JPS6473731A - Manufacture of molding part in electronic component - Google Patents

Manufacture of molding part in electronic component

Info

Publication number
JPS6473731A
JPS6473731A JP23151887A JP23151887A JPS6473731A JP S6473731 A JPS6473731 A JP S6473731A JP 23151887 A JP23151887 A JP 23151887A JP 23151887 A JP23151887 A JP 23151887A JP S6473731 A JPS6473731 A JP S6473731A
Authority
JP
Japan
Prior art keywords
synthetic resin
lead
electronic component
gaps
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23151887A
Other languages
Japanese (ja)
Other versions
JP2535358B2 (en
Inventor
Fusao Matsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP62231518A priority Critical patent/JP2535358B2/en
Publication of JPS6473731A publication Critical patent/JPS6473731A/en
Application granted granted Critical
Publication of JP2535358B2 publication Critical patent/JP2535358B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent troubles of a trouble that each inner lead part is curved due to a dust and so on by a method wherein a synthetic resin thin film is made to protrude integrally with each inner lead part from the molding part of an electronic component along the upper and lower surfaces of each inner lead part and thereafter, this film is removed. CONSTITUTION:When components of an island 6 and so on in a lead frame 1 are inserted in a cavity 22 between molding metal fittings 20 and 21 and are pinched between the metal molds 20 and 22, gaps can be each formed between each inner lead part 7 and recessed places 24 on the upper and lower surfaces of the lead 7 and at the same time, the gaps are interconnected with the gaps between the mutually adjacent lead parts 7 and 7 as well. Then, when a liquid thermosetting epoxy synthetic resin, for example, is poured, the interior of the cavity 22 is filled with this synthetic resin and at the same time, the synthetic resin flows in the places 24 in such a way as to cover the peripheral surface of each lead part 7, a molding part 27 can be formed by heating the metal molds 20 and 21 and at the same time, a thin film 28 is formed protuberantly from the side surfaces of the molding part 27 in such a way as to cover all the lead parts 7. Then, the film 28 is removed and thereafter, when a coupling bar 3 and dam bars 4 are cut out, an electronic component is manufactured.
JP62231518A 1987-09-16 1987-09-16 Manufacturing method of mold part in electronic parts Expired - Lifetime JP2535358B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231518A JP2535358B2 (en) 1987-09-16 1987-09-16 Manufacturing method of mold part in electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231518A JP2535358B2 (en) 1987-09-16 1987-09-16 Manufacturing method of mold part in electronic parts

Publications (2)

Publication Number Publication Date
JPS6473731A true JPS6473731A (en) 1989-03-20
JP2535358B2 JP2535358B2 (en) 1996-09-18

Family

ID=16924742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231518A Expired - Lifetime JP2535358B2 (en) 1987-09-16 1987-09-16 Manufacturing method of mold part in electronic parts

Country Status (1)

Country Link
JP (1) JP2535358B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0999586A2 (en) * 1998-11-05 2000-05-10 Sony Corporation Semiconductor device and method of producing same
US8723589B2 (en) 2009-03-27 2014-05-13 Eth Zurich Switching device with a cascode circuit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604225A (en) * 1983-06-23 1985-01-10 Toshiba Corp Method for removing resin burr in resin mold semiconductor device
JPS6092625A (en) * 1983-10-27 1985-05-24 Toshiba Corp Removing method of resin burr of resin seal type semiconductor device
JPS6236834A (en) * 1985-08-10 1987-02-17 Fujitsu Ltd Resin sealing apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604225A (en) * 1983-06-23 1985-01-10 Toshiba Corp Method for removing resin burr in resin mold semiconductor device
JPS6092625A (en) * 1983-10-27 1985-05-24 Toshiba Corp Removing method of resin burr of resin seal type semiconductor device
JPS6236834A (en) * 1985-08-10 1987-02-17 Fujitsu Ltd Resin sealing apparatus and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0999586A2 (en) * 1998-11-05 2000-05-10 Sony Corporation Semiconductor device and method of producing same
EP0999586A3 (en) * 1998-11-05 2002-06-05 Sony Corporation Semiconductor device and method of producing same
US8723589B2 (en) 2009-03-27 2014-05-13 Eth Zurich Switching device with a cascode circuit

Also Published As

Publication number Publication date
JP2535358B2 (en) 1996-09-18

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