JPS5521149A - Semiconductor interior connecting device - Google Patents

Semiconductor interior connecting device

Info

Publication number
JPS5521149A
JPS5521149A JP9396578A JP9396578A JPS5521149A JP S5521149 A JPS5521149 A JP S5521149A JP 9396578 A JP9396578 A JP 9396578A JP 9396578 A JP9396578 A JP 9396578A JP S5521149 A JPS5521149 A JP S5521149A
Authority
JP
Japan
Prior art keywords
bonding
tool
lift amount
connecting device
completion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9396578A
Other languages
Japanese (ja)
Other versions
JPS6216543B2 (en
Inventor
Joji Kosho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP9396578A priority Critical patent/JPS5521149A/en
Publication of JPS5521149A publication Critical patent/JPS5521149A/en
Publication of JPS6216543B2 publication Critical patent/JPS6216543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE: To reduce a lift amount of a tool used for a bonding start device by slightly holding up the bonding tool with an arm driven by a supplementary driving device provided in the following bonding after completion of a bonding of a semiconductor device.
CONSTITUTION: A tool 3 for a bonding is operated by a cam 4 used for a main driver, after completion of the bonding, the holding-up operation of the tool 3 is achieved by a control operation of a supplementary cam 9 used for a sub-driver to set the lift amount H of the tool 3 at a reduced level. According to such a construction, because the lift amount for a bonding start position can be less restricted, the bonding speed can be raised more.
COPYRIGHT: (C)1980,JPO&Japio
JP9396578A 1978-08-01 1978-08-01 Semiconductor interior connecting device Granted JPS5521149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9396578A JPS5521149A (en) 1978-08-01 1978-08-01 Semiconductor interior connecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9396578A JPS5521149A (en) 1978-08-01 1978-08-01 Semiconductor interior connecting device

Publications (2)

Publication Number Publication Date
JPS5521149A true JPS5521149A (en) 1980-02-15
JPS6216543B2 JPS6216543B2 (en) 1987-04-13

Family

ID=14097111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9396578A Granted JPS5521149A (en) 1978-08-01 1978-08-01 Semiconductor interior connecting device

Country Status (1)

Country Link
JP (1) JPS5521149A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143332U (en) * 1984-08-23 1986-03-20 株式会社ノダ Painted wall structure in houses

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0313249U (en) * 1989-06-24 1991-02-12

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5199472A (en) * 1975-02-27 1976-09-02 Nippon Electric Co
JPS5360569A (en) * 1976-11-12 1978-05-31 Shinkawa Seisakusho Kk Mechanism for changing load in wireebonder
JPS5360570A (en) * 1976-11-12 1978-05-31 Shinkawa Seisakusho Kk Mechanism for changing load in wireebonder
JPS5380967A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Wire clamper driving mechanism

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5199472A (en) * 1975-02-27 1976-09-02 Nippon Electric Co
JPS5360569A (en) * 1976-11-12 1978-05-31 Shinkawa Seisakusho Kk Mechanism for changing load in wireebonder
JPS5360570A (en) * 1976-11-12 1978-05-31 Shinkawa Seisakusho Kk Mechanism for changing load in wireebonder
JPS5380967A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Wire clamper driving mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6143332U (en) * 1984-08-23 1986-03-20 株式会社ノダ Painted wall structure in houses

Also Published As

Publication number Publication date
JPS6216543B2 (en) 1987-04-13

Similar Documents

Publication Publication Date Title
JPS53113933A (en) Idle speed control device for engine
JPS5521149A (en) Semiconductor interior connecting device
JPS57146431A (en) Driving device for feed bar in transfer press
JPS54140069A (en) Automatic positioning system
JPS52101569A (en) Device for controlling manipulator
JPS52103135A (en) Steering device for fork lift truck
JPS51118228A (en) Wiper drive control device
JPS53114344A (en) Electronic microscope
JPS5213201A (en) Automatic operation apparatus in chassis dynamo-meter
JPS5235819A (en) Control device for standstill scheribius device
JPS5373715A (en) Sequential operation control device for refuse collecting vehicle
JPS5396447A (en) Protection controlling circuit for emergency motor
JPS54123392A (en) Device for driving reversing unit
JPS5221567A (en) Direct coupled clutch controller of an automatic transmission with a d irect coupled clutch-loaded torque converter
JPS6451002A (en) Lift-controlling apparatus for working part of ground-working vehicle
JPS536769A (en) Oiler priming mechanism
JPS5359811A (en) Control device of commutator-less motor
JPS52140793A (en) Drawing out/inserting method of control rod driving device
JPS5225213A (en) Controlling device for commutatorless motor
JPS5530569A (en) Device for strengthening force of main shaft
JPS53121121A (en) Reversible device for dc motor
JPS53105374A (en) Die bonding method for semiconductor chip
JPS5241355A (en) Actuating apparatus
JPS5588683A (en) Device for automatically taking fish paste in and out of steaming retainer
JPS53934A (en) Printing head driving device