JPS5380967A - Wire clamper driving mechanism - Google Patents

Wire clamper driving mechanism

Info

Publication number
JPS5380967A
JPS5380967A JP15649476A JP15649476A JPS5380967A JP S5380967 A JPS5380967 A JP S5380967A JP 15649476 A JP15649476 A JP 15649476A JP 15649476 A JP15649476 A JP 15649476A JP S5380967 A JPS5380967 A JP S5380967A
Authority
JP
Japan
Prior art keywords
driving mechanism
wire clamper
clamper driving
wire
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15649476A
Other languages
Japanese (ja)
Inventor
Shunichiro Fujioka
Shunei Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15649476A priority Critical patent/JPS5380967A/en
Publication of JPS5380967A publication Critical patent/JPS5380967A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a wire clamper driving mechanism, which has no changes of the junction load caused by the clamper action and features an easy adjustment of timing, etc. with no mechanical trouble at all.
COPYRIGHT: (C)1978,JPO&Japio
JP15649476A 1976-12-27 1976-12-27 Wire clamper driving mechanism Pending JPS5380967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15649476A JPS5380967A (en) 1976-12-27 1976-12-27 Wire clamper driving mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15649476A JPS5380967A (en) 1976-12-27 1976-12-27 Wire clamper driving mechanism

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP59192502A Division JPS6084828A (en) 1984-09-17 1984-09-17 Method for wire bonding
JP59192503A Division JPS6084829A (en) 1984-09-17 1984-09-17 Method for wire bonding

Publications (1)

Publication Number Publication Date
JPS5380967A true JPS5380967A (en) 1978-07-17

Family

ID=15628969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15649476A Pending JPS5380967A (en) 1976-12-27 1976-12-27 Wire clamper driving mechanism

Country Status (1)

Country Link
JP (1) JPS5380967A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521149A (en) * 1978-08-01 1980-02-15 Nec Kyushu Ltd Semiconductor interior connecting device
JPS5946037A (en) * 1982-09-09 1984-03-15 Marine Instr Co Ltd Supply method for bonding wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521149A (en) * 1978-08-01 1980-02-15 Nec Kyushu Ltd Semiconductor interior connecting device
JPS6216543B2 (en) * 1978-08-01 1987-04-13 Kyushu Nippon Electric
JPS5946037A (en) * 1982-09-09 1984-03-15 Marine Instr Co Ltd Supply method for bonding wire
JPH0213815B2 (en) * 1982-09-09 1990-04-05 Kaijo Denki Kk

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