JPS57155739A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS57155739A
JPS57155739A JP56041118A JP4111881A JPS57155739A JP S57155739 A JPS57155739 A JP S57155739A JP 56041118 A JP56041118 A JP 56041118A JP 4111881 A JP4111881 A JP 4111881A JP S57155739 A JPS57155739 A JP S57155739A
Authority
JP
Japan
Prior art keywords
load
wire
plunger
bonding tool
solenoid coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56041118A
Other languages
Japanese (ja)
Other versions
JPS6341217B2 (en
Inventor
Haruo Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56041118A priority Critical patent/JPS57155739A/en
Publication of JPS57155739A publication Critical patent/JPS57155739A/en
Publication of JPS6341217B2 publication Critical patent/JPS6341217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To permit the connection of a wire without applying damage to a bonded member side and without decreasing wire strength by a method wherein the load of a bonding tool is increased at the initial stage and then, the load is decreased to the optimum value. CONSTITUTION:Load transfer is performed by stopping current application to a solenoid coil 5. Now, with a current applied to the solenoid coil 5, a plunger 8 moves left to engage an arm 9 with a stopper 10. The present load of a bonding tool 3 is decided by the plunger attraction force of the solenoid coil 5. The initial high load shortens attenuation time for wire vibration and when current application is stopped at an attenuation point, the plunger 8 is released and the load of the bonding tool 3 depends on a balance coil spring 6 only to provide the wire with the optimum load.
JP56041118A 1981-03-20 1981-03-20 Wire bonding method Granted JPS57155739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56041118A JPS57155739A (en) 1981-03-20 1981-03-20 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56041118A JPS57155739A (en) 1981-03-20 1981-03-20 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS57155739A true JPS57155739A (en) 1982-09-25
JPS6341217B2 JPS6341217B2 (en) 1988-08-16

Family

ID=12599536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56041118A Granted JPS57155739A (en) 1981-03-20 1981-03-20 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS57155739A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101039A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Wire bonding method and device therefor
JPH0758142A (en) * 1994-04-22 1995-03-03 Hitachi Ltd Wire bonding device
US6786392B2 (en) 2001-11-27 2004-09-07 Nec Electronics Corporation Wire bonding device and wire bonding method
US7353976B2 (en) 2004-09-30 2008-04-08 Unaxis International Trading Ltd. Wire bonder
JP2009152480A (en) * 2007-12-21 2009-07-09 Shinapex Co Ltd Wire bonding device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61101039A (en) * 1984-10-24 1986-05-19 Hitachi Ltd Wire bonding method and device therefor
JPH0530058B2 (en) * 1984-10-24 1993-05-07 Hitachi Ltd
JPH0758142A (en) * 1994-04-22 1995-03-03 Hitachi Ltd Wire bonding device
US6786392B2 (en) 2001-11-27 2004-09-07 Nec Electronics Corporation Wire bonding device and wire bonding method
US7353976B2 (en) 2004-09-30 2008-04-08 Unaxis International Trading Ltd. Wire bonder
JP2009152480A (en) * 2007-12-21 2009-07-09 Shinapex Co Ltd Wire bonding device

Also Published As

Publication number Publication date
JPS6341217B2 (en) 1988-08-16

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