JP2587539B2 - Mold for resin sealing of semiconductor device - Google Patents
Mold for resin sealing of semiconductor deviceInfo
- Publication number
- JP2587539B2 JP2587539B2 JP35391A JP35391A JP2587539B2 JP 2587539 B2 JP2587539 B2 JP 2587539B2 JP 35391 A JP35391 A JP 35391A JP 35391 A JP35391 A JP 35391A JP 2587539 B2 JP2587539 B2 JP 2587539B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- semiconductor device
- pot
- plunger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置の樹脂封止用
金型に関し、特に熱硬化性樹脂によりモールド封入を行
なう金型に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for encapsulating a resin for a semiconductor device, and more particularly to a mold for molding and sealing with a thermosetting resin.
【０００２】[0002]
【従来の技術】従来、半導体装置の樹脂封止用金型は、
図２の縦断面図に示す様に、リードフレーム３を上金型
１と下金型２とで挟んだ後、ポット７に投入された熱硬
化性樹脂５を加熱により溶融させ、プランジャー６で加
圧する事により、センターカル９，ランナ１０，ゲート
１１を通じてキャビティ４に充填する。成形完了後、エ
ジェクターピン８により、成形品を離型する様になって
いる。2. Description of the Related Art Conventionally, a mold for resin sealing of a semiconductor device has been
As shown in the longitudinal sectional view of FIG. 2, after the lead frame 3 is sandwiched between the upper mold 1 and the lower mold 2, the thermosetting resin 5 put in the pot 7 is melted by heating, and the plunger 6 Then, the cavity 4 is filled through the center cal 9, the runner 10, and the gate 11. After the molding is completed, the molded product is released from the mold by the ejector pins 8.
【０００３】[0003]
【発明が解決しようとする課題】上述した半導体装置の
樹脂封止用金型は、センターカル，ランナー，ゲートを
有している為、次のような欠点がある。（１）封入後、
上記各部に残存する樹脂を廃棄しなければならない、
（２）ゲート部の樹脂が成形品に残る事がある、（３）
金型の大きさに対して、成形品の成形個数が少ない、
（４）多数のエジェクターピンが必要となる、等であ
る。The above-described resin molding die for a semiconductor device has a center cull, a runner, and a gate, and thus has the following disadvantages. (1) After encapsulation,
Resin remaining in each of the above parts must be discarded,
(2) The resin at the gate may remain on the molded product. (3)
The number of molded products is small relative to the size of the mold,
(4) Many ejector pins are required, and so on.
【０００４】[0004]
【課題を解決するための手段】本発明の半導体装置の樹
脂封止用金型は、下金型の各キャビティ底部に、熱硬化
性樹脂を投入するポット及びこのポット内を上下し前記
樹脂の充填と成形品のノックアウトを兼ねたプランジャ
ーを備えている。According to the present invention, there is provided a resin sealing mold for a semiconductor device according to the present invention, wherein a pot for charging a thermosetting resin is placed at the bottom of each cavity of a lower mold, and the pot is moved up and down in the pot to form the resin. Equipped with a plunger that performs both filling and knocking out of molded products.
【０００５】[0005]
【実施例】以下、本発明について図面を用いて説明す
る。図１は、本発明の一実施例を示す図で、同図
（Ａ），（Ｂ）とも縦断面図である。同図（Ａ）におい
て、下金型２のキャビティ４の下方にポット７およびプ
ランジャー６を設けた構造になっている。ポット７およ
びプランジャー７は、１つの下金型２の底部にキャビテ
ィ毎に設けられている。次に金型の動作について説明す
ると、まず下金型２のポット７に熱硬化性樹脂５を投入
（投入機構は図示していない）し、次いでリードフレー
ム３を供給して上金型１との間で型締めを行なう。投入
された熱硬化性樹脂５が、加熱によりゲル状化したとこ
ろをプランジャー６で押し込み、キャビティ４に充填す
る。成形完了後、同図（Ｂ）のようにプランジャー６で
成形品１２を押し上げ、金型より離型する様になってい
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a view showing an embodiment of the present invention, and FIGS. 1A and 1B are longitudinal sectional views. In FIG. 1A, the pot 7 and the plunger 6 are provided below the cavity 4 of the lower mold 2. The pot 7 and the plunger 7 are provided at the bottom of one lower mold 2 for each cavity. Next, the operation of the mold will be described. First, the thermosetting resin 5 is introduced into the pot 7 of the lower mold 2 (the introduction mechanism is not shown), and then the lead frame 3 is supplied to the upper mold 1 so that Clamp between the molds. The place where the injected thermosetting resin 5 has gelled by heating is pushed by the plunger 6 to fill the cavity 4. After the molding is completed, the molded product 12 is pushed up by the plunger 6 and released from the mold as shown in FIG.
【０００６】[0006]
【発明の効果】以上説明した様に本発明は、キャビティ
の下方にプランジャーを設ける事により、（１）金型内
に残存樹脂がなくなるため、樹脂の全てを成形品とする
事ができる、（２）成形品にゲート部の樹脂が残らな
い、（３）金型の大きさに対して成形品の個数が多くな
る、（４）エジェクターピンの数を軽減できる、という
効果がある。As described above, according to the present invention, by providing the plunger below the cavity, (1) there is no residual resin in the mold, so that all of the resin can be molded. (2) There is an effect that the resin at the gate portion does not remain in the molded product, (3) the number of molded products increases with respect to the size of the mold, and (4) the number of ejector pins can be reduced.
【図１】本発明の一実施例を示す図で、同図（Ａ），
（Ｂ）はそれぞれ縦断面図である。FIG. 1 is a view showing an embodiment of the present invention, wherein FIG.
(B) is a longitudinal sectional view, respectively.
【図２】従来の半導体装置の樹脂封止用金型を示す縦断
面図である。FIG. 2 is a longitudinal sectional view showing a resin molding die of a conventional semiconductor device.
１ 金型 ２ 下金型 ３ リードフレーム ４ キャビティ ５ 熱硬化性樹脂 ６ プランジャー ７ ポット ８ エジェクターピン ９ センターカル １０ ランナー １１ ゲート １２ 成形品 DESCRIPTION OF SYMBOLS 1 Die 2 Lower die 3 Lead frame 4 Cavity 5 Thermosetting resin 6 Plunger 7 Pot 8 Ejector pin 9 Center call 10 Runner 11 Gate 12 Molded product
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 31:34 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical display location B29L 31:34
Claims (1)
半導体装置の樹脂封止用金型において、下金型の各キャ
ビティ底部に、前記樹脂を投入するポット及びこのポッ
ト内を上下し前記樹脂の充填と成形品のノックアウトを
兼ねたプランジャーを備えたことを特徴とする半導体装
置の樹脂封止用金型。1. A resin sealing mold for a semiconductor device in which a thermosetting resin is used for molding and encapsulating, wherein a pot for charging the resin is formed at the bottom of each cavity of a lower mold, and the resin is moved up and down in the pot. A resin-sealing mold for a semiconductor device, comprising a plunger that serves both as a filling and a knock-out of a molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35391A JP2587539B2 (en) | 1991-01-08 | 1991-01-08 | Mold for resin sealing of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35391A JP2587539B2 (en) | 1991-01-08 | 1991-01-08 | Mold for resin sealing of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04242941A JPH04242941A (en) | 1992-08-31 |
| JP2587539B2 true JP2587539B2 (en) | 1997-03-05 |
Family
ID=11471467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35391A Expired - Lifetime JP2587539B2 (en) | 1991-01-08 | 1991-01-08 | Mold for resin sealing of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2587539B2 (en) |
-
1991
- 1991-01-08 JP JP35391A patent/JP2587539B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04242941A (en) | 1992-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19961022 |