JPS5588364A - Method of arranging lead frame in molding die - Google Patents

Method of arranging lead frame in molding die

Info

Publication number
JPS5588364A
JPS5588364A JP15987678A JP15987678A JPS5588364A JP S5588364 A JPS5588364 A JP S5588364A JP 15987678 A JP15987678 A JP 15987678A JP 15987678 A JP15987678 A JP 15987678A JP S5588364 A JPS5588364 A JP S5588364A
Authority
JP
Japan
Prior art keywords
lines
lead frame
long series
composites
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15987678A
Other languages
Japanese (ja)
Other versions
JPS6028386B2 (en
Inventor
Takeshi Shimizu
Tsutomu Mimata
Masakazu Ozawa
Osamu Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15987678A priority Critical patent/JPS6028386B2/en
Publication of JPS5588364A publication Critical patent/JPS5588364A/en
Publication of JPS6028386B2 publication Critical patent/JPS6028386B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the equipment cost of a molding device by arranging specified length lead frames in two lines.
CONSTITUTION: Long series of lead frame specified length composites 6a and 6b are arranged in two parallel lines at a distance d opposing across a col 8 along the matching face of a die 7. The long series of lead frame composites 6a and 6b are arranged and transferred in two lines at a distance d in each assembly processes of pellets and wire bonding, held in prescribed positions by a frame holder 12 and resin molded. By so doing, the long series of lead frames can be molded in one shot and introduced into the die arranged in two lines, therefore, automatic aligning jig becomes unnecessary, the device is simplified and can be made at low cost.
COPYRIGHT: (C)1980,JPO&Japio
JP15987678A 1978-12-27 1978-12-27 Lead frame placement method inside the mold Expired JPS6028386B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15987678A JPS6028386B2 (en) 1978-12-27 1978-12-27 Lead frame placement method inside the mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15987678A JPS6028386B2 (en) 1978-12-27 1978-12-27 Lead frame placement method inside the mold

Publications (2)

Publication Number Publication Date
JPS5588364A true JPS5588364A (en) 1980-07-04
JPS6028386B2 JPS6028386B2 (en) 1985-07-04

Family

ID=15703126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15987678A Expired JPS6028386B2 (en) 1978-12-27 1978-12-27 Lead frame placement method inside the mold

Country Status (1)

Country Link
JP (1) JPS6028386B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217778A (en) * 1990-12-19 1992-08-07 Misako Takase Umbrella dewatering method and device thereof

Also Published As

Publication number Publication date
JPS6028386B2 (en) 1985-07-04

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