JPS5588364A - Method of arranging lead frame in molding die - Google Patents
Method of arranging lead frame in molding dieInfo
- Publication number
- JPS5588364A JPS5588364A JP15987678A JP15987678A JPS5588364A JP S5588364 A JPS5588364 A JP S5588364A JP 15987678 A JP15987678 A JP 15987678A JP 15987678 A JP15987678 A JP 15987678A JP S5588364 A JPS5588364 A JP S5588364A
- Authority
- JP
- Japan
- Prior art keywords
- lines
- lead frame
- long series
- composites
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To reduce the equipment cost of a molding device by arranging specified length lead frames in two lines.
CONSTITUTION: Long series of lead frame specified length composites 6a and 6b are arranged in two parallel lines at a distance d opposing across a col 8 along the matching face of a die 7. The long series of lead frame composites 6a and 6b are arranged and transferred in two lines at a distance d in each assembly processes of pellets and wire bonding, held in prescribed positions by a frame holder 12 and resin molded. By so doing, the long series of lead frames can be molded in one shot and introduced into the die arranged in two lines, therefore, automatic aligning jig becomes unnecessary, the device is simplified and can be made at low cost.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15987678A JPS6028386B2 (en) | 1978-12-27 | 1978-12-27 | Lead frame placement method inside the mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15987678A JPS6028386B2 (en) | 1978-12-27 | 1978-12-27 | Lead frame placement method inside the mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5588364A true JPS5588364A (en) | 1980-07-04 |
JPS6028386B2 JPS6028386B2 (en) | 1985-07-04 |
Family
ID=15703126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15987678A Expired JPS6028386B2 (en) | 1978-12-27 | 1978-12-27 | Lead frame placement method inside the mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6028386B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04217778A (en) * | 1990-12-19 | 1992-08-07 | Misako Takase | Umbrella dewatering method and device thereof |
-
1978
- 1978-12-27 JP JP15987678A patent/JPS6028386B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6028386B2 (en) | 1985-07-04 |
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