JPS5617238A - Mold device for molding resin - Google Patents

Mold device for molding resin

Info

Publication number
JPS5617238A
JPS5617238A JP9320879A JP9320879A JPS5617238A JP S5617238 A JPS5617238 A JP S5617238A JP 9320879 A JP9320879 A JP 9320879A JP 9320879 A JP9320879 A JP 9320879A JP S5617238 A JPS5617238 A JP S5617238A
Authority
JP
Japan
Prior art keywords
mold
resin
runner
products
lead frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9320879A
Other languages
Japanese (ja)
Other versions
JPS6311125B2 (en
Inventor
Takeshi Yoneyama
Kazuo Numajiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9320879A priority Critical patent/JPS5617238A/en
Publication of JPS5617238A publication Critical patent/JPS5617238A/en
Publication of JPS6311125B2 publication Critical patent/JPS6311125B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To readily couple a resin sealing step with its preceding step, facilitate execution of the steps, standardize equipments concerned and facilitate aligning and taking-out of products by a method wherein the element assemblies placed in correspondence with cavity portions are all arranged in one direction. CONSTITUTION:In the case of clamping lead frames (element assemblies) 1, 1' between the upper mold 4 and the lower mold 5 of a mold for molding a resin, the lead frames 1, 1' are all arranged in one direction with the runner 19 as a center. Accordingly, a pair of cavities 6, 19 are also provided in the same direction relative to the runner 19, and the direction of products (the direction of broken-line arrows) in the mold for sealing a resin is fixed.
JP9320879A 1979-07-24 1979-07-24 Mold device for molding resin Granted JPS5617238A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9320879A JPS5617238A (en) 1979-07-24 1979-07-24 Mold device for molding resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9320879A JPS5617238A (en) 1979-07-24 1979-07-24 Mold device for molding resin

Publications (2)

Publication Number Publication Date
JPS5617238A true JPS5617238A (en) 1981-02-19
JPS6311125B2 JPS6311125B2 (en) 1988-03-11

Family

ID=14076143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9320879A Granted JPS5617238A (en) 1979-07-24 1979-07-24 Mold device for molding resin

Country Status (1)

Country Link
JP (1) JPS5617238A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815240A (en) * 1981-07-20 1983-01-28 Hitachi Ltd Manufacture of semiconductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815240A (en) * 1981-07-20 1983-01-28 Hitachi Ltd Manufacture of semiconductor
JPH0225253B2 (en) * 1981-07-20 1990-06-01 Hitachi Ltd

Also Published As

Publication number Publication date
JPS6311125B2 (en) 1988-03-11

Similar Documents

Publication Publication Date Title
JPS5630841A (en) Plastic molding method and metallic mold therefor
DE3476176D1 (en) Method and apparatus for manufacturing cast windows, and products obtained
ATE70003T1 (en) COMPOSITE OBJECTS, AND METHOD AND APPARATUS FOR THE PRODUCTION THEREOF.
EP0186413A3 (en) Equipment for injection moulding of plastics
ATE13153T1 (en) DEVICE FOR CASTING COMPOSITE PLASTIC PARTS.
JPS5617238A (en) Mold device for molding resin
JPS5595497A (en) Forming method for speaker vibration system
EP0211620A3 (en) Process and apparatus for sealing semiconductor packages
JPS5472262A (en) Hot runner mold
JPS55139240A (en) Resin molding method
JPS6436421A (en) Injection molding method for gate seal
EP0143954A3 (en) Process for manufacturing mould parts according to the cold-box method, mould part formed and moulding apparatus used
JPS57188330A (en) Injection molding method
JPS5686730A (en) Method and device for preparation of molded article
DK158501C (en) PROCEDURE AND APPARATUS FOR FORMING A THERMOPLASTIC FORMING MATERIAL
JPS57135401A (en) Parts block molding method to substrate
JPS5662347A (en) Production of resin molded ic
JPS56164814A (en) Mold
JPS6422510A (en) Molding method
JPS5766646A (en) Manufacture of resin sealed type semiconductor device
JPS6438214A (en) Method for molding product having closure film
ATE74854T1 (en) PROCESSES FOR FORMING UNITS OF MOLDABLE MATERIAL, UNITS SO MANUFACTURED, AND MOLDS AND PACKAGING.
JPS6422511A (en) Molding method
JPS5588364A (en) Method of arranging lead frame in molding die
JPS6473731A (en) Manufacture of molding part in electronic component