JPS5360570A - Mechanism for changing load in wireebonder - Google Patents

Mechanism for changing load in wireebonder

Info

Publication number
JPS5360570A
JPS5360570A JP13516976A JP13516976A JPS5360570A JP S5360570 A JPS5360570 A JP S5360570A JP 13516976 A JP13516976 A JP 13516976A JP 13516976 A JP13516976 A JP 13516976A JP S5360570 A JPS5360570 A JP S5360570A
Authority
JP
Japan
Prior art keywords
wireebonder
changing load
changing
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13516976A
Other languages
Japanese (ja)
Other versions
JPS5733854B2 (en
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP13516976A priority Critical patent/JPS5360570A/en
Publication of JPS5360570A publication Critical patent/JPS5360570A/en
Publication of JPS5733854B2 publication Critical patent/JPS5733854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
JP13516976A 1976-11-12 1976-11-12 Mechanism for changing load in wireebonder Granted JPS5360570A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13516976A JPS5360570A (en) 1976-11-12 1976-11-12 Mechanism for changing load in wireebonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13516976A JPS5360570A (en) 1976-11-12 1976-11-12 Mechanism for changing load in wireebonder

Publications (2)

Publication Number Publication Date
JPS5360570A true JPS5360570A (en) 1978-05-31
JPS5733854B2 JPS5733854B2 (en) 1982-07-20

Family

ID=15145436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13516976A Granted JPS5360570A (en) 1976-11-12 1976-11-12 Mechanism for changing load in wireebonder

Country Status (1)

Country Link
JP (1) JPS5360570A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521149A (en) * 1978-08-01 1980-02-15 Nec Kyushu Ltd Semiconductor interior connecting device
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS61101039A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Wire bonding method and device therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022875A (en) * 1973-06-05 1975-03-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022875A (en) * 1973-06-05 1975-03-11

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521149A (en) * 1978-08-01 1980-02-15 Nec Kyushu Ltd Semiconductor interior connecting device
JPS6216543B2 (en) * 1978-08-01 1987-04-13 Kyushu Nippon Electric
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPH0152896B2 (en) * 1978-11-22 1989-11-10 Kurike Ando Sofua Ind Inc
JPS61101039A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Wire bonding method and device therefor
JPH0530058B2 (en) * 1984-10-24 1993-05-07 Hitachi Ltd

Also Published As

Publication number Publication date
JPS5733854B2 (en) 1982-07-20

Similar Documents

Publication Publication Date Title
ZA775280B (en) Load cell
JPS5297513A (en) Trailroad truck
ZA767708B (en) Load cell arrangement
JPS5345857A (en) Transporter
ZA773233B (en) Improvements in controllers
ZA771141B (en) Improvements in dispensers
GR59190B (en) Improvements in filterpresses
ZA77880B (en) Improvements in scarper-chain assemblies
ZA772745B (en) Improvements in metal-heating furnaces
JPS5322952A (en) Axtal load device
ZA764837B (en) Improvements in iucds
JPS52115061A (en) Load limit device
JPS5360570A (en) Mechanism for changing load in wireebonder
JPS5360055A (en) Load carrying device
IL53262A0 (en) Improvements in switches
JPS5291438A (en) Improvement in electrophresis
JPS5360569A (en) Mechanism for changing load in wireebonder
JPS5360571A (en) Mechanism for changing load in wireebonder
JPS53538A (en) Carrying truck
HU175602B (en) Pallet block
AU2511877A (en) Pallets
JPS5277785A (en) Load cell mechanism
JPS52129975A (en) Load switch
JPS52112926A (en) Selffdriven truck
JPS534943A (en) Pallet