JPS57206039A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS57206039A
JPS57206039A JP56090555A JP9055581A JPS57206039A JP S57206039 A JPS57206039 A JP S57206039A JP 56090555 A JP56090555 A JP 56090555A JP 9055581 A JP9055581 A JP 9055581A JP S57206039 A JPS57206039 A JP S57206039A
Authority
JP
Japan
Prior art keywords
wire
capillary
rotary ring
spool
rotated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56090555A
Other languages
Japanese (ja)
Other versions
JPS6231821B2 (en
Inventor
Kazuo Sugiura
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56090555A priority Critical patent/JPS57206039A/en
Publication of JPS57206039A publication Critical patent/JPS57206039A/en
Publication of JPS6231821B2 publication Critical patent/JPS6231821B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the configuration of a wire loop and bondability by providing a rotary ring, which is rotated in the reverse direction with respect to the wire drawing direction at the intermediate part between a spool and a capillary and has a wire sucking hole at the outer surface and imparting tension to the wire. CONSTITUTION:The wire 13 drawn from a spool 12 is inserted into a glass guide 14, contacted with the outer surface of the rotary ring of a rotary sucking device 20, and guided to the capillary 15 through a clamper 17. Then a ball 13a is formed at the tip. The capillary 15 is moved up and down and a bonding head 10 is horizontally moved. The wire is connected to the first bonding point and the second bonding point. At this time, the rotary ring of the device 20 is rotated in the reverse direction B with respect to the drawing direction A of the wire 13. Therefore the wire 13 is always pulled in the direction of an arrow C between the device 20 and the capillary 15 by the frictional force of the wire 13 and the device 20. When the capillary 15 is lifted, the wire 13 is pulled to the same direction C as the rotating direction B. Therefore slackening is not yielded and the suitable tension is always inparted to the wire 13.
JP56090555A 1981-06-12 1981-06-12 Wire bonding device Granted JPS57206039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56090555A JPS57206039A (en) 1981-06-12 1981-06-12 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56090555A JPS57206039A (en) 1981-06-12 1981-06-12 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS57206039A true JPS57206039A (en) 1982-12-17
JPS6231821B2 JPS6231821B2 (en) 1987-07-10

Family

ID=14001649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56090555A Granted JPS57206039A (en) 1981-06-12 1981-06-12 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS57206039A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016803A (en) * 1988-11-01 1991-05-21 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525265A (en) * 1975-07-02 1977-01-14 Hitachi Ltd Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS525265A (en) * 1975-07-02 1977-01-14 Hitachi Ltd Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016803A (en) * 1988-11-01 1991-05-21 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Also Published As

Publication number Publication date
JPS6231821B2 (en) 1987-07-10

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