JPS53115176A - Production of resn mold type semiconductor device - Google Patents

Production of resn mold type semiconductor device

Info

Publication number
JPS53115176A
JPS53115176A JP3069277A JP3069277A JPS53115176A JP S53115176 A JPS53115176 A JP S53115176A JP 3069277 A JP3069277 A JP 3069277A JP 3069277 A JP3069277 A JP 3069277A JP S53115176 A JPS53115176 A JP S53115176A
Authority
JP
Japan
Prior art keywords
resn
production
semiconductor device
type semiconductor
mold type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3069277A
Other languages
Japanese (ja)
Other versions
JPS5813029B2 (en
Inventor
Akimasa Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP3069277A priority Critical patent/JPS5813029B2/en
Publication of JPS53115176A publication Critical patent/JPS53115176A/en
Publication of JPS5813029B2 publication Critical patent/JPS5813029B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To achieve making common of dies for frames and molding by changing the spacings between connecting strips and adjoining lead pieces according to the number of pins of frames.
COPYRIGHT: (C)1978,JPO&Japio
JP3069277A 1977-03-17 1977-03-17 Method for manufacturing resin molded semiconductor device Expired JPS5813029B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3069277A JPS5813029B2 (en) 1977-03-17 1977-03-17 Method for manufacturing resin molded semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3069277A JPS5813029B2 (en) 1977-03-17 1977-03-17 Method for manufacturing resin molded semiconductor device

Publications (2)

Publication Number Publication Date
JPS53115176A true JPS53115176A (en) 1978-10-07
JPS5813029B2 JPS5813029B2 (en) 1983-03-11

Family

ID=12310721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3069277A Expired JPS5813029B2 (en) 1977-03-17 1977-03-17 Method for manufacturing resin molded semiconductor device

Country Status (1)

Country Link
JP (1) JPS5813029B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158462A (en) * 1980-05-12 1981-12-07 Fujitsu Ltd Lead frame for single inline semiconductor device
JPS58209146A (en) * 1982-05-31 1983-12-06 Nec Corp Semiconductor device
JP2007251217A (en) * 2007-07-06 2007-09-27 Renesas Technology Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56158462A (en) * 1980-05-12 1981-12-07 Fujitsu Ltd Lead frame for single inline semiconductor device
JPS6050347B2 (en) * 1980-05-12 1985-11-08 富士通株式会社 Single inline lead frame for semiconductor devices
JPS58209146A (en) * 1982-05-31 1983-12-06 Nec Corp Semiconductor device
JPS6250059B2 (en) * 1982-05-31 1987-10-22 Nippon Electric Co
JP2007251217A (en) * 2007-07-06 2007-09-27 Renesas Technology Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5813029B2 (en) 1983-03-11

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