JPS57159034A - Wire clamping device - Google Patents

Wire clamping device

Info

Publication number
JPS57159034A
JPS57159034A JP56044039A JP4403981A JPS57159034A JP S57159034 A JPS57159034 A JP S57159034A JP 56044039 A JP56044039 A JP 56044039A JP 4403981 A JP4403981 A JP 4403981A JP S57159034 A JPS57159034 A JP S57159034A
Authority
JP
Japan
Prior art keywords
wire
clamping
clamping device
branch
wire clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56044039A
Other languages
Japanese (ja)
Inventor
Kenji Watanabe
Isamu Yamazaki
Yasushi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP56044039A priority Critical patent/JPS57159034A/en
Publication of JPS57159034A publication Critical patent/JPS57159034A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To accelerate a wire bonding method by clamping a wire with a piezoelectric element, thereby reducing the weight of a bonding mechanism. CONSTITUTION:The clamping arm 10 of a wire clamping device is branched at the end side into fork shape, a piezoelectric element 12 is provided in the vicinity of the end of one branch 10A, and a clamping plate 14 is mounted at the position faced with the element 12 at the other branch 10B. When an electric field or a magnetic field is applied to the element 12, the element 12 rapidly responds thereto, and elongates longitudinally at a high speed by the electrostrictive or magnetostrictive characteristic, with the result that a wire 16 is rapidly clamped between the element 12 and the plate 14.
JP56044039A 1981-03-27 1981-03-27 Wire clamping device Pending JPS57159034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56044039A JPS57159034A (en) 1981-03-27 1981-03-27 Wire clamping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56044039A JPS57159034A (en) 1981-03-27 1981-03-27 Wire clamping device

Publications (1)

Publication Number Publication Date
JPS57159034A true JPS57159034A (en) 1982-10-01

Family

ID=12680475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56044039A Pending JPS57159034A (en) 1981-03-27 1981-03-27 Wire clamping device

Country Status (1)

Country Link
JP (1) JPS57159034A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01198037A (en) * 1988-02-03 1989-08-09 Nec Corp Wire clamp device
JPH01245532A (en) * 1988-03-26 1989-09-29 Toshiba Corp Wire clamp mechanism
JPH0268942A (en) * 1988-09-02 1990-03-08 Matsushita Electric Ind Co Ltd Wire-clamping method and device
US5323948A (en) * 1992-03-12 1994-06-28 Kabushiki Kaisha Shinkawa Wire clamper
US6156990A (en) * 1998-06-22 2000-12-05 Kulicke & Soffa Industries, Inc. Long-wearing impervious conductive wire clamp
WO2008151952A1 (en) * 2007-06-11 2008-12-18 Oerlikon Assembly Equipment Ag, Steinhausen Wire clamp for a wire bonder
US11004822B2 (en) * 2016-08-23 2021-05-11 Shinkawa Ltd. Wire clamp apparatus calibration method and wire bonding apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423469A (en) * 1977-07-25 1979-02-22 Hitachi Ltd Wire clamper for wire bonder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423469A (en) * 1977-07-25 1979-02-22 Hitachi Ltd Wire clamper for wire bonder

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01198037A (en) * 1988-02-03 1989-08-09 Nec Corp Wire clamp device
JPH0616519B2 (en) * 1988-02-03 1994-03-02 日本電気株式会社 Wire clamp device
JPH01245532A (en) * 1988-03-26 1989-09-29 Toshiba Corp Wire clamp mechanism
JPH0268942A (en) * 1988-09-02 1990-03-08 Matsushita Electric Ind Co Ltd Wire-clamping method and device
US5323948A (en) * 1992-03-12 1994-06-28 Kabushiki Kaisha Shinkawa Wire clamper
US6156990A (en) * 1998-06-22 2000-12-05 Kulicke & Soffa Industries, Inc. Long-wearing impervious conductive wire clamp
WO2008151952A1 (en) * 2007-06-11 2008-12-18 Oerlikon Assembly Equipment Ag, Steinhausen Wire clamp for a wire bonder
US11004822B2 (en) * 2016-08-23 2021-05-11 Shinkawa Ltd. Wire clamp apparatus calibration method and wire bonding apparatus

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