JPS5633847A - Package molding for semiconductor - Google Patents

Package molding for semiconductor

Info

Publication number
JPS5633847A
JPS5633847A JP10996579A JP10996579A JPS5633847A JP S5633847 A JPS5633847 A JP S5633847A JP 10996579 A JP10996579 A JP 10996579A JP 10996579 A JP10996579 A JP 10996579A JP S5633847 A JPS5633847 A JP S5633847A
Authority
JP
Japan
Prior art keywords
cavities
thermoplastic resin
plate shaped
resin plate
shaped substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10996579A
Other languages
Japanese (ja)
Other versions
JPS6122467B2 (en
Inventor
Mitsuyoshi Nakatsuka
Keiji Hazama
Shinichi Oota
Fumio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP10996579A priority Critical patent/JPS5633847A/en
Publication of JPS5633847A publication Critical patent/JPS5633847A/en
Publication of JPS6122467B2 publication Critical patent/JPS6122467B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To eliminate the damage to connection between semiconductors and lead wires and to improve the reliability of a semiconductor function by using thermoplastic resin plate shaped substances having cavities to accommodate the semiconductors. CONSTITUTION:Two thermoplastic resin plate shaped substances 17, 17' with cavities for storing melting resin are provided in metal molds 14, 14' with cavities and a lead frame 5 equipped with a semiconductor is provided in the metal mold 14'. Wherein, the thermoplastic resin plate shaped substances 17, 17' are provided with cavities 11, 11' having thin side wall sections 15, 15' and thick side wall sections 16, 16' for accommodating a previously molded semiconductor and cavities 18, 18' for storing melting resin to store extra resin generated when the thermoplastic resin plate shaped substances are melted and united to the thick side wall sections. The thermoplastic resin plate shaped substances 17, 17' are melted and united by pressurizing by a presser after heating the substances 17, 17' at a predetermined temperature. Furthermore, the metal molds 14, 14' with cavities are provided with cavities 19, 19' for installing the thermoplastic resin plate shaped substances.
JP10996579A 1979-08-28 1979-08-28 Package molding for semiconductor Granted JPS5633847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10996579A JPS5633847A (en) 1979-08-28 1979-08-28 Package molding for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10996579A JPS5633847A (en) 1979-08-28 1979-08-28 Package molding for semiconductor

Publications (2)

Publication Number Publication Date
JPS5633847A true JPS5633847A (en) 1981-04-04
JPS6122467B2 JPS6122467B2 (en) 1986-05-31

Family

ID=14523633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10996579A Granted JPS5633847A (en) 1979-08-28 1979-08-28 Package molding for semiconductor

Country Status (1)

Country Link
JP (1) JPS5633847A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like
JPS6313352A (en) * 1986-07-04 1988-01-20 Sumitomo Bakelite Co Ltd Sealing method of semiconductor and the like

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0212994A2 (en) * 1985-08-28 1987-03-04 Seiei Kohsan Co.,Ltd. Method and apparatus for packaging semiconductor device and the like
JPS6313352A (en) * 1986-07-04 1988-01-20 Sumitomo Bakelite Co Ltd Sealing method of semiconductor and the like

Also Published As

Publication number Publication date
JPS6122467B2 (en) 1986-05-31

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