JPS5683042A - Wire clamping system of wire bonder - Google Patents

Wire clamping system of wire bonder

Info

Publication number
JPS5683042A
JPS5683042A JP16002579A JP16002579A JPS5683042A JP S5683042 A JPS5683042 A JP S5683042A JP 16002579 A JP16002579 A JP 16002579A JP 16002579 A JP16002579 A JP 16002579A JP S5683042 A JPS5683042 A JP S5683042A
Authority
JP
Japan
Prior art keywords
wire
capillary
bonder
arm
introducing outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16002579A
Other languages
Japanese (ja)
Other versions
JPS5856257B2 (en
Inventor
Satoru Imai
Hiroshi Niikura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54160025A priority Critical patent/JPS5856257B2/en
Publication of JPS5683042A publication Critical patent/JPS5683042A/en
Publication of JPS5856257B2 publication Critical patent/JPS5856257B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate the cutting of wire in the wire bonder by the application of radical tension to the wire by a method wherein the wire introducing outlet and the capillary of a wire tension control mechanism are made to be driven together. CONSTITUTION:A swingable arm 15 and an arm 16 being provided with a pull cut clamp 6 at one end are equipped to a bonding head 2, the wire introducing outlet 5 and the capillary 8 are provided at the tip of the arm 15, and another end is made to come in contact with a detecting element 12 of a detector 11 and a plate spring 14. The wire 9 being formed a ball 10 at the tip is made to penetrate rectilineally through the wire introducing outlet 5, the pull cut clamp 6 and the capillary 8 in this order. By this way, the interval between the wire introducing outlet 5 and the capillary 8 is kept to be constant not with standing the driving of the wire bonder, and because the sag of the wire is eliminated so that the cutting of the wire to be caused by the application of radical shock can be eliminated.
JP54160025A 1979-12-10 1979-12-10 Wire bonder wire clamp method Expired JPS5856257B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54160025A JPS5856257B2 (en) 1979-12-10 1979-12-10 Wire bonder wire clamp method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54160025A JPS5856257B2 (en) 1979-12-10 1979-12-10 Wire bonder wire clamp method

Publications (2)

Publication Number Publication Date
JPS5683042A true JPS5683042A (en) 1981-07-07
JPS5856257B2 JPS5856257B2 (en) 1983-12-14

Family

ID=15706331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54160025A Expired JPS5856257B2 (en) 1979-12-10 1979-12-10 Wire bonder wire clamp method

Country Status (1)

Country Link
JP (1) JPS5856257B2 (en)

Also Published As

Publication number Publication date
JPS5856257B2 (en) 1983-12-14

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