JPH0268942A - Wire-clamping method and device - Google Patents
Wire-clamping method and deviceInfo
- Publication number
- JPH0268942A JPH0268942A JP63220954A JP22095488A JPH0268942A JP H0268942 A JPH0268942 A JP H0268942A JP 63220954 A JP63220954 A JP 63220954A JP 22095488 A JP22095488 A JP 22095488A JP H0268942 A JPH0268942 A JP H0268942A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- clamp
- piezoelectric element
- movable part
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 8
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000004044 response Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品ワイヤーボンディング機のワイヤー
クランプ方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire clamping method for an electronic component wire bonding machine.
従来の技術
ワイヤーボンディング装置には種々のタイプがあるが、
その−例を第２図に示す。即ち、ペレット５をつけた基
板６が位置決め台７上に送られて位置決めされると、Ｘ
Ｙ駆動部８が駆動してボンディングヘッド９をＸＹ力方
向移動させ、ボンディングアーム１０に取付けられたボ
ンディングツール１１がペレット５の上方に位置する。Conventional technology There are various types of wire bonding equipment.
An example is shown in FIG. That is, when the substrate 6 with the pellets 5 attached is sent onto the positioning table 7 and positioned,
The Y drive section 8 is driven to move the bonding head 9 in the XY force directions, and the bonding tool 11 attached to the bonding arm 10 is positioned above the pellet 5.
次にボンディングアーム１０が下降してボンディングツ
ール１１によりワイヤ４をベレット５のパッドに押付け
てボンディングし、その後ボンディングアーム１０が上
昇し、続いてＸＹ駆動部８によってボンディングヘッド
９がＸＹ力方向移動してワイヤ４をワイヤスプール１２
より繰り出しながら基板６の上方に位置する。そして再
びボンディングアーム１０が下降してボンディングツー
ル１１でワイヤ４を基板６のポストにボンディングし、
その後クランプ部上下動アーム１３に取付けられたワイ
ヤークランプ部１４が作動してワイヤ４をクランプし、
クランプ部上下動アーム１３が上昇してワイヤ４をボン
ディングツール１１の根元より切断する。以上がワイヤ
ーボンディング装置の説明である。この種のボンディン
グに使用するワイヤーは、直径が十数μｍから数＋μｍ
のワイヤーであり、従来の技術では、ワイヤーのクラン
プ部には第３図に代表されるメカニズムが用いられてい
る。これは第３図においてソレノイド１５の変位を１６
．１７のレバーで受け、レバーに取り付けられた板バネ
１８がクランプ可動部１９をクランプ固定部２０の方に
押す際に、ワイヤー４をクランプする仕組みである。Next, the bonding arm 10 is lowered and the bonding tool 11 presses the wire 4 against the pad of the pellet 5 for bonding, and then the bonding arm 10 is raised, and then the XY drive section 8 moves the bonding head 9 in the XY force direction. and connect the wire 4 to the wire spool 12.
It is positioned above the substrate 6 while being extended further. Then, the bonding arm 10 descends again and the bonding tool 11 bonds the wire 4 to the post of the board 6.
Thereafter, the wire clamp section 14 attached to the clamp section vertically movable arm 13 operates to clamp the wire 4,
The clamp part vertically movable arm 13 rises and cuts the wire 4 from the base of the bonding tool 11. The above is the explanation of the wire bonding device. The wire used for this type of bonding has a diameter of several tens of micrometers to several plus micrometers.
In the conventional technology, a mechanism typified by FIG. 3 is used for the clamping part of the wire. This means that the displacement of solenoid 15 is 16 in Figure 3.
．． The wire 4 is clamped when the plate spring 18 attached to the lever pushes the clamp movable part 19 toward the clamp fixing part 20.
発明が解決しようとする課題
しかしながら、上記のような機構では構成部品点数が多
いために、個々のメンテナンスや調整が複雑になる上応
答性も悪く、最大の欠点としてワイヤーの種類に応じた
クランプ力の調整が構造上不可能であるという問題点を
有していた。本発明は、上記問題点に鑑み、部品点数の
消滅、メンテナンスの簡素化、高応答性を実現し、ワイ
ヤークランプ強さの調整機能を付加したワイヤークラン
プ装置を提供するものである。Problems to be Solved by the Invention However, the mechanism described above has a large number of component parts, which makes maintenance and adjustment of each component complicated, and the response is poor.The biggest drawback is that the clamping force cannot be adjusted depending on the type of wire. The problem was that it was structurally impossible to adjust. In view of the above-mentioned problems, the present invention provides a wire clamp device that eliminates the number of parts, simplifies maintenance, achieves high responsiveness, and has an added function of adjusting wire clamp strength.
課題を解決するための手段
本発明は上記課題を解決するため、ワイヤをクランプす
る一対の固定側アームと、可動側アームとを備え、この
可動側アームを、弾性を有するクランプ可動部及びクラ
ンプ可動部をたわませる圧電素子により構成したワイヤ
クランプ装置を手段とし、さらに、クランプ可動部を板
バネ状の支点により支持した構成、及びクランプ可動部
のワイヤを挟持する平面を非挟持時において固定側アー
ムの平面と所定の角度で対向するよう形成し、挟持時に
はクランプ可動部を圧電素子によってたわませた状態で
固定側アームとクランプ可動部の挟持面とがワイヤを平
行して挟持するよう一対のクランプ面を構成したワイヤ
クランプ装置を手段とする。また、一対のアームの内、
一方のアームを圧電素子によりたわませて、両アーム間
に挾持力を発生させて、ワイヤをクランプするワイヤク
ランプ方法、及び圧電素子への印加電圧を制御し、これ
によってワイヤのクランプ力を変化させるワイヤクラン
プ方法、さらに、入力されたワイヤー径に関する情報に
より、予めクランプするワイヤー径に対応して設定され
た電圧値を選択し圧電素子に印加することを特徴とする
ワイヤークランプ方法を手段として備えたものである。Means for Solving the Problems In order to solve the above problems, the present invention includes a pair of fixed arms and a movable arm for clamping a wire, and the movable arms are connected to an elastic clamp movable part and a clamp movable part. The wire clamp device is constructed by a piezoelectric element that bends the wire, and the clamp movable part is supported by a leaf spring-like fulcrum, and the flat surface of the clamp movable part that clamps the wire is on the fixed side when not clamped. The wire is formed to face the plane of the arm at a predetermined angle, and when clamping, the clamp movable part is bent by the piezoelectric element, and the fixed arm and the clamping surface of the clamp movable part clamp the wire in parallel. The means is a wire clamping device having a clamping surface. Also, among the pair of arms,
A wire clamping method in which one arm is bent by a piezoelectric element to generate a clamping force between the two arms to clamp the wire, and the voltage applied to the piezoelectric element is controlled, thereby changing the clamping force of the wire. and a wire clamping method characterized by selecting a voltage value set in advance according to the diameter of the wire to be clamped based on input information regarding the wire diameter and applying it to the piezoelectric element. It is something that
作 用
上記のクランプ手段により、ワイヤーのクランプ可動部
とクランプ固定部を一体化して構造を簡単にすると同時
に圧電素子をクランプのアクチュエーターに使用するこ
とにより、任意の情報信号によってワイヤーのクランプ
力を調整することができる。Function The clamping means described above simplifies the structure by integrating the movable part of the wire clamp and the fixed part of the clamp, and at the same time, by using a piezoelectric element as the actuator of the clamp, the clamping force of the wire can be adjusted using an arbitrary information signal. can do.
実 施 例
以下、本発明の一実施例を第１図、第４図及び第５図を
用いて説明する。１は圧電素子であり、板バネ状の支点
２１により支持されたクランプ可動部２とで可動側アー
ムで構成している。３は固定側アームであり、両アーム
２，３の先端の挟持面２ａ、３ａによりワイヤー４が挟
持されるもので、圧電素子１へ電圧を印加し、クランプ
可動部２を固定側アーム３へ相対移動させてワイヤクラ
ンプ動作が行なわれる。次に上記で示した板バネ支点２
１を有する一体型クランバーの動作原理を第４図以下で
説明する。第４図（ａ）のＦｌは圧電素子１による押し
付は力でＭ２はＦｌにより生じるねじりモーメント、ψ
１はＭ２により生じるたわみ角δｌはたわみ変位量であ
り、カスティリアノの定理により導出した理論式を次に
示す。Ｅはヤング率、ｌｚは断面二次モーメントである
。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1, 4, and 5. Reference numeral 1 denotes a piezoelectric element, which is constituted by a movable arm and a clamp movable portion 2 supported by a leaf spring-shaped fulcrum 21. Reference numeral 3 designates a fixed side arm, in which a wire 4 is held between the holding surfaces 2a and 3a at the ends of both arms 2 and 3. A voltage is applied to the piezoelectric element 1, and the clamp movable part 2 is moved to the fixed side arm 3. The wire clamping operation is performed by relative movement. Next, the leaf spring fulcrum 2 shown above
The principle of operation of the integrated clamper having the above-mentioned clamper 1 will be explained below with reference to FIG. In Fig. 4(a), Fl is the force exerted by the piezoelectric element 1, and M2 is the twisting moment caused by Fl, ψ
1 is the deflection angle δl generated by M2, which is the amount of deflection displacement, and the theoretical formula derived from Castigliano's theorem is shown below. E is Young's modulus, lz is the moment of inertia of area.
Ｍｌ＝Ｆｌ・、Ｐ！３ ・・・・
（１）・ ・ ・ ・（２）
置関係を示しており、ｄＯはクランプ可動部２とクラン
プ固定部３の間の初期隙量、ｄｉはワイヤー直径であり
、これら諸量の間には次に示す関係が成立する。Ml=Fl・,P! 3...
(1) ・ ・ ・ ・(2) It shows the positional relationship, where dO is the initial gap between the clamp movable part 2 and the clamp fixed part 3, di is the wire diameter, and the following is the relationship between these quantities. The relationship shown in is established.
ｄＯ−ｄｉ−δ１−δ２ ・・・・（７
）・ ・ ・ ・（３）
第４図（ｂ）のＦ２は、クランプ可動部２の先端でのワ
イヤークランプ力であり、Ｍ２はＦ２により生じるねじ
りモーメント、ψ２はたわみ角、δ２はたわみ変位量で
ある。dO-di-δ1-δ2 (7
)・・・・・(3) In Fig. 4(b), F2 is the wire clamping force at the tip of the clamp movable part 2, M2 is the torsion moment generated by F2, ψ2 is the deflection angle, and δ2 is the deflection displacement amount. It is.
Ｍ２＝Ｆ２・ノ２＝Ｆ２（）ｏ４） ・・・・（４
）・ ・ ・ ・（５）
第４図（Ｃ）は、クランプ可動部２の先端での位・ ・
・ ・（８）
また、第４図（ｄ）は、クランプ可動部２の先端形状で
あり、クランプ可動部２の先端２ａをクランプ固定部３
に対してψ１−ψ２の傾斜角を持つ様に初期設定すると
、ワイヤークランプ時にクランプ可動部２と固定側アー
ム３の挾持面３ａが平行となり、クランプ部相互間の平
行度を確保できることを示している。即ち、ワイヤーを
クランプする際に必要とされるクランプ可動部２と固定
側アーム３の平行度は、ワイヤー径をｄ、クランプ部の
長さをＬとすると、ｄ／Ｌ以下であることが必要である
。今仮にワイヤー径が１３〜３０μｍまで変化したとし
ても、本発明では、ワイヤークランプ時の平行度をｄ／
Ｌ以下に保持可能であることが理論的にも証明される。M2=F2・ノ2=F2()o4) ・・・(4
)・・・・・(5) Figure 4 (C) shows the position at the tip of the clamp movable part 2.
・ ・(8) Also, FIG. 4(d) shows the shape of the tip of the clamp movable part 2, and the tip 2a of the clamp movable part 2 is connected to the clamp fixing part 3.
It is shown that if the initial setting is made to have an inclination angle of ψ1 - ψ2 against the wire, the clamping surfaces 3a of the clamp movable part 2 and fixed side arm 3 will be parallel when wire clamping, and parallelism between the clamp parts can be ensured. There is. That is, the parallelism between the clamp movable part 2 and the fixed arm 3 required when clamping the wire needs to be less than or equal to d/L, where d is the wire diameter and L is the length of the clamp part. It is. Even if the wire diameter changes from 13 to 30 μm, in the present invention, the parallelism when clamping the wire is d/
It is also theoretically proven that it is possible to maintain the temperature below L.
なお、本発明のアクチュエータである圧電素子１に対し
て、ワイヤー径等の情報に応じた印加電圧をコンピュー
ター制御のちとに加えることにより、Ｆｌの調節が可能
となり、その結果としてワイヤー４のクランプ強さの調
節が可能となる。Note that by applying an applied voltage according to information such as the wire diameter to the piezoelectric element 1, which is the actuator of the present invention, under computer control, Fl can be adjusted, and as a result, the clamping strength of the wire 4 can be adjusted. The height can be adjusted.
第５図は、このような本発明一実施例のシステム構成図
である。すなわち、第５図においては、圧電素子１への
印加電圧をワイヤー径等の任意情報信号の入力によりＣ
ＰＣを介して、あらかじめ設定したワイヤー径と印加電
圧のテーブルを検索して最適印加電圧を決定し、これに
より印加電圧を変化させワイヤークランプ力を変化させ
る制御手段を持つ事を特徴とするワイヤークランプ方法
を示すものである。FIG. 5 is a system configuration diagram of one embodiment of the present invention. That is, in FIG. 5, the voltage applied to the piezoelectric element 1 is changed to C by inputting an arbitrary information signal such as the wire diameter.
A wire clamp characterized by having a control means that searches a preset table of wire diameters and applied voltages via a PC to determine the optimum applied voltage, and thereby changes the applied voltage and changes the wire clamping force. It shows the method.
発明の効果
本発明によるクランプ装置は、従来のメカニズム式に比
べて以下に示す優位性を有する。Effects of the Invention The clamp device according to the present invention has the following advantages over the conventional mechanical type.
・構成部品点数が従来方式に比べ大幅に消滅可能である
。・The number of component parts can be significantly reduced compared to conventional methods.
・可動クランパー先端部分に傾斜を設定しである為、ワ
イヤーの平行うランプが容易に行える。・Since the tip of the movable clamper is sloped, it is easy to ramp the wire horizontally.
・クランプ部の一体化に加えて圧電素子の物理変化が高
速であるため、高応答性を特徴とするクランプ機構が実
現できる。・In addition to the integration of the clamp part, the physical change of the piezoelectric element is fast, so a clamp mechanism featuring high response can be realized.
・クランプ部分を板バネ機構を有する一体物とすること
により、安定した再現性と、重量の軽減が可能となる。- By making the clamp part an integral part with a leaf spring mechanism, stable reproducibility and weight reduction are possible.
・圧電素子への印加電圧をワイヤー径等の任意情報に応
じた最適値になる様コンピューターで制御する事により
、ワイヤークランプ力の調節が容易に可能となる。- The wire clamping force can be easily adjusted by controlling the voltage applied to the piezoelectric element using a computer so that it becomes the optimal value according to arbitrary information such as the wire diameter.
第１図は本発明の一実施例を示すワイヤークランプ装置
の部分斜視図、第２図はワイヤーボンディング装置の一
例を示す斜視図、第３図は従来のワイヤークランプ部の
一例を示す平面図、第４図（ａ）〜（ｃ）は、本発明の
一実施例における力学的解析図、第４図（ｄ）はクラン
プ部先端部分の拡大図、第５図は本発明の一実施例のシ
ステム構成図である。
１・・・・・・圧電素子、２・・・・・・クランプ可動
部、３・・・・・・固定側アーム、４・・・・・・ワイ
ヤー代理人の氏名 弁理士 粟野重孝 ほか１名イ６’
、ｌ’？−ルハ１−
１８−−一碩バ′λ
ｆ９−−−クラノブイ電Ｏ＠Ｐ
２０−−−７うＪ″）″国定舒FIG. 1 is a partial perspective view of a wire clamp device showing an embodiment of the present invention, FIG. 2 is a perspective view of an example of a wire bonding device, and FIG. 3 is a plan view showing an example of a conventional wire clamp section. 4(a) to 4(c) are mechanical analysis diagrams of an embodiment of the present invention, FIG. 4(d) is an enlarged view of the tip of the clamp portion, and FIG. 5 is a diagram of an embodiment of the present invention. It is a system configuration diagram. 1... Piezoelectric element, 2... Clamp movable part, 3... Fixed side arm, 4... Wire Agent's name Patent attorney Shigetaka Awano and others 1 name i6'
,l'? -Ruha 1- 18--Isseiba'λ f9--Kurano Buoy Den O@P 20--7UJ'')''Kokusei Shu
Claims (6)
動側アームとを有し、この可動側アームを、弾性を有す
るクランプ可動部及びクランプ可動部をたわませる圧電
素子により構成したワイヤクランプ装置。(1) A wire clamp device that has a pair of fixed arms that clamp the wire and a movable arm, and the movable arm is composed of an elastic clamp movable part and a piezoelectric element that deflects the clamp movable part. .
請求項１記載のワイヤクランプ装置。(2) The wire clamp device according to claim 1, wherein the clamp movable part is supported by a leaf spring-shaped fulcrum.
時において固定側アームの平面と所定の角度で対向する
よう形成し、挟持時にはクランプ可動部を圧電素子によ
ってたわませた状態で固定側アームとクランプ可動部の
挟持面とがワイヤを平行して挟持するよう一対のクラン
プ面を構成した請求項１記載のワイヤクランプ装置。(3) The flat surface of the clamp movable part that clamps the wire is formed so that it faces the flat surface of the stationary arm at a predetermined angle when not clamped, and when clamped, the clamp movable part is bent by the piezoelectric element on the fixed side. 2. The wire clamping device according to claim 1, wherein the arm and the clamping surface of the movable clamp portion constitute a pair of clamping surfaces so as to clamp the wire in parallel.
りたわませて、両アーム間に挾持力を発生させて、ワイ
ヤをクランプするワイヤクランプ方法。(4) A wire clamping method in which one of a pair of arms is bent by a piezoelectric element to generate a clamping force between the two arms to clamp the wire.
イヤのクランプ力を変化させる請求項４記載のワイヤク
ランプ方法。(5) The wire clamping method according to claim 4, wherein the voltage applied to the piezoelectric element is controlled, thereby changing the clamping force of the wire.
クランプするワイヤー径に対応して設定された電圧値を
選択し圧電素子に印加することを特徴とする請求項４記
載のワイヤクランプ方法。(6) The wire clamping method according to claim 4, characterized in that, based on the inputted information regarding the wire diameter, a voltage value set in advance in accordance with the wire diameter to be clamped is selected and applied to the piezoelectric element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63220954A JP2743394B2 (en) | 1988-09-02 | 1988-09-02 | Wire clamp method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63220954A JP2743394B2 (en) | 1988-09-02 | 1988-09-02 | Wire clamp method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268942A true JPH0268942A (en) | 1990-03-08 |
| JP2743394B2 JP2743394B2 (en) | 1998-04-22 |
Family
ID=16759157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63220954A Expired - Lifetime JP2743394B2 (en) | 1988-09-02 | 1988-09-02 | Wire clamp method and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2743394B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435477A (en) * | 1993-03-09 | 1995-07-25 | Kabushiki Kaisha Shinkawa | Wire clampers |
| EP0704916A1 (en) | 1994-09-29 | 1996-04-03 | Nec Corporation | Output-enlarged piezoelectric clamp device |
| JP2002368035A (en) * | 2001-06-06 | 2002-12-20 | Nec Corp | Wire clamp device for wire bonder |
| US8157222B1 (en) | 2010-10-29 | 2012-04-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Wire harness clamp |
| US11004822B2 (en) * | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire clamp apparatus calibration method and wire bonding apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57159034A (en) * | 1981-03-27 | 1982-10-01 | Hitachi Ltd | Wire clamping device |
| JPS61151338U (en) * | 1985-03-11 | 1986-09-18 | ||
| JPS62119932A (en) * | 1985-11-19 | 1987-06-01 | Rohm Co Ltd | Wire clamping mechanism |
| JPS63111634A (en) * | 1986-10-30 | 1988-05-16 | Toshiba Corp | Method and apparatus for win bonding |
| JPH01245532A (en) * | 1988-03-26 | 1989-09-29 | Toshiba Corp | Wire clamp mechanism |
-
1988
- 1988-09-02 JP JP63220954A patent/JP2743394B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57159034A (en) * | 1981-03-27 | 1982-10-01 | Hitachi Ltd | Wire clamping device |
| JPS61151338U (en) * | 1985-03-11 | 1986-09-18 | ||
| JPS62119932A (en) * | 1985-11-19 | 1987-06-01 | Rohm Co Ltd | Wire clamping mechanism |
| JPS63111634A (en) * | 1986-10-30 | 1988-05-16 | Toshiba Corp | Method and apparatus for win bonding |
| JPH01245532A (en) * | 1988-03-26 | 1989-09-29 | Toshiba Corp | Wire clamp mechanism |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5435477A (en) * | 1993-03-09 | 1995-07-25 | Kabushiki Kaisha Shinkawa | Wire clampers |
| EP0704916A1 (en) | 1994-09-29 | 1996-04-03 | Nec Corporation | Output-enlarged piezoelectric clamp device |
| JP2002368035A (en) * | 2001-06-06 | 2002-12-20 | Nec Corp | Wire clamp device for wire bonder |
| US8157222B1 (en) | 2010-10-29 | 2012-04-17 | Toyota Motor Engineering & Manufacturing North America, Inc. | Wire harness clamp |
| US11004822B2 (en) * | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire clamp apparatus calibration method and wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2743394B2 (en) | 1998-04-22 |
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