
一部を押しつぶし、扁平部を形成して超音波若しくは過
熱を併用してリード67に固定させ、ワイヤ64を引いて扁
平部の端から切断し、その後キャピラリー63を上昇させ
て一回のボンディングを終了する。その後ワイヤ64の先
端にトーチ61によりボール68を形成して第５図（ａ）の
状態に戻り、次のボンディングを行う。A case where the ball 68 formed at the tip of the wire 64 is bonded to the pad 65 of the pellet 66 using the capillary 63 will be described. First, the frame 51 is moved in the X and Y directions to position the capillary 63 above the torch 61. Then, a wire 64 having a predetermined length is extended from the tip of the capillary 63, and a ball is formed at the tip of the wire 64 by the torch 61. Next, as shown in FIG. 5A, the capillary 63 is moved to a position immediately above the pad 65 and positioned. Next, as shown in FIG. 5 (b), the capillary 63 is lowered and the ball 68 is padded.
Contact ball 65 and crush ball 68. Ultrasonic vibration or overheating is given simultaneously with the crushing. Thereafter, the capillary 63 is raised and moved in the horizontal direction, positioned above the lead 67 to be bonded, the capillary 63 is lowered as shown by a two-dot chain line, and a portion of the wire 64 is crushed by the lower end, and the flat portion is pressed. The wire 64 is pulled and cut from the end of the flat portion, and then the capillary 63 is raised to complete one bonding. Thereafter, a ball 68 is formed at the tip of the wire 64 by the torch 61, and the state returns to the state shown in FIG. 5A, where the next bonding is performed.

ところで、上記のような装置を用いてワイヤ64をキャ
ピラリー63の先端より下方に送り出すワイヤフィード作
業を行うに当り、第５図（ｂ）に示すリード67側の２′
ndボンディング接続後の上がり時のボンディングタイミ
ングによりクランプ60を閉じてワイヤ64を握持し所定量
のワイヤを引出してカットすることによりワイヤフィー
ド量を決定している。即ち、キャピラリー63の上昇過程
でクランプを閉じるようにして所定の長さのワイヤ64が
キャピラリー63の先端より伸長するようにするが、所定
の長さのワイヤが繰り出されていない場合にはトーチ61
により形成されるボールが所定の大きさに形成されなか
ったり、ボールが形成されない場合にはワイヤ切れが発
生する。By the way, in performing the wire feeding operation for sending the wire 64 below the tip of the capillary 63 using the above-described device, 2 'on the lead 67 side shown in FIG.
The wire feed amount is determined by closing the clamp 60, grasping the wire 64, pulling out a predetermined amount of wire, and cutting the wire at the bonding timing at the time of rising after the nd bonding connection. That is, the clamp is closed in the course of raising the capillary 63 so that the wire 64 of a predetermined length extends from the tip of the capillary 63. However, if the wire of the predetermined length is not extended, the torch 61 is used.
If the ball formed by the method is not formed to a predetermined size, or if the ball is not formed, wire breakage occurs.

［発明が解決しようとする課題］ しかしながら、従来の半導体組立装置のワイヤフィー
ド量決定の機構構成では、ワイヤーフィード量が長い若
しくは短いというバラツキが出てしまい、ボールが所望
の大きさ等に形成されないか若しくはボールが形成され
ず、その後ハーフクランプ59によりワイヤ64が引上げら
れた時にキャピラリー63の先端部より巻き戻されてワイ
ヤ切れが多く発生するという欠点がある。[Problem to be Solved by the Invention] However, in the conventional mechanism configuration for determining the wire feed amount of the semiconductor assembling apparatus, the wire feed amount varies widely or shortly, and the ball is not formed to a desired size or the like. Or, no ball is formed, and when the wire 64 is pulled up by the half clamp 59 thereafter, the wire 64 is rewound from the distal end of the capillary 63, so that there is a disadvantage that the wire is often cut.

上記のようなボンディング作業の際にワイヤ切れが発
生すると、作業者が装置を停止させてキャピラリ63にワ
イヤとうしの作業を行い、他のボンディング点と異なる
処に仮ボンディングを行いボール形成を行う。この仮ボ
ンディングは上記のようなワイヤ切れのあったとき又は
最初のボンディング時にボールが形成されていないとき
に本ボンディングを行うタイミング上仮ボンディングに
よるボール形成を行うためである。この仮ボンディング
は正規のボンディングがなされるリード67とパッド65を
用いることができないので、第６図に示すようにショー
ト、導通等が発生しないリード67の端等で行われる。If a wire break occurs during the above-described bonding operation, the operator stops the apparatus, performs a wire-threading operation on the capillary 63, and performs temporary bonding at a location different from other bonding points to form a ball. . This provisional bonding is for performing ball formation by provisional bonding in the timing of performing the main bonding when the wire is broken as described above or when the ball is not formed at the time of the first bonding. Since this temporary bonding cannot use the lead 67 and the pad 65 to which regular bonding is performed, as shown in FIG. 6, the temporary bonding is performed at the end of the lead 67 where short-circuiting, conduction or the like does not occur.

しかしながら、上記のようなワイヤとうしの作業は作
業者の熟練を要すると共に、仮ボンディングを行いタイ
ミング等を合わせる作業及びワイヤ除去等が必要となる
ため作業時間が係り作業効率が低下する欠点がある。However, the above-mentioned wire threading work requires the skill of an operator, and also requires work such as performing temporary bonding to adjust the timing and the like and wire removal, which has a drawback that work time is involved and work efficiency is reduced. .

そこで、本発明は上記従来技術の欠点に鑑みなされた
もので、ワイヤ切れが発生した場合でも簡単にワイヤと
おしを行うことのできる半導体組立装置を提供すること
を目的とする。SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described drawbacks of the related art, and has as its object to provide a semiconductor assembling apparatus capable of easily performing a wire cutting even when a wire break occurs.

［課題を解決するための手段］ 本発明は、先端にキャピラリが設けられたボンディン
グアームと、該ボンディングアームを上下に揺動させる
揺動アームと、該揺動アーム上に設けられ該揺動アーム
との間に変位可能なワイヤクランプ手段と、該ワイヤク
ランプ手段を変位させる駆動手段と、前記ボンディング
アームに設けられたキャピラリの下方に配置された電気
−放電発生手段と、該電気−放電発生手段とワイヤ間の
電圧を検出しこの電圧の変化によってワイヤ切れかどう
かの判定を行う制御手段とを備え、前記制御手段により
ワイヤ切れがあると判定された場合には前記ワイヤクラ
ンプ手段を変位させてキャピラリに形成されている開口
部にワイヤを繰り出すようにし、前記キャピラリに形成
された開口部にワイヤを繰り出す際に該キャピラリに超
音波振動を印加するようにし、かつ、繰り出したワイヤ
を前記電気−放電発生手段に接触させてワイヤのとおし
を確認できるように構成したものである。Means for Solving the Problems The present invention relates to a bonding arm provided with a capillary at a tip, a swing arm for swinging the bonding arm up and down, and the swing arm provided on the swing arm. And a driving means for displacing the wire clamp means, an electric-discharge generating means disposed below a capillary provided on the bonding arm, and the electric-discharge generating means And control means for detecting the voltage between the wires and determining whether or not the wire is broken by a change in the voltage, and displacing the wire clamp means when the control means determines that the wire is broken. The wire is fed to an opening formed in the capillary, and the wire is fed to the opening formed in the capillary. Ultrasonic vibration is applied to the capillary, and the fed wire is brought into contact with the electric-discharge generating means so that the wire can be checked.

また、本発明は、Ｘ方向及びＹ方向に移動可能なXYテ
ーブルと、先端にキャピラリが設けられたボンディング
アームと、該ボンディングアームを上下に揺動させる揺
動アームと、該揺動アーム上に設けられ該揺動アームと
の間に変位可能なワイヤクランプ手段と、該ワイヤクラ
ンプ手段を変位させる駆動手段と、前記ボンディングア
ームに設けられたキャピラリの下方に配置された電気−
放電発生手段と、該電気−放電発生手段とワイヤ間の電
圧を検出しこの電圧の変化によってワイヤ切れかどうか
の判定を行う制御手段とを備え、前記ボンディングアー
ムの移動に伴ってキャピラリの下面に前記電気−放電発
生手段が移動した後前記ワイヤクランプ手段を変位させ
てキャピラリに形成されている開口部にワイヤを繰り出
して前記電気−放電発生手段にワイヤを接触させてワイ
ヤのとおしを確認できるように構成したものである。ま
た、本発明は、先端にキャピラリが設けられたボンディ
ングアームと、該ボンディングアームを上下に揺動させ
る揺動アームと、該揺動アーム上に設けられ該揺動アー
ムとの間に変位可能な第１のワイヤクランプ手段と、該
第１のワイヤクランプ手段を変位させる駆動手段と、該
第１のワイヤクランプ手段の上方に配設された第２のワ
イヤクランプ手段と、前記ボンディングアームに設けら
れたキャピラリの下方に配置された電気−放電発生手段
と、該電気−放電発生手段とワイヤ間の電圧を検出しこ
の電圧の変化によってワイヤ切れかどうかの判定を行う
制御手段とを備え、前記制御手段によりワイヤ切れがあ
ると判定された場合には前記ワイヤクランプ手段を変位
させてキャピラリに形成されている開口部にワイヤを繰
り出すようにし、かつ、繰り出したワイヤを前記電気−
放電発生手段に接触させてワイヤのとおしを確認できる
ようにしたものである。The present invention also provides an XY table movable in the X and Y directions, a bonding arm provided with a capillary at a tip, a swing arm for swinging the bonding arm up and down, and A wire clamp means provided between the swing arm and the movable arm; a driving means for displacing the wire clamp means; and an electric wire disposed below a capillary provided on the bonding arm.
A discharge generating means, and a control means for detecting a voltage between the electric-discharge generating means and the wire and determining whether or not the wire has been cut off based on a change in the voltage. After the electric-discharge generating means is moved, the wire clamp means is displaced to feed out the wire to the opening formed in the capillary so that the wire comes into contact with the electric-discharge generating means so that the wire can be checked. It is what was constituted. Further, the present invention provides a bonding arm provided with a capillary at a tip, a swing arm for swinging the bonding arm up and down, and a displaceable arm between the swing arm and the swing arm provided on the swing arm. A first wire clamp unit, a driving unit for displacing the first wire clamp unit, a second wire clamp unit disposed above the first wire clamp unit, and the bonding arm. An electric-discharge generating means disposed below the capillary, and a control means for detecting a voltage between the electric-discharge generating means and the wire and determining whether or not the wire is broken based on a change in the voltage. If it is determined that the wire is broken, the wire clamping means is displaced so that the wire is fed out to an opening formed in the capillary. And the feeding wire the electric -
The wire is made to contact the discharge generating means so that the wire can be checked.

［実施例］ 次に本発明の実施例について図面を用いて詳細に説明
する。Example Next, an example of the present invention will be described in detail with reference to the drawings.

第１図は本発明に係る半導体組立装置の構成を示す図
である。FIG. 1 is a diagram showing a configuration of a semiconductor assembling apparatus according to the present invention.

第１図において、超音波振動発生可能なボンディング
アーム１と揺動アーム２はＸ方向及びＹ方向に移動可能
なボンディングヘッドのフレームに支持される軸３に回
転可能に支持されている。この揺動アーム２に配設され
たソレノイド4aと対向して電磁吸着片4bがボンディング
アーム１に配設されている。このソレノイド4aが図示せ
ぬ電源から通電されると電磁吸着片4bとの間に吸着力が
作用しボンディングアーム１と揺動アーム２とが固定さ
れる。このソレノイド4aの吸着力によりボンディングア
ーム１はソレノイド4a側に吸着されるが、所定距離以上
吸着されないように揺動アーム２にねじ等で構成された
調整可能なストッパ６が設けられている。また、揺動ア
ーム２に設けられたマグネット5aと対向してボンディン
グアーム１にコイル5bが配設されており、このマグネッ
ト5aとコイル5bとの吸着力は、ボンディング時にボンデ
ィングアーム１の先端に設けられたキャピラリ７の先端
を軸３を支点として下方向に付勢するために発生され
る。揺動アーム２の先端には軸８を介してクランプアー
ム９が第１図の上下方向に回動可能に支持されており、
このクランプアーム９の先端には図示せぬ開閉機構によ
りワイヤ10を握持してカットするためのクランプ9aすな
わち第１のワイヤクランプ手段が設けられている。この
クランプ9aと軸８との間にはクランプアーム９を軸８を
中心に上下に回動させる駆動手段としてのリニアモータ
11が配設されている。このリニアモータ11はクランプア
ーム９の上方の支持部に設けられたコイル11aと揺動ア
ーム２の上方の支持部に設けられたマグネット11bとで
構成され、図示せぬ制御手段により位置決め及び移動速
度を制御できるように構成されている。このクランプア
ーム９は、上方への揺動が可能なようにコイル11aとマ
グネット11b間が制御されている。また、キャピラリ７
の下方には図示せぬ垂直軸にアクチュエータ等の作用に
より回動可能に電気トーチ12（電気トーチ12は放電電極
を含み電気−放電発生手段とも称する。）が配置されて
おりボンディングアーム１の移動によってキャピラリ７
の下面に回動移動するように構成されている。この電気
トーチ12は所定の電圧が印加されてワイヤ10の先端にボ
ールが形成される他ワイヤ10がタッチしたかどうかを通
電検知できるように構成されている。すなわち、電気ト
ーチ12とワイヤ間の電圧を検出しこの電圧の変化によっ
てワイヤ切れかどうかを図示せぬ制御手段により判定す
ると共に、ワイヤ切れの場合にはキャピラリ７の開口部
である孔7aをとおしてワイヤ10が繰り出され電気トーチ
12にワイヤ端を接触させることによってキャピラリ７の
孔7aをワイヤ10がとおったことを確認できるように構成
されている。このキャピラリ７の孔7aの上面にはワイヤ
10をとおし易いようにテーパ面が形成されている。ま
た、クランプ9aの上方にはワイヤ10を図示せぬフレーム
に固定支持され、ワイヤ10に所定のテンションをかけて
常にワイヤ10をボンディングアーム１のキャピラリ７の
先端まで真直ぐな状態になるように保持し図示せぬ開閉
機構により開閉可能な第２のワイヤクランプ手段として
のテンションクランプ13が配設され、このワイヤ10は更
にガイド14を介して図示せぬリールにより巻回されてい
る。In FIG. 1, a bonding arm 1 and a swing arm 2 capable of generating ultrasonic vibration are rotatably supported on a shaft 3 supported by a frame of a bonding head that can move in the X and Y directions. An electromagnetic attraction piece 4b is disposed on the bonding arm 1 so as to face the solenoid 4a disposed on the swing arm 2. When the solenoid 4a is energized from a power supply (not shown), an attraction force acts between the solenoid 4a and the electromagnetic attraction piece 4b, and the bonding arm 1 and the swing arm 2 are fixed. The bonding arm 1 is attracted to the solenoid 4a side by the attraction force of the solenoid 4a, but the swing arm 2 is provided with an adjustable stopper 6 composed of a screw or the like so as not to be attracted for a predetermined distance or more. Further, a coil 5b is provided on the bonding arm 1 so as to face the magnet 5a provided on the swing arm 2, and the attraction between the magnet 5a and the coil 5b is provided at the tip of the bonding arm 1 during bonding. This is generated in order to urge the tip of the provided capillary 7 downward with the shaft 3 as a fulcrum. A clamp arm 9 is supported at the tip of the swing arm 2 via a shaft 8 so as to be rotatable in the vertical direction in FIG.
A clamp 9a for gripping and cutting the wire 10 by an opening / closing mechanism (not shown), that is, a first wire clamp means is provided at the tip of the clamp arm 9. A linear motor as driving means for rotating the clamp arm 9 up and down around the shaft 8 between the clamp 9a and the shaft 8
11 are arranged. The linear motor 11 is composed of a coil 11a provided on a support portion above the clamp arm 9 and a magnet 11b provided on a support portion above the swing arm 2. The positioning and moving speed are controlled by control means (not shown). Is configured to be controlled. The clamp arm 9 is controlled between the coil 11a and the magnet 11b so as to be able to swing upward. In addition, the capillary 7
An electric torch 12 (the electric torch 12 includes a discharge electrode and is also referred to as an electric-discharge generating means) is arranged below a vertical axis (not shown) so as to be rotatable by the action of an actuator or the like. By capillary 7
Is configured to pivotally move to the lower surface of the. The electric torch 12 is configured such that a predetermined voltage is applied to form a ball at the tip of the wire 10 and that the electric torch 12 can detect whether or not the wire 10 is touched. That is, a voltage between the electric torch 12 and the wire is detected, and whether or not the wire is broken is determined by a control means (not shown) based on a change in the voltage. In the case of a broken wire, a hole 7a which is an opening of the capillary 7 is removed. Wire 10 is fed out and electric torch
The wire end is brought into contact with 12 so that it can be confirmed that the wire 10 has passed through the hole 7a of the capillary 7. A wire is provided on the upper surface of the hole 7a of the capillary 7.
A tapered surface is formed so as to be easy to pass through. Above the clamp 9a, the wire 10 is fixedly supported by a frame (not shown), and a predetermined tension is applied to the wire 10 so that the wire 10 is always kept straight up to the tip of the capillary 7 of the bonding arm 1. A tension clamp 13 is provided as second wire clamp means that can be opened and closed by an opening and closing mechanism (not shown). The wire 10 is further wound around a reel (not shown) via a guide 14.

次に、揺動アーム２を上下動させる機構について説明
する。Next, a mechanism for vertically moving the swing arm 2 will be described.

アーム側カムフォロア15は揺動アーム２の軸15aに回
転可能に支持されており、このアーム側カムフォロア15
と揺動フレーム16の揺動ベース16aとは揺動アーム２と
独立して相互に回転可能に支持されている。この揺動ベ
ース16aにはベアリングガイド16bが固定されており、ま
た、予圧アームピン16cにはカムフォロア17が支持され
ている予圧アーム16dが回転可能に設けられており、こ
の予圧アーム16dの先端部と揺動ベース16aの先端部との
間には引張り力を有する予圧バネ16eが掛け渡されてい
る。また、カム18の周縁はアーム側カムフォロア15とカ
ムフォロア17により圧接され、アーム側カムフォロア15
及びカムフォロア17とカム18との各接点はカム18の回転
中心を挟むように構成されている。また、ベアリングガ
イド16bは、カム軸19に設けられたラジアルベアリング2
0の外面に接するように設けられている。駆動モータ21
の駆動力はカム軸19を介してカム18に伝達され、このカ
ム18の回転により変化する量と該回転角度の変化量とが
比例するように形成されており、このカム18の回転量は
図示せぬ制御手段により制御されるように構成されてい
る。このカム18の制御によりボンディングアーム１の上
下の移動量の制御が可能な構成となっている。前記揺動
アーム２はカム18の運動に基づいて軸３を支点として往
復回転運動がなされ、ソレノイド4aと電磁吸着片4bとで
揺動アーム２に固定されたボンディングアーム１に往復
回転運動をさせる。The arm-side cam follower 15 is rotatably supported on the shaft 15a of the swing arm 2.
The swing base 16a of the swing frame 16 and the swing base 16 are independently rotatably supported by the swing arm 2. A bearing guide 16b is fixed to the swing base 16a, and a preload arm 16d on which a cam follower 17 is supported is rotatably provided on the preload arm pin 16c. A preload spring 16e having a tensile force is stretched between the tip of the swing base 16a and the swinging base 16a. Further, the periphery of the cam 18 is pressed against the arm-side cam follower 15 and the cam follower 17, and the arm-side cam follower 15 is pressed.
Each contact point between the cam follower 17 and the cam 18 is configured to sandwich the rotation center of the cam 18. The bearing guide 16b is provided on the radial bearing 2 provided on the cam shaft 19.
0 is provided so as to be in contact with the outer surface. Drive motor 21
Is transmitted to the cam 18 via the camshaft 19, and the amount of change in the rotation of the cam 18 and the amount of change in the rotation angle are formed in proportion to each other. It is configured to be controlled by control means (not shown). By controlling the cam 18, the amount of vertical movement of the bonding arm 1 can be controlled. The swing arm 2 is reciprocally rotated about the shaft 3 based on the motion of the cam 18, and causes the bonding arm 1 fixed to the swing arm 2 to reciprocate by the solenoid 4a and the electromagnetic attraction piece 4b. .

次に上記構成よりなる装置の作用について説明する。 Next, the operation of the device having the above configuration will be described.

まず、第２図（ｂ）に示すようにキャピラリ７の下方
に位置する電気トーチ12とキャピラリ７の先端よりワイ
ヤ10が所定距離送り出されている時、そのワイヤ端と電
気トーチ12との間に規定のギャップ長が必要である。し
たがって、第２図（ａ）及び（ｃ）に示すように規定の
ギャップ長でない場合にはワイヤ先端に所定の大きさの
ボールが形成されなかったり、ボールが全くできない等
によりワイヤ切れが発生する。First, as shown in FIG. 2 (b), when the electric torch 12 located below the capillary 7 and the wire 10 are sent out a predetermined distance from the tip of the capillary 7, a gap between the wire end and the electric torch 12 is obtained. A specified gap length is required. Therefore, as shown in FIGS. 2 (a) and 2 (c), when the gap length is not the prescribed value, a wire of a predetermined size is not formed at the end of the wire, or the ball cannot be formed at all. .

このワイヤ切れが発生した場合にキャピラリ７の孔に
ワイヤ10をとおす作業工程を第３図を用いて説明する
と、 先ず、ボンディングアーム１の移動によりキャピラリ
７の下面に電気トーチ12が回動移動させる。そして、第
３図に示すようにワイヤ10が切れているのでワイヤ10
をキャピラリ７の孔7aの上面より挿入させるために第３
図に示すようにクランプ9aを開としリニアモータのコ
イル11aを励磁させて所定量クランプアーム９をテンシ
ョンクランプ13側に回動させてクランプする（第３図
）。そして、第３図に示すようにリニアモータのコ
イル11aを励磁させて所定量クランプアーム９を上記と
は逆方向に回動させてクランプ9aを下方に移動させてワ
イヤ10を繰り出す。そして、上記第３図乃至の工程
を繰返してワイヤ10の先端が電気トーチ12に通電検知、
すなわちワイヤ通しが確認されるまでワイヤ10を繰り出
す。更に、ワイヤ10がキャピラリ７の孔7aの上面より抜
け出ていない場合にも上記工程を行うことにより容易に
ワイヤを繰り出すことが可能となる。An operation process of passing the wire 10 through the hole of the capillary 7 when the wire breakage occurs will be described with reference to FIG. 3. First, the electric torch 12 is rotated to the lower surface of the capillary 7 by the movement of the bonding arm 1. . Then, as shown in FIG.
Is inserted through the upper surface of the hole 7a of the capillary 7
As shown in the figure, the clamp 9a is opened, the coil 11a of the linear motor is excited, and the clamp arm 9 is rotated by a predetermined amount toward the tension clamp 13 for clamping (FIG. 3). Then, as shown in FIG. 3, the coil 11a of the linear motor is excited, the clamp arm 9 is rotated by a predetermined amount in the opposite direction to move the clamp 9a downward, and the wire 10 is paid out. Then, by repeating the above-described steps of FIG. 3 to FIG.
That is, the wire 10 is paid out until the wire passing is confirmed. Further, even when the wire 10 does not fall out from the upper surface of the hole 7a of the capillary 7, the wire can be easily drawn out by performing the above-described steps.

以上のような工程により容易にワイヤ10をキャピラリ
７の孔7aに通すことが可能となる。Through the above steps, the wire 10 can be easily passed through the hole 7a of the capillary 7.

なお、キャピラリ７の孔7aの上面はワイヤ10をとおし
易いようにテーパ面が形成されているが、ワイヤ10の先
端が真直でなく曲がっているような場合等にはワイヤ10
を孔7aに容易に挿入させ易いようにボンディングアーム
１に軽い超音波を発生させてキャピラリ７に超音波振動
を印加するようにすれば容易にワイヤ通しを行うことが
可能となる。The upper surface of the hole 7a of the capillary 7 has a tapered surface so that the wire 10 can be easily passed through. However, when the tip of the wire 10 is
If light ultrasonic waves are generated in the bonding arm 1 and ultrasonic vibrations are applied to the capillary 7 so that the wire 7 can be easily inserted into the hole 7a, the wire can be easily passed.

また、本実施例におけるリニアモータの代わりにクラ
ンプアーム９とボンディングアーム１との間にカム機構
を設けてこのカム機構の回転量によりクランプアーム９
を回動制御するようにしてもよい。Further, a cam mechanism is provided between the clamp arm 9 and the bonding arm 1 instead of the linear motor in this embodiment, and the clamp arm 9 is rotated by the rotation amount of the cam mechanism.
May be controlled to rotate.

その他本発明の趣旨の範囲内で適宜変更することがで
きる。Other changes can be made within the spirit of the present invention.

［発明の効果］ 以上説明したように本発明によれば、ワイヤ切れが発
生した場合であっても装置を停止させることなく簡単に
ワイヤとおしの作業を自動的に行うことができる。した
がって、本発明によればワイヤとおしを容易に行うこと
ができるので作業効率が向上する効果がある。[Effects of the Invention] As described above, according to the present invention, even when a wire break occurs, the work through the wire can be automatically performed easily without stopping the apparatus. Therefore, according to the present invention, since the wire can be easily passed through, there is an effect that the working efficiency is improved.

また、本発明では、キャピラリの開口部にワイヤを繰
り出す際に、該キャピラリに超音波振動を印加するよう
になされている。これによって、ワイヤの先端が真直で
なく曲がっているような場合などでも引っ掛り等が防止
されてワイヤ通しを容易に行うことができる。Further, in the present invention, when the wire is fed to the opening of the capillary, ultrasonic vibration is applied to the capillary. Thereby, even when the tip of the wire is not straight but bent, for example, the wire is prevented from being caught and the wire can be easily passed.

更に、本発明に係る半導体組立装置においては、キャ
ピラリの開口部に繰り出したワイヤを電気−放電発生手
段に接触させてワイヤのとおしを確認するので、確実な
作業が行われる。Further, in the semiconductor assembling apparatus according to the present invention, since the wire fed out to the opening of the capillary is brought into contact with the electric-discharge generating means to check whether the wire passes through, a reliable operation is performed.

また、本発明による半導体組立装置は、ワイヤ繰返し
用として変位可能な第１のワイヤクランプ手段のみなら
ず、その上方に第２のワイヤクランプ手段を備えてい
る。この第２のワイヤクランプ手段は第１のワイヤクラ
ンプ手段がワイヤの把持を解除しているときにワイヤを
保持して巻き戻しを防止するため、第１のワイヤクラン
プ手段による自動ワイヤ繰り出しが実現される。Further, the semiconductor assembling apparatus according to the present invention includes not only the first wire clamp means displaceable for wire repetition but also the second wire clamp means above the first wire clamp means. The second wire clamp means holds the wire when the first wire clamp means releases the gripping of the wire and prevents the wire from being rewound, so that automatic wire feeding by the first wire clamp means is realized. You.

【図面の簡単な説明】[Brief description of the drawings]

第１図は本発明に係る半導体組立装置を示す説明図、第
２図（ａ），（ｂ）及び（ｃ）は本発明に係る半導体組
立装置のワイヤ長さのバラツキ等の調整を説明する図、
第３図は本発明に係るワイヤとおしの作業工程を説明す
る説明図、第４図は従来の半導体組立装置を示す図、第
５図（ａ）及び（ｂ）はボンディング工程を説明する
図、第６図は従来の仮ボンディングを説明する図であ
る。 １……ボンディングアーム、２……揺動アーム、３……
軸、4a……ソレノイド、4b……電磁吸着片、5a……マグ
ネット、5b……コイル、６……ストッパ、７……キャピ
ラリ、８……軸、９……クランプアーム、9a……クラン
プ、10……ワイヤ、11……リニアモータ、12……電気ト
ーチ、13……テンションクランプ、14……ガイド、16…
…揺動フレーム、17……カムフォロア、18……カム。FIG. 1 is an explanatory view showing a semiconductor assembling apparatus according to the present invention, and FIGS. 2 (a), 2 (b) and 2 (c) illustrate adjustment of a wire length variation and the like of the semiconductor assembling apparatus according to the present invention. Figure,
FIG. 3 is an explanatory view for explaining a working process through a wire according to the present invention, FIG. 4 is a view showing a conventional semiconductor assembling apparatus, FIGS. 5 (a) and (b) are views for explaining a bonding step, FIG. 6 is a view for explaining conventional temporary bonding. 1 ... bonding arm, 2 ... swing arm, 3 ...
Shaft, 4a Solenoid, 4b Electromagnetic adsorption piece, 5a Magnet, 5b Coil, 6 Stopper, 7 Capillary, 8 Shaft, 9 Clamp arm, 9a Clamp, 10 ... wire, 11 ... linear motor, 12 ... electric torch, 13 ... tension clamp, 14 ... guide, 16 ...
… Swing frame, 17… Cam follower, 18… Cam.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭64−17433（ＪＰ，Ａ) 特開 昭60−198741（ＪＰ，Ａ) 特開 昭61−3419（ＪＰ，Ａ) 実開 昭60−187537（ＪＰ，Ｕ) 特公 平４−44420（ＪＰ，Ｂ２) 特公 平１−35500（ＪＰ，Ｂ２) 特公 平２−13815（ＪＰ，Ｂ２) 実公 平４−51478（ＪＰ，Ｙ２) 実公 平２−5533（ＪＰ，Ｙ２) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-64-17433 (JP, A) JP-A-60-198741 (JP, A) JP-A-61-3419 (JP, A) 187537 (JP, U) JP 4-44420 (JP, B2) JP 1-35500 (JP, B2) JP 2-13815 (JP, B2) JP 4-51478 (JP, Y2) 2-553, Jiko (JP, Y2)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】先端にキャピラリが設けられたボンディン
グアームと、 該ボンディングアームを上下に揺動させる揺動アーム
と、 該揺動アーム上に設けられ該揺動アームとの間に変位可
能なワイヤクランプ手段と、 該ワイヤクランプ手段を変位させる駆動手段と、 前記ボンディングアームに設けられたキャピラリの下方
に配置された電気−放電発生手段と、 該電気−放電発生手段とワイヤ間の電圧を検出しこの電
圧の変化によってワイヤ切れかどうかの判定を行う制御
手段とを備え、 前記制御手段によりワイヤ切れがあると判定された場合
には前記ワイヤクランプ手段を変位させてキャピラリに
形成されている開口部にワイヤを繰り出すようにし、 前記キャピラリに形成された開口部にワイヤを繰り出す
際に該キャピラリに超音波振動を印加するようにし、か
つ、繰り出したワイヤを前記電気−放電発生手段に接触
させてワイヤのとおしを確認できるようにしたことを特
徴とする半導体組立装置。A bonding arm provided with a capillary at a tip thereof; a swing arm for swinging the bonding arm up and down; and a wire provided on the swing arm and displaceable between the swing arm. Clamping means; driving means for displacing the wire clamping means; electric-discharge generating means disposed below a capillary provided on the bonding arm; and detecting a voltage between the electric-discharge generating means and the wire. Control means for determining whether or not the wire is broken based on the change in the voltage. If the control means determines that the wire is broken, the wire clamp means is displaced to form an opening formed in the capillary. When the wire is fed out to the opening formed in the capillary, ultrasonic vibration is applied to the capillary. A semiconductor assembly apparatus, wherein the extended wire is brought into contact with the electric-discharge generating means so that the wire can be checked. 【請求項２】Ｘ方向及びＹ方向に移動可能なXYテーブル
と、 先端にキャピラリが設けられたボンディングアームと、 該ボンディングアームを上下に揺動させる揺動アーム
と、 該揺動アーム上に設けられ該揺動アームとの間に変位可
能なワイヤクランプ手段と、 該ワイヤクランプ手段を変位させる駆動手段と、 前記ボンディングアームに設けられたキャピラリの下方
に配置された電気−放電発生手段と、 該電気−放電発生手段とワイヤ間の電圧を検出しこの電
圧の変化によってワイヤ切れかどうかの判定を行う制御
手段とを備え、 前記ボンディングアームの移動に伴ってキャピラリの下
面に前記電気−放電発生手段が移動した後前記ワイヤク
ランプ手段を変位させてキャピラリに形成されている開
口部にワイヤを繰り出して前記電気−放電発生手段にワ
イヤを接触させてワイヤのとおしを確認できるようにし
たことを特徴とする半導体組立装置。2. An XY table movable in X and Y directions, a bonding arm provided with a capillary at a tip, a swing arm for swinging the bonding arm up and down, and a swing arm provided on the swing arm. A wire clamp means displaceable between the swing arm and a driving means for displacing the wire clamp means; an electric-discharge generating means disposed below a capillary provided on the bonding arm; An electric-discharge generating means, and a control means for detecting a voltage between the wires and determining whether or not the wire is broken based on a change in the voltage. The electric-discharge generating means is provided on a lower surface of the capillary as the bonding arm moves. After the wire is moved, the wire clamp means is displaced to feed out a wire to an opening formed in the capillary, and the electric-discharge is performed. The semiconductor assembly apparatus being characterized in that contacting the wire raw means to be able to see through the wire. 【請求項３】先端にキャピラリが設けられたボンディン
グアームと、 該ボンディングアームを上下に揺動させる揺動アーム
と、 該揺動アーム上に設けられ該揺動アームとの間に変位可
能な第１のワイヤクランプ手段と、 該第１のワイヤクランプ手段を変位させる駆動手段と、 該第１のワイヤクランプ手段の上方に配設された第２の
ワイヤクランプ手段と、 前記ボンディングアームに設けられたキャピラリの下方
に配置された電気−放電発生手段と、 該電気−放電発生手段とワイヤ間の電圧を検出しこの電
圧の変化によってワイヤ切れかどうかの判定を行う制御
手段とを備え、 前記制御手段によりワイヤ切れがあると判定された場合
には前記ワイヤクランプ手段を変位させてキャピラリに
形成されている開口部にワイヤを繰り出すようにし、か
つ、繰り出したワイヤを前記電気−放電発生手段に接触
させてワイヤのとおしを確認できるようにしたことを特
徴とする半導体組立装置。3. A bonding arm provided with a capillary at a tip thereof, a swing arm for swinging the bonding arm up and down, and a swing arm provided on the swing arm and displaceable between the swing arm. A first wire clamp means; a driving means for displacing the first wire clamp means; a second wire clamp means disposed above the first wire clamp means; and a bonding arm. An electric-discharge generating means disposed below the capillary; and a control means for detecting a voltage between the electric-discharge generating means and the wire and determining whether or not the wire has been cut off based on a change in the voltage. When it is determined that the wire is broken, the wire clamping means is displaced so that the wire is fed out to an opening formed in the capillary. A semiconductor assembly apparatus wherein the extended wire is brought into contact with the electric-discharge generating means so that the wire can be checked.
JP2115102A 1990-05-02 1990-05-02 Semiconductor assembly equipment Expired - Lifetime JP2627968B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2115102A JP2627968B2 (en) 1990-05-02 1990-05-02 Semiconductor assembly equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2115102A JP2627968B2 (en) 1990-05-02 1990-05-02 Semiconductor assembly equipment

Publications (2)

Publication Number Publication Date
JPH0412544A JPH0412544A (en) 1992-01-17
JP2627968B2 true JP2627968B2 (en) 1997-07-09

Family

ID=14654274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2115102A Expired - Lifetime JP2627968B2 (en) 1990-05-02 1990-05-02 Semiconductor assembly equipment

Country Status (1)

Country Link
JP (1) JP2627968B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4530984B2 (en) * 2005-12-28 2010-08-25 株式会社新川 Wire bonding apparatus, bonding control program, and bonding method
US11420287B2 (en) * 2019-09-29 2022-08-23 Ningbo Shangjin Automation Technology Co., Ltd. Wire clamping system for fully automatic wire bonding machine

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198741A (en) * 1984-03-23 1985-10-08 Hitachi Tokyo Electronics Co Ltd Detector for disconnection
JPS60187537U (en) * 1984-05-22 1985-12-12 新日本無線株式会社 automatic wire bonder
JPS613419A (en) * 1984-06-15 1986-01-09 Nec Corp Method for wire bonding
JPS6435500A (en) * 1987-07-30 1989-02-06 Hitachi Heating Appl Voice recognition
JPH025533U (en) * 1988-06-23 1990-01-16
JPH0213815A (en) * 1988-06-30 1990-01-18 Fujitsu Ltd Sensitivity correction system for photoconducting type infrared detector

Also Published As

Publication number Publication date
JPH0412544A (en) 1992-01-17

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