JPH01245532A - Wire clamp mechanism - Google Patents
Wire clamp mechanismInfo
- Publication number
- JPH01245532A JPH01245532A JP63072731A JP7273188A JPH01245532A JP H01245532 A JPH01245532 A JP H01245532A JP 63072731 A JP63072731 A JP 63072731A JP 7273188 A JP7273188 A JP 7273188A JP H01245532 A JPH01245532 A JP H01245532A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- piezoelectric element
- clamp
- movable plate
- clamp plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 claims abstract description 12
- 229920001971 elastomer Polymers 0.000 abstract 2
- 239000000806 elastomer Substances 0.000 abstract 2
- 230000001133 acceleration Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
この発明はワイヤボンディング装置、コイル巻線機、溶
接機等に装備されるワイヤクランプ機構に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a wire clamp mechanism installed in a wire bonding device, a coil winding machine, a welding machine, etc.
（従来の技術）
半導体の組立などに使用するワイヤボンディング装置は
、ワイヤをクランプして繰出したり前記ワイヤに張力を
付加したりなどするワイヤクランプ機構を備えている。(Prior Art) A wire bonding device used for semiconductor assembly etc. is equipped with a wire clamp mechanism that clamps and feeds out a wire, applies tension to the wire, and the like.
この従来のワイヤクランプ機構としては、クランプ可動
板の開閉駆動源にモータを用いる特開昭８２−１１９９
３２号公報に開示のもの、クランプ可動板の開閉駆動源
にソレノイドを用いる添附図面第３図に示したような構
造のものが知られている。This conventional wire clamp mechanism uses a motor as the drive source for opening and closing the movable clamp plate.
The structure disclosed in Japanese Patent No. 32 and the structure shown in FIG. 3 of the attached drawings, which use a solenoid as the drive source for opening and closing the movable clamp plate, are known.
第３図に示した従来のワイヤクランプ機構は、先端にワ
イヤ挟持片６を有し中間支軸１ａを回動支点としてソレ
ノイド５により開き方向に作動されるクランプ可動板１
と、このクランプ可動板１に対向する固定板３と、先端
にクランプ可動板１のワイヤ挟持片６と対向するワイヤ
挟持片７を有しワイヤクランプ時の衝撃を緩和する間隙
をもって前記固定板３に取付けられた板バネ２と、クラ
ンブ可動板１を閉じ方向に付勢する圧縮バネ４とを具備
し、ワイヤ挟持片６．７の間に挿通されたワイヤＷをク
ランプ可動板１の閉じ作用でワイヤ挟持片６．７間に挟
持してクランプするように構成されている。The conventional wire clamp mechanism shown in FIG. 3 has a movable clamp plate 1 which has a wire clamping piece 6 at its tip and is operated in the opening direction by a solenoid 5 with an intermediate support shaft 1a as a pivot point.
, a fixed plate 3 facing the movable clamp plate 1, and a wire clamping piece 7 facing the wire clamping piece 6 of the movable clamp plate 1 at the tip thereof, and the fixed plate 3 having a gap to reduce the impact when clamping the wire. A compression spring 4 that biases the clamp movable plate 1 in the closing direction is provided, and the wire W inserted between the wire clamping pieces 6. It is configured to be held and clamped between the wire holding pieces 6 and 7.
（発明が解決しようとする課題）
前記従来のワイヤクランプ機構は、クランプ可動板１の
開閉をモータやソレノイド等で行なうので、クランプ機
構が大型で重くなり、ワイヤボンディング装置に利用す
る場合（ツールアームの先端に固定して使用する）には
、ＤＣモータ等のアーム駆動源の負荷が大きくなって、
装置全体のインデックス時間が遅くなるという問題があ
る。(Problems to be Solved by the Invention) In the conventional wire clamp mechanism, the movable clamp plate 1 is opened and closed by a motor, a solenoid, etc., so the clamp mechanism is large and heavy. (fixed to the tip of the arm), the load on the arm drive source such as a DC motor increases,
There is a problem that the indexing time of the entire device becomes slow.
しかも、前記従来のワイヤクランプ機構は一定のクラン
プ力しか出すことができず、クランプ力の変更の際には
クランプ機構そのものを変更しなければならない問題が
あった。Moreover, the conventional wire clamp mechanism can only produce a fixed clamping force, and when changing the clamping force, the clamping mechanism itself has to be changed.
この発明の目的はクランプ力を容易に変更でき、しかも
インデックス時間の高速化に有効な小型・軽量で応答性
の速いワイヤクランプ機構を提供することにある。An object of the present invention is to provide a small, lightweight, and quick-response wire clamping mechanism that allows the clamping force to be easily changed and is effective in speeding up the indexing time.
（課題を解決するための手段）
この発明は前記の目的を達成するために、一対のワイヤ
挟持片の間に挿通されるワイヤをクランプ可動板の閉じ
作用によってクランプするようにしたワイヤクランプ機
構において、クランプ可動板の開閉駆動源として電圧の
印加により長さ方向に微小変位する圧電素子を用い、こ
の圧電素子とクランプ可動板との間に圧電素子の微小変
位量をてこの原理で拡大してクランプ可動板を開き方向
または閉じ方向に作動させるリンク機構を設けると共に
、クランプ可動板を閉じ方向または開き方向に付勢する
弾性体と、この弾性体を調整しワイヤクランプ力を変更
させるクランプ力制御部を設けたことを特徴とする。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a wire clamping mechanism in which a wire inserted between a pair of wire clamping pieces is clamped by the closing action of a movable clamp plate. , a piezoelectric element that can be slightly displaced in the length direction by the application of voltage is used as the driving source for opening and closing the movable clamp plate, and the minute displacement of the piezoelectric element is magnified by the principle of leverage between this piezoelectric element and the movable clamp plate. A link mechanism that operates the movable clamp plate in the opening or closing direction is provided, an elastic body that biases the movable clamp plate in the closing or opening direction, and a clamp force control that adjusts this elastic body to change the wire clamping force. It is characterized by having a section.
（作用）
前記構成のワイヤクランプ機構は、圧電素子に電圧を印
加すると、この圧電素子が長さ方向に微小変位し、この
圧電素子の微小変位量がリンク機構で数十倍に拡大され
てクランプ可動板を開き方向または閉じ方向に作動させ
る。また、圧電素子の電源駆動部をＯＦＦにすると、圧
電素子は元の長さに瞬時に復帰し、これと同時にクラン
プ可動板が弾性体の付勢力で閉じ方向または開き方向に
作動する。そして、クランプ可動板が閉じた時に一対の
ワイヤ挟持片でワイヤを挟んでクランプし、またクラン
プ可動板が開いた時に前記ワイヤのクランプを解除する
ようになる。(Function) In the wire clamp mechanism configured as described above, when a voltage is applied to the piezoelectric element, this piezoelectric element is slightly displaced in the length direction, and the link mechanism magnifies the amount of this minute displacement several tens of times, thereby clamping the piezoelectric element. Operate the movable plate in the opening or closing direction. Further, when the power supply driving section of the piezoelectric element is turned off, the piezoelectric element instantly returns to its original length, and at the same time, the clamp movable plate is operated in the closing direction or opening direction by the biasing force of the elastic body. When the movable clamp plate is closed, the wire is clamped between the pair of wire clamping pieces, and when the movable clamp plate is opened, the wire is unclamped.
（実施例）
以下、この発明の第１の実施例を第１図に従い説明する
。図中１は先端にワイヤ挟持片６を有したクランプ可動
板、３はクランプ可動板１に離間して対向する固定板、
２は先端にクランプ可動板１のワイヤ挟持片６と対向す
るワイヤ挟持片７を有しワイヤクランプ時の衝撃を緩和
する間隙をもって前記固定板３に取付けられた板バネで
、この板バネ先端のワイヤ挟持片７とクランプ可動板１
先端のワイヤ挟持片６との間に挿通されるワイヤＷをク
ランプ可動板１の閉じ作用でクランプするように構成さ
れている。(Example) A first example of the present invention will be described below with reference to FIG. In the figure, 1 is a movable clamp plate having a wire clamping piece 6 at its tip; 3 is a fixed plate facing the movable clamp plate 1 at a distance;
Reference numeral 2 denotes a leaf spring having a wire clamping piece 7 opposite to the wire clamping piece 6 of the movable clamp plate 1 at the tip, and is attached to the fixed plate 3 with a gap to reduce the impact when clamping the wire. Wire clamping piece 7 and clamp movable plate 1
The movable clamp plate 1 is configured to clamp the wire W inserted between it and the wire clamping piece 6 at the tip by the closing action of the movable clamp plate 1.
ＩＯはクランプ可動板１の開閉駆動源としての圧電素子
で、この圧電素子ｌＯは固定部１１内に固定され、外部
の電源駆動部１２より電圧の印加すると、長さ方向に僅
かに伸びるように微小変位する。１３はこの圧電素子Ｉ
Ｏの微小変位量を、てこの原理を利用して数十倍例えば
３０倍位に拡大し、クランプ可動板１を開き方向に作動
させるリンク機構で、このリンク機構１３は弾性変形可
能な切欠ヒンジ部Ａ、Ａ’ 、Ｂ、Ｂ’ を支点として
図示矢印方向にリンク作動される一対の差動リンク１３
ａ 、 １３ｂで構成されている。１４はクランプ可動
板１を閉じ方向に付勢する引張バネ等の弾性体、１５は
この弾性体１４の弾性力を調整しワイヤクランプ力を変
更させるクランプ力制御部である。IO is a piezoelectric element that serves as an opening/closing drive source for the movable clamp plate 1. This piezoelectric element IO is fixed in the fixed part 11, and when a voltage is applied from an external power supply drive part 12, it expands slightly in the length direction. Small displacement. 13 is this piezoelectric element I
This is a link mechanism that uses the lever principle to magnify the minute displacement of O by several tens of times, for example, 30 times, and operates the movable clamp plate 1 in the opening direction.This link mechanism 13 is an elastically deformable notch hinge. A pair of differential links 13 that are operated in the direction of the arrow shown with parts A, A', B, and B' as fulcrums.
It is composed of a, 13b. 14 is an elastic body such as a tension spring that biases the movable clamp plate 1 in the closing direction, and 15 is a clamp force control unit that adjusts the elastic force of the elastic body 14 to change the wire clamping force.
而して、前記構成のワイヤクランプ機構は、固定部１１
に固定された圧電素子ＩＯを電源駆動部１２からの電圧
印加により長さ方向に微小変位させると、差動リンク１
３ａ 、 １３ｂが切欠ヒンジ部Ａ、Ａ’ 。Thus, the wire clamp mechanism having the above configuration has the fixed part 11
When the piezoelectric element IO fixed to the
3a and 13b are notch hinge parts A and A'.
Ｂ、Ｂ’を支点にして図示矢印で示す方向にリンり作動
し、このリンク作動で圧電素子１０の微小変位量か数十
倍に拡大されて、クランプ可動板１を開き方向に作動さ
せる。A linking operation is performed in the direction shown by the arrow in the figure using B and B' as fulcrums, and this linking operation magnifies the minute displacement of the piezoelectric element 10 by several tens of times, thereby operating the movable clamp plate 1 in the opening direction.
前記ワイヤＷをクランプする場合は、クランプ可動板１
の開き状態で圧電素子１０の電源駆動部１２をＯＦＦに
すると、圧電素子１０が元の長さに瞬時に復帰すると同
時にクランプ可動板１が弾性体■４で引張られて閉じ、
クランプ可動板１の復元力と弾性体■４の付勢力とで決
定されたクランプ力でワイヤＷをワイヤ挟持片６，７の
間に挟んでクランプする。なお、このワイヤクランプ時
の衝撃は板バネ２により吸収されるので、衝撃によって
前記ワイヤＷが変形したりすることもない。When clamping the wire W, the clamp movable plate 1
When the power drive section 12 of the piezoelectric element 10 is turned off in the open state, the piezoelectric element 10 instantly returns to its original length, and at the same time, the movable clamp plate 1 is pulled by the elastic body 4 and closed.
The wire W is clamped between the wire clamping pieces 6 and 7 with a clamping force determined by the restoring force of the movable clamp plate 1 and the biasing force of the elastic body 4. Incidentally, since the impact upon clamping the wire is absorbed by the leaf spring 2, the wire W will not be deformed by the impact.
第２図は本発明の第２の実施例に係わる両開き式のワイ
ヤクランプ機構を示すもので、図中１゜１′は開閉可能
な一対のクランプ可動板であり、一方のクランプ可動板
１の先端にはワイヤ挟持片６か固定され、他方のクラン
プ可動板１′の先端部にはクランプ可動板１のワイヤ挟
持片６と対向するワイヤ挟持片７を有した仮バネ２がワ
イヤクランプ時の衝撃を緩和する間隙をもって取付けら
れ、この板バネ先端のワイヤ挟持片７とクランプ可動板
１先端のワイヤ挟持片６との間に挿通されるワイヤＷを
クランプ可動板１，１′の閉じ作用 −でクランプする
ように構成されている。FIG. 2 shows a double-opening wire clamp mechanism according to a second embodiment of the present invention. In the figure, reference numeral 1°1' indicates a pair of movable clamp plates that can be opened and closed. A temporary spring 2 has a wire clamping piece 6 fixed at its tip, and a wire clamping piece 7 facing the wire clamping piece 6 of the clamp movable plate 1 at the tip of the other movable clamp plate 1'. A closing action of the clamp movable plates 1, 1' is applied to the wire W, which is attached with a gap to reduce the impact and is inserted between the wire clamping piece 7 at the tip of this leaf spring and the wire clamping piece 6 at the tip of the clamp movable plate 1. It is configured to be clamped with.
ｌＯはクランプ可動板１．１′の開閉駆動源としての圧
電素子で、この圧電素子ｌＯは前記実施例と同様に固定
部ｌｌ内に固定され、外部の電源駆動部１２より電圧を
印加すると、長さ方向に僅かに伸びるように微小変位す
る。１３はこの圧電素子１０の微小変位量を、てこの原
理を利用して数十倍に拡大し、クランプ可動板１．１′
を開き方向に作動させるリンク機構で、このリンク機構
１３は弾性変形可能な切欠ヒンジ部Ａ−Ｃ，Ａ’ 〜Ｃ
′を支点として図示矢印方向に同じ動き量でリンク作動
される一対の共動リンク１３ｃ 、 １３ｄで構成され
ている。1O is a piezoelectric element as a driving source for opening and closing the movable clamp plate 1.1', and this piezoelectric element 1O is fixed in the fixed part 11 as in the previous embodiment, and when a voltage is applied from the external power supply drive part 12, It is slightly displaced so that it stretches slightly in the length direction. 13 expands the minute displacement of the piezoelectric element 10 by several tens of times using the lever principle, and clamps the movable plate 1.1'.
This link mechanism 13 has elastically deformable cutout hinge parts A-C, A' to C.
It is composed of a pair of cooperating links 13c and 13d which are linked by the same amount of movement in the direction of the arrow shown in the figure with the fulcrum point ``.
１４はクランプ可動板１．１′を閉じ方向に付勢する弾
性体、１５はこの弾性体１４の弾性力を調整しワイヤク
ランプ力を変更させるクランプ力制御部である。Reference numeral 14 designates an elastic body that urges the movable clamp plate 1.1' in the closing direction, and reference numeral 15 designates a clamping force control unit that adjusts the elastic force of the elastic body 14 to change the wire clamping force.
而して、前記構成のワイヤクランプ機構は、固定部１１
に固定された圧電素子ＩＯを電源駆動部１２からの電圧
印加により長さ方向に微小変位させると、共動リンク１
３ｃ 、 １３ｄが切欠ヒンジ部Ａ−Ｃ。Thus, the wire clamp mechanism having the above configuration has the fixed part 11
When the piezoelectric element IO fixed to
3c and 13d are notched hinge parts A-C.
Ａ′〜Ｃ′を支点にして図示矢印で示す方向にリンク作
動し、このリンク作動で圧電素子ＩＯの微小変位量が数
十倍に拡大されて、クランプ可動板１゜１′を開き方向
に作動させる。Using A' to C' as fulcrums, the link operates in the direction indicated by the arrow in the figure, and this link operation magnifies the minute displacement of the piezoelectric element IO by several tens of times, moving the clamp movable plate 1°1' in the opening direction. Activate.
前記ワイヤＷをクランプする場合は、クランプ可動板１
，１′の開き状態で圧電索子１０の電源駆動部１２をＯ
ＦＦにすると、圧電素子１０が元の長さに瞬時に復帰す
ると同時にクランプ可動板１゜１′が弾性体１４で引張
られて閉じ、クランプ可動ｌｆ１．１’ の復元力と弾
性体１４の付勢力とで決定されたクランプ力でワイヤＷ
をワイヤ挟持片６゜７の間に挟んでクランプする（この
時の衝撃は板バネ２により吸収される）。When clamping the wire W, the clamp movable plate 1
, 1' are open and the power supply drive section 12 of the piezoelectric cable 10 is turned to O.
When set to FF, the piezoelectric element 10 instantly returns to its original length, and at the same time, the movable clamp plate 1°1' is pulled and closed by the elastic body 14, and the restoring force of the movable clamp lf1.1' and the attachment of the elastic body 14 are combined. Wire W with the clamping force determined by the force and
is clamped between the wire clamping pieces 6°7 (the impact at this time is absorbed by the leaf spring 2).
なお、前記実施例では圧電素子が長さ方向に微小変位す
る際に、クランプ可動板が開くリンク機構になっている
が、圧電素子が長さ方向に微小変位する際に、クランプ
可動板が閉じるリンク機構としても実施可能である。こ
の場合には、クランプ可動板を弾性体で開き方向に付勢
し、この弾性体をクランプ力制御部で調整することによ
り、クランプ力を変更できるようにする。In the above embodiment, the movable clamp plate opens when the piezoelectric element is slightly displaced in the length direction, but the movable clamp plate closes when the piezoelectric element is slightly displaced in the length direction. It can also be implemented as a link mechanism. In this case, the clamp movable plate is biased in the opening direction by an elastic body, and the clamp force is adjusted by the clamp force control section, thereby making it possible to change the clamp force.
本発明のワイヤクランプ機構は、クランプ可動板の開閉
駆動源として電圧の印加により長さ方向に微小変位する
圧電素子を用い、この圧電素子の微小変位量をリンク機
構で拡大してクランプ可動板を作動させるように構成し
ているので、クランプ機構全体をインデックス時間の高
速化に有効な小型・軽量で応答性の速いものにすること
ができる。しかも、圧電素子を駆動源に用いたワイヤク
ランプ機構は、圧電素子によるクランプ力は一定である
が、クランプ可動板を付勢する弾性体をクランプ力制御
部で調整することにより、容易にクランプ力を変更する
ことができ、クランプ力の変更の際にクランプ機構その
ものを変更しなければならないという従来の問題を解消
することができる。The wire clamp mechanism of the present invention uses a piezoelectric element that makes a small displacement in the length direction by applying a voltage as the driving source for opening and closing the movable clamp plate, and uses a link mechanism to magnify the minute displacement of this piezoelectric element to open and close the movable clamp plate. Since the clamp mechanism is configured to operate, the entire clamp mechanism can be made compact, lightweight, and quick in response, which is effective in speeding up the indexing time. Moreover, in the wire clamp mechanism that uses a piezoelectric element as a drive source, the clamping force due to the piezoelectric element is constant, but the clamping force can be easily adjusted by adjusting the elastic body that biases the movable clamp plate with the clamping force control unit. This eliminates the conventional problem of having to change the clamping mechanism itself when changing the clamping force.
第１図は本発明の第１の実施例によるワイヤクランプ機
構をワイヤクランプ状態で示した平面図、第２図は本発
明の第２の実施例によるワイヤクランプ機構をワイヤク
ランプ状態で示した平面図、第３図は従来のワイヤクラ
ンプ機構をクランプ解除の状態で示した平面図である。
Ｗ・・・ワイヤ、１．１’ ・・・クランプ可動板、２
・・・板バネ、３・・・固定板、６．７・・・ワイヤ挟
持片、ＩＯ・・・圧電素子、１１・・・素子固定部、１
２・・・電源駆動部、１３・・・リンク機構、１３ａ
、 １３ｂ・・・差動リンク、Ｈｅ 、 １３ｄ−・・
共動リンク、Ａ−Ｃ，Ａ’ 〜Ｃ’ ・・・リンク支点
となる切欠ヒンジ部、１４・・・弾性体、１５・・・ク
ランプ力制御部。
出願人代理人 弁理士 鈴江武彦
第１図
第２図
第３図FIG. 1 is a plan view showing a wire clamp mechanism according to a first embodiment of the present invention in a wire clamp state, and FIG. 2 is a plan view showing a wire clamp mechanism according to a second embodiment of the present invention in a wire clamp state. FIG. 3 is a plan view showing a conventional wire clamp mechanism in an unclamped state. W... Wire, 1.1'... Clamp movable plate, 2
...Plate spring, 3...Fixing plate, 6.7...Wire clamping piece, IO...Piezoelectric element, 11...Element fixing part, 1
2... Power drive unit, 13... Link mechanism, 13a
, 13b...differential link, He, 13d-...
Cooperative link, A-C, A' to C'... Notch hinge portion serving as a link fulcrum, 14... Elastic body, 15... Clamping force control unit. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 3
Claims (1)
プ可動板の閉じ作用によってクランプするようにしたワ
イヤクランプ機構において、クランプ可動板の開閉駆動
源として電圧の印加により長さ方向に微小変位する圧電
素子を用い、この圧電素子とクランプ可動板との間に圧
電素子の微小変位量をてこの原理で拡大してクランプ可
動板を開き方向または閉じ方向に作動させるリンク機構
を設けると共に、クランプ可動板を閉じ方向または開き
方向に付勢する弾性体と、この弾性体を調整しワイヤク
ランプ力を変更させるクランプ力制御部を設けたことを
特徴とするワイヤクランプ機構。In a wire clamp mechanism in which a wire inserted between a pair of wire clamping pieces is clamped by the closing action of a movable clamp plate, a piezoelectric material that is slightly displaced in the length direction by the application of voltage is used as the driving source for opening and closing the movable clamp plate. A link mechanism is provided between the piezoelectric element and the movable clamp plate to operate the movable clamp plate in the opening direction or the closing direction by magnifying the minute displacement of the piezoelectric element using the principle of leverage. 1. A wire clamping mechanism comprising: an elastic body that biases the wire in a closing direction or an opening direction; and a clamping force control section that adjusts the elastic body to change the wire clamping force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63072731A JPH01245532A (en) | 1988-03-26 | 1988-03-26 | Wire clamp mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63072731A JPH01245532A (en) | 1988-03-26 | 1988-03-26 | Wire clamp mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01245532A true JPH01245532A (en) | 1989-09-29 |
Family
ID=13497793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63072731A Pending JPH01245532A (en) | 1988-03-26 | 1988-03-26 | Wire clamp mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01245532A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268942A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Ind Co Ltd | Wire-clamping method and device |
| US5746422A (en) * | 1995-09-13 | 1998-05-05 | Kabushiki Kaisha Shinkawa | Clamping device |
| KR100250869B1 (en) * | 1996-02-15 | 2000-04-01 | 후지야마 겐지 | Wire cutting supply apparatus for wire bonding device |
| JP2002517910A (en) * | 1998-06-09 | 2002-06-18 | ヘッセ・ウント・クニップス・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | Feed unit for moving parts |
| US11004822B2 (en) * | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire clamp apparatus calibration method and wire bonding apparatus |
| US11257781B2 (en) * | 2016-06-15 | 2022-02-22 | Shinkawa Ltd. | Method for calibrating wire clamp device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106579A (en) * | 1974-01-09 | 1975-08-22 | ||
| JPS57159034A (en) * | 1981-03-27 | 1982-10-01 | Hitachi Ltd | Wire clamping device |
-
1988
- 1988-03-26 JP JP63072731A patent/JPH01245532A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50106579A (en) * | 1974-01-09 | 1975-08-22 | ||
| JPS57159034A (en) * | 1981-03-27 | 1982-10-01 | Hitachi Ltd | Wire clamping device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0268942A (en) * | 1988-09-02 | 1990-03-08 | Matsushita Electric Ind Co Ltd | Wire-clamping method and device |
| US5746422A (en) * | 1995-09-13 | 1998-05-05 | Kabushiki Kaisha Shinkawa | Clamping device |
| KR100250869B1 (en) * | 1996-02-15 | 2000-04-01 | 후지야마 겐지 | Wire cutting supply apparatus for wire bonding device |
| JP2002517910A (en) * | 1998-06-09 | 2002-06-18 | ヘッセ・ウント・クニップス・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | Feed unit for moving parts |
| US11257781B2 (en) * | 2016-06-15 | 2022-02-22 | Shinkawa Ltd. | Method for calibrating wire clamp device |
| US11004822B2 (en) * | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire clamp apparatus calibration method and wire bonding apparatus |
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