JPS63111634A - Method and apparatus for win bonding - Google Patents
Method and apparatus for win bondingInfo
- Publication number
- JPS63111634A JPS63111634A JP61256820A JP25682086A JPS63111634A JP S63111634 A JPS63111634 A JP S63111634A JP 61256820 A JP61256820 A JP 61256820A JP 25682086 A JP25682086 A JP 25682086A JP S63111634 A JPS63111634 A JP S63111634A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- clamping force
- clamping
- force
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、半導体装置の配線時に生じるクランプ力の不
安定性を除去することのできるワイヤボンディング方法
及びその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a wire bonding method and device capable of eliminating instability in clamping force that occurs during wiring of semiconductor devices.
（従来の技術）
半導体装置の製造には、ベレットと外部リードとの間を
金ワイヤにより結線する例えば特開昭６１−１０１０１
２号に開示されているようなワイヤボンディング装置が
用いられている。このような装置においては、キャピラ
リにより被圧着物に所定の加圧力で固着されるワイヤを
繰出すためのクランプ機構を有している。このクランプ
機構は、その駆動源として圧電素子を用い、この圧電素
子の印加電圧を制御することにより、ワイヤをクランプ
している。(Prior art) In manufacturing semiconductor devices, for example, Japanese Patent Laid-Open No. 61-10101 discloses that a gold wire is used to connect a bullet and an external lead.
A wire bonding device as disclosed in No. 2 is used. Such an apparatus includes a clamp mechanism for feeding out a wire that is fixed to an object to be crimped with a predetermined pressure by a capillary. This clamp mechanism uses a piezoelectric element as its driving source, and clamps the wire by controlling the voltage applied to the piezoelectric element.
しかしながら、上記従来の装置においては、実際にワイ
ヤに加えられるクランプ力が不明であり、適正なクラン
プ力を得ることが困難である不都合を生じている。こと
に、ルーピング時に、ワイヤにテンシ四ンをかける場合
においては、ワイヤの材種、ワイヤ径、クランパの種類
等により、ワイヤにかかる摩擦力が違うため適正なルー
プ形成を困難にしていた。このような不都合は、半導体
装置製造の歩留低下の一因ともなっていた。However, in the conventional device described above, the clamping force actually applied to the wire is unknown, resulting in the disadvantage that it is difficult to obtain an appropriate clamping force. In particular, when tension is applied to the wire during looping, the frictional force applied to the wire varies depending on the wire material, wire diameter, type of clamper, etc., making it difficult to form an appropriate loop. Such inconveniences have been a factor in reducing the yield of semiconductor device manufacturing.
（発明が解決しようとする問題点）
不発明は、上記ワイヤボンディングのクランプ時に惹起
する問題を顧慮してなされたもので、ワイヤのクランプ
時に、最適なりランプ力を安定して投入できるワイヤボ
ンディング方法及びその装置を提供することを目的とす
る。(Problems to be Solved by the Invention) The invention was made in consideration of the above-mentioned problems that occur when clamping wire bonding, and provides a wire bonding method that can stably apply an optimum ramp force when clamping the wire. and its equipment.
（問題点を解決するための手段と作用）本発明のワイヤ
ボンディング方法は、ワイヤをクランプするクランプ工
程と、クランプ力を検出するクランプ工程と、検出され
たクランプ力に基づいてクランプ力を調整する工程とか
らなる。(Means and effects for solving the problems) The wire bonding method of the present invention includes a clamping process of clamping the wire, a clamping process of detecting the clamping force, and adjusting the clamping force based on the detected clamping force. It consists of a process.
また、本発明のワイヤボンディング装置は、ワイヤをク
ランプするクランプ手段と、クランプ力を検出する手段
と、検出されたクランプ力に基づいてクランプ力を制御
する手段とからなる。Further, the wire bonding apparatus of the present invention includes a clamping means for clamping the wire, a means for detecting the clamping force, and a means for controlling the clamping force based on the detected clamping force.
そして、クランプ力の厳密な制御により、ワイヤボンデ
ィングの信頼性を向上させるようにしたものである。The reliability of wire bonding is improved by strictly controlling the clamping force.
（実施例） 以下、本発明の一実施例を図面を参照して詳述する。(Example) Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第１図は、この実施例のワイヤボンディング装置を示し
ている。第１図中（１）は装置本体で、この本体（１）
の上部にはクジンプ部（２ａ）を備えたワイヤスプール
などのワイヤ繰出部（２）が設けられており、またその
ワイヤ繰出し側にはワイヤ（３）を案内するワイヤガイ
ド（４）が設けられている。このワイヤガイド（４）は
基端部が本体（１）の取付部（５）に対して上下方向に
揺動自在に取付けられた板ばねからなり、常に上方への
弾性力が付与されているとともに、ホルダ（６）に設け
たストッパ（７）によって下方への揺動量が規制されて
いる。また、ワイヤガイド責４）の自由端部には上記ワ
イヤ（３）を下方へ案内するための湾曲部（８）が形成
されている。このワイヤガイド（４）の湾曲部（８）の
下部には導入されたワイヤ（３）をクランプしたり解放
するための上クジンＩ（９）が設けられている。この上
クランパ（９）の支持構造として゛は、上記上クランパ
（９）がアーム（９ａ）を介して本体（１）に固定され
たものと、上記アーム（９ａ）が回動軸（９ｂ）を中心
として上下方向に回動し、上クランパ（９）が上下動す
る構造のものとの２種類がある。そして、いずれの構造
の上クランパ（９）も後述する機構により開閉し、ワイ
ヤ（３）をクランプしたり解放したりするようになって
いる。上記上クランパ（９）の下方にはチューブ状のワ
イヤガイド（１０が下クランパαυの揺動アームａ２の
取付けられていて、ワイヤ（３）を下クランパαυに案
内するようになっている。FIG. 1 shows the wire bonding apparatus of this embodiment. In Figure 1, (1) is the main body of the device;
A wire feeding part (2) such as a wire spool equipped with a wire spool (2a) is provided on the upper part of the wire, and a wire guide (4) for guiding the wire (3) is provided on the wire feeding side. ing. This wire guide (4) consists of a leaf spring whose base end is attached to the attachment part (5) of the main body (1) so as to be able to swing vertically, and is always given an upward elastic force. At the same time, the amount of downward swinging is regulated by a stopper (7) provided on the holder (6). Further, a curved portion (8) for guiding the wire (3) downward is formed at the free end of the wire guide 4). An upper clamp I (9) for clamping and releasing the introduced wire (3) is provided at the lower part of the curved portion (8) of the wire guide (4). The support structure for the upper clamper (9) is such that the upper clamper (9) is fixed to the main body (1) via an arm (9a), and the arm (9a) rotates around the rotation axis (9b). There are two types: one in which the clamper rotates vertically around the center, and the other in which the upper clamper (9) moves up and down. The upper clamper (9) of either structure is opened and closed by a mechanism described later to clamp or release the wire (3). Below the upper clamper (9), a tubular wire guide (10) is attached to the swing arm a2 of the lower clamper αυ, so as to guide the wire (3) to the lower clamper αυ.
上記下クランパαυは揺動アーム（Ｌりの先端に設けら
れていて図示しないソレノイドに駆動されて開閉し、ワ
イヤ（３）をクランプしたり解放したりするようになっ
ている。上記揺動アームα２の下側にはこれと平行する
超音波ホーン付のキャピラリアーム（１３が設けられて
いる。この超音波ホーン付のキャピラリアーム０３の先
端にはワイヤ（３）を挿通させるボンディングツールＩ
が設けられている。そして、この超音波ホーン付のキャ
ピラリアームθ（至）は、上記下り２ンパ圓の揺動アー
ム口の基端部と板ばね（１３ｇ）を介して連結されてお
り、揺動アームｃＬ匂の基端部を軸支する回動軸α９を
中心としてともに上下方向に回動するようになっている
。すなわち、ワイヤガイド００、下クランパ住υおよび
ボンディングツール（１４）は一体となり、上下方向に
移動するようになっている。なお、ボンディングツール
α４の下方にはトーチαｅが設けられていて、ボンディ
ングツールα尋の下方に突出するワイヤ（３）の先端を
放電Φ加熱してボールα力を形成するようになっている
。そして、ボンディングはボンディングツールＩの下方
にベレッ） （１８の固定されたリードフレームα優を
配置し、上記ボールα力をペレット（ハ）にボンディン
グしたのち、ワイヤ（３）をリードフレーム←９にボン
ディングしてベレット（ｌ樽とリードフレーム（１９と
を接続することによりおこなわれる。ｇ２図は、上、下
クランパ（９）、αＤの詳細な構造を示している。この
図において、各クラン〆（９１，（ｌυは、−対の対向
して設けられ電圧の印加により適時にワイヤ（３）を挟
圧する板状の圧電セラミックアクチュエータｍ、ａ１）
と、これらのアクチュエータ（１）、Ｑｌ）遊端部対向
面に取付けられワイヤ（３）を直接挾持する一対の片状
クランプ具（２ａ、Ｑ３と、これらクランプＪｉｅ＠、
Ｇ３のうち少なくとも一つに埋設されワイヤ（３）のク
ランプカを検出して対応する電気信号８Ａを出力する圧
力センサ（２）とからなっている。しかして、上記圧力
センサ（財）は比較回路（ハ）の入力側に接続されてい
る。この比較回路（ハ）には、最適のランプ力を示す基
準値ｖＯが設定されている。そうして、この比較回路（
ホ）の出力側は、ＣＰＵ （ＣｅｎｔｒａｌＰｒｏｃｅ
ｓｓｉｎｇ Ｕｎｉｔ ；中央制御部）０６）の入力側
に接続されている。一方、前記アクチーエータ（４）、
＋２１）は、所要の電圧を適時に印加するための駆動
回路（財）の出力側に接続されている。また、この駆動
回路（５）の入力側は、電圧を制御するための電圧制御
回路（ハ）の出力側に接続されている。さらに、この電
圧制御回路−の入力側は、前記ＣＰＵ（ホ）の出力側に
接続されている。The lower clamper αυ is provided at the tip of the swing arm (L) and is driven by a solenoid (not shown) to open and close to clamp or release the wire (3).The swing arm A capillary arm (13) with an ultrasonic horn is provided on the lower side of α2 and parallel to this. A bonding tool I through which a wire (3) is inserted into the tip of the capillary arm 03 with an ultrasonic horn.
is provided. The capillary arm θ (end) with the ultrasonic horn is connected to the base end of the swinging arm opening of the downward two-ampere circle via a leaf spring (13g), and the swinging arm cL Both are configured to rotate in the vertical direction about a rotation axis α9 that pivotally supports the base end portion. That is, the wire guide 00, the lower clamper housing υ, and the bonding tool (14) are integrally moved in the vertical direction. Note that a torch αe is provided below the bonding tool α4, and the tip of the wire (3) protruding below the bonding tool α is heated by discharge Φ to form a ball α force. Then, the bonding is carried out under the bonding tool I.) (18 fixed lead frame α is placed, and the above ball α force is bonded to the pellet (c), and then the wire (3) is attached to the lead frame←9. This is done by bonding the barrel and the lead frame (19). Figure g2 shows the detailed structure of the upper and lower clampers (9) and αD. (91, (lυ is a pair of plate-shaped piezoelectric ceramic actuators m, a1 that are provided oppositely and pinch the wire (3) at the appropriate time by applying a voltage)
, a pair of piece-shaped clamps (2a, Q3) attached to the opposing surfaces of the free ends of these actuators (1), Ql and directly clamping the wire (3), and these clamps Jie@,
The pressure sensor (2) is embedded in at least one of the G3s and detects the clamping force of the wire (3) and outputs a corresponding electric signal 8A. The pressure sensor (product) is connected to the input side of the comparison circuit (c). A reference value vO indicating the optimum lamp power is set in this comparison circuit (c). Then, this comparison circuit (
The output side of
Connected to the input side of the ssing unit (central control unit) 06). On the other hand, the actuator (4),
+21) is connected to the output side of the drive circuit for timely application of the required voltage. Further, the input side of this drive circuit (5) is connected to the output side of a voltage control circuit (c) for controlling voltage. Furthermore, the input side of this voltage control circuit - is connected to the output side of the CPU (E).
つぎに、上記構成のワイヤボンディング装置を用いて、
この実施例のワイヤボンディング方法について述べる。Next, using the wire bonding device with the above configuration,
The wire bonding method of this embodiment will be described.
まず、ＣＰＵ（イ）に格納されている所定のプログラム
に従ってワイヤ（３）のリードフレームＵへのワイヤボ
ンディングを開示する。これにともない、ワイヤ（３）
は、上、下クランパ（９１，（１１）により順次に繰り
出される。すなわち、ＣＰＵ＠からは、所定のプログ２
ムに従って、所定のクランプ力を発生させるに必要な電
圧値を指示する制御信号ＳＢが電圧制御回路（至）に出
力される。すると、この電圧制御回路（２）からは、信
号ＳＢに対応した制御信号ＳＣが駆動回路（財）に出力
される。すると、この駆動回路（財）からは、各アクチ
ーエータｗ、ｏＩ）に所期の電圧が印加され、その結果
、ワイヤ（３）は、印加された電圧値に対応したクラン
プ力で、クランプ具（２榎、（ハ）によりクランプされ
る。しかして、このクランプ時に生じたクランプ圧力は
、圧力センサ（財）にて検出され、クランプ力を示す電
圧値Ｖを有する電気信号８人が比較回路（ハ）に出力さ
れる。すると、この比較回路（ハ）にては、基準値Ｖｏ
と電圧値■との差Δ■を示す信号８ＤがＣＰＵＩＡに出
力される。この差ΔＶは、実際のクランプ力と最適クラ
ンプカとの偏差値を示すものであって、ＣＰＵ（ハ）に
ては、この差ΔＶをゼロにするための演算処理が行われ
、補正された制御信号８Ｂが再び電圧制御回路−に出力
され、前と同様のワイヤ（３）のクランプ操作が行われ
る。しかして、上述したクランプ力を最適値に設定する
ためのフィードバック処理は、ワイヤボンディング中、
終始一貫して行われる。First, wire bonding of the wire (3) to the lead frame U is disclosed according to a predetermined program stored in the CPU (a). Along with this, wire (3)
are sequentially paid out by the upper and lower clampers (91, (11). In other words, from the CPU@, a predetermined program 2
A control signal SB instructing a voltage value necessary to generate a predetermined clamping force is output to the voltage control circuit (to) according to the timing. Then, the voltage control circuit (2) outputs a control signal SC corresponding to the signal SB to the drive circuit. Then, the drive circuit applies a desired voltage to each actuator (w, oI), and as a result, the wire (3) is clamped by the clamping tool (3) with a clamping force corresponding to the applied voltage value. The clamping pressure generated during this clamping is detected by a pressure sensor, and an electric signal having a voltage value V indicating the clamping force is sent to the comparator circuit (c). Then, in this comparison circuit (c), the reference value Vo
A signal 8D indicating the difference Δ■ between the voltage value ■ and the voltage value ■ is output to the CPUIA. This difference ΔV indicates the deviation value between the actual clamping force and the optimum clamping force, and the CPU (c) performs arithmetic processing to make this difference ΔV zero, and performs the corrected control. Signal 8B is again output to the voltage control circuit, and the same clamping operation of the wire (3) as before is performed. Therefore, during wire bonding, the feedback process for setting the clamping force to the optimal value is
It is done consistently from start to finish.
以上のように、この実施例においては、圧力センサＱ４
により実際のクランプ力を検出し、得られた検出信号に
基づいてクランプ力が最適値をとるように７ヤードパツ
ク制御するようにしたので、ワイヤ（３）を繰り出した
り、保持したり、テンシ璽ンをかけたりするためのクラ
ンプ力の強弱を微調整することが可能となり、ワイヤの
材種９寸法等の変化に即応できるようになった。As described above, in this embodiment, the pressure sensor Q4
The actual clamping force is detected, and the 7-yard pack is controlled so that the clamping force takes the optimum value based on the obtained detection signal, so the wire (3) can be fed out, held, and tightened. It is now possible to finely adjust the strength of the clamping force applied, and it is now possible to immediately respond to changes in the wire material type and dimensions.
なお、上記実施例における圧力センサＱ４）の代りに、
荷重センサを用いてもよい。さらに、上記実施例におい
ては、圧力センサ（財）からの電気信号ＳＡに基づいて
、フィードバック制御する場合を例示しているが、第３
図に示すように、電気信号ＳＡに基づき検出したクラン
プカをシンクロスコープ（至）にうつし出し、必要なり
ランプ力が出ていない場合は、キーボード６１）から最
適クランプ力にするためのデータをＣＰＵＣＡにインプ
ットするようにしてもよい。Note that instead of the pressure sensor Q4) in the above embodiment,
A load sensor may also be used. Furthermore, in the above embodiment, the case where feedback control is performed based on the electrical signal SA from the pressure sensor (goods) is exemplified, but the third
As shown in the figure, the clamp force detected based on the electric signal SA is transmitted to the synchroscope (to), and if the required ramp force is not being generated, data for setting the optimum clamp force is sent to CPUCA from the keyboard 61). You may also input it.
本発明は、クランプ力検出手段により実際のクランプカ
を検出し、得られた検出信号に基づいてクランプカを最
適にするようにしている。その結果、クランプ力の強弱
の微調整が可能となり、ワイヤの材種２寸法等のクラン
プ条件の変化に即応した調整を行うことができるように
なった。とりわけ、ワイヤルーズの形成が安定化かつ適
正化し、半導体装置の製造歩留の低下要因の一つを解消
することができる。In the present invention, the actual clamper is detected by a clamping force detection means, and the clamper is optimized based on the obtained detection signal. As a result, it has become possible to finely adjust the strength of the clamping force, and it has become possible to make adjustments immediately in response to changes in clamping conditions such as the wire material type and dimensions. In particular, the formation of loose wires is stabilized and optimized, and one of the factors that reduce the manufacturing yield of semiconductor devices can be eliminated.
第１図は本発明の一実施例のワイヤボンディング装置の
構成図、第２図は同じくクランプ機構の説明図、第３図
は本発明の他の芙施例のワイヤポンディング装置のクラ
ンプ機構の説明図である。
（９） 、 （１１） ：クランパ（クランプ手段）。
（財）：圧力センサ（クランプ力検出手段）。
Ｈ： ＣＰＵ （クランプ力制御手段）。
代理人 弁理士 則 近 慧 佑
同 竹 花 喜久男
第１図
第２ｒＡ
館 ３ｖＡFIG. 1 is a configuration diagram of a wire bonding device according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a clamping mechanism, and FIG. 3 is a diagram of a clamping mechanism of a wire bonding device according to another embodiment of the present invention. It is an explanatory diagram. (9), (11): Clamper (clamping means). (Foundation): Pressure sensor (clamping force detection means). H: CPU (clamping force control means). Agent Patent Attorney Nori Kei Yudo Takehana Kikuo Figure 1 2rA Building 3vA
Claims (5)
結線するワイヤボンディング方法において、上記ワイヤ
をクランプして上記結線動作を行わせるクランプ工程と
、このクランプ工程におけるクランプ力を検出するクラ
ンプ力検出工程と、このクランプ力検出工程にて検出さ
れたクランプ力に基づいて上記クランプ力を調整するク
ランプ力調整工程とを有することを特徴とするワイヤボ
ンディング方法。(1) A wire bonding method in which a wire is used to connect an electrode of a semiconductor pellet to a lead terminal, including a clamping step in which the wire is clamped to perform the wiring operation, and a clamping force detection step in which the clamping force in this clamping step is detected. A wire bonding method comprising: a clamping force adjusting step of adjusting the clamping force based on the clamping force detected in the clamping force detecting step.
れたクランプ力を基準クランプ力と比較し、比較結果に
基づいて閉ループ制御により行うことを特徴とする特許
請求の範囲第１項記載のワイヤボンディング方法。(2) The wire according to claim 1, wherein the clamping force adjustment is performed by comparing the clamping force detected in the clamping force detection step with a reference clamping force, and performing closed loop control based on the comparison result. Bonding method.
結線するワイヤボンディング装置において、上記ワイヤ
を着脱自在に挾持してクランプするクランプ手段と、こ
のクランプ手段に取付けられ上記クランプ手段における
クランプ力を検出して上記クランプ力を示す検出信号を
出力するクランプ力検出手段と、上記検出信号に基づき
上記クランプ力を制御するクランプ力制御手段とを具備
することを特徴とするワイヤボンディング装置。(3) A wire bonding device that connects an electrode of a semiconductor pellet to a lead terminal using a wire, which includes a clamping device that removably clamps the wire, and a device that is attached to the clamping device and detects the clamping force in the clamping device. A wire bonding apparatus comprising: clamp force detection means for outputting a detection signal indicating the clamp force; and clamp force control means for controlling the clamp force based on the detection signal.
とを特徴とする特許請求の範囲第３項記載のワイヤボン
ディング装置。(4) The wire bonding apparatus according to claim 3, wherein the clamping means is a piezoelectric element actuator.
徴とする特許請求の範囲第３項記載のワイヤボンディン
グ装置。(5) The wire bonding apparatus according to claim 3, wherein the clamping force detection means is a pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25682086A JPH0738399B2 (en) | 1986-10-30 | 1986-10-30 | Wire bonding method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25682086A JPH0738399B2 (en) | 1986-10-30 | 1986-10-30 | Wire bonding method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63111634A true JPS63111634A (en) | 1988-05-16 |
| JPH0738399B2 JPH0738399B2 (en) | 1995-04-26 |
Family
ID=17297886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25682086A Expired - Lifetime JPH0738399B2 (en) | 1986-10-30 | 1986-10-30 | Wire bonding method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0738399B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268942A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Ind Co Ltd | Wire-clamping method and device |
| WO2017217385A1 (en) * | 2016-06-15 | 2017-12-21 | 株式会社新川 | Method for calibrating wire clamp device, and wire bonding device |
| WO2018038135A1 (en) * | 2016-08-23 | 2018-03-01 | 株式会社新川 | Wire clamp device calibration method and wire bonding device |
-
1986
- 1986-10-30 JP JP25682086A patent/JPH0738399B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268942A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Ind Co Ltd | Wire-clamping method and device |
| WO2017217385A1 (en) * | 2016-06-15 | 2017-12-21 | 株式会社新川 | Method for calibrating wire clamp device, and wire bonding device |
| TWI633609B (en) * | 2016-06-15 | 2018-08-21 | 日商新川股份有限公司 | Method for calibrating lead clamp device and wire bonding device |
| JPWO2017217385A1 (en) * | 2016-06-15 | 2019-04-04 | 株式会社新川 | Calibration method for wire clamp apparatus and wire bonding apparatus |
| US11257781B2 (en) | 2016-06-15 | 2022-02-22 | Shinkawa Ltd. | Method for calibrating wire clamp device |
| WO2018038135A1 (en) * | 2016-08-23 | 2018-03-01 | 株式会社新川 | Wire clamp device calibration method and wire bonding device |
| CN109863582A (en) * | 2016-08-23 | 2019-06-07 | 株式会社新川 | The calibration method and throwing device of wire-clamping device |
| JPWO2018038135A1 (en) * | 2016-08-23 | 2019-06-24 | 株式会社新川 | Method of calibrating wire clamp apparatus and wire bonding apparatus |
| US11004822B2 (en) | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire clamp apparatus calibration method and wire bonding apparatus |
| CN109863582B (en) * | 2016-08-23 | 2023-05-30 | 株式会社新川 | Calibration method of wire clamping device and wire bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0738399B2 (en) | 1995-04-26 |
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