JPS635226Y2 - - Google Patents
Info
- Publication number
- JPS635226Y2 JPS635226Y2 JP1982004841U JP484182U JPS635226Y2 JP S635226 Y2 JPS635226 Y2 JP S635226Y2 JP 1982004841 U JP1982004841 U JP 1982004841U JP 484182 U JP484182 U JP 484182U JP S635226 Y2 JPS635226 Y2 JP S635226Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- filling part
- runner
- mold
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000001721 transfer moulding Methods 0.000 claims description 8
- 238000011109 contamination Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【考案の詳細な説明】
(1) 考案の技術分野
本考案は、樹脂封止タイプのIC等の製造に利
用されるトランスフアー成形装置のモールド金型
のランナー形状に関する。[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a runner shape of a mold of a transfer molding device used for manufacturing resin-sealed type ICs and the like.
(2) 技術の背景
ICの製造等において廉価な封止手段として樹
脂封止が広く利用されている。この樹脂封止はト
ランスフアー成形装置を利用することにより、よ
り安価に行なわれる。(2) Technical background Resin encapsulation is widely used as an inexpensive encapsulation method in the manufacture of ICs. This resin sealing can be performed at a lower cost by using a transfer molding device.
(3) 従来技術と問題点
複数個を同時に成形するために、トランスフア
ー成形装置のモールド金型には複数個のキヤビイ
テイが形成されており、充てん部より押圧された
タブレツトがそれぞれのランナーを通つてキヤビ
イテイ内に注入される。その場合、充てん部から
各キヤビイテイへ至るランナーの形状が、例えば
流線でなかつたり、キヤビイテイの位置に応じて
長さが異なつたりすると、特定のキヤビイテイへ
の樹脂の未充てん及び型汚れが発生し易くなる。
つまり近くにあるキヤビイテイには充分樹脂が充
てんされるが、遠くにあるキヤビイテイには未充
てん及び型汚れが生じたり、またランナーの形状
がなめらかでない場合等も未充てんが生じる。(3) Prior art and problems In order to mold multiple tablets at the same time, multiple cavities are formed in the mold of the transfer molding device, and the tablets pressed from the filling part pass through each runner. It is then injected into the cavity. In that case, if the shape of the runner from the filling part to each cavity is not streamlined, or the length varies depending on the position of the cavity, certain cavities may not be filled with resin or mold stains may occur. It becomes easier to do.
In other words, cavities located nearby are sufficiently filled with resin, but cavities located far away may be unfilled or have mold stains, or may be unfilled if the shape of the runner is not smooth.
(4) 考案の目的
本考案の目的は、複数のキヤビイテイに対し、
未充てん及び型汚れが生じるのを防止し、製品の
ばらつきをなくすことができるトランスフアー成
形装置の提供にある。(4) Purpose of the invention The purpose of the invention is to
To provide a transfer molding device that can prevent unfilled and mold stains and eliminate product variations.
(5) 考案の構成
本考案は、タブレツトの充てん部と、該タブレ
ツトを押圧するプランジヤー部樹脂が注入される
複数のキヤテテイ部と、前記充てん部から各キヤ
ビテイ部へ樹脂を送出する為に前記充てん部から
放射状に導出された複数のランナーを有するモー
ルド金型を具備し、少なくとも３つキヤビテイ部
が同一の列内に整列して配置されており、全ての
ランナーはその長さが略同一となる様に前記充て
ん部から各キヤビテイ部へ至る途中でそれぞれ湾
曲して、且つ充てん部とランナー，ランナーとキ
ヤビテイの接続部が全て略垂直方向に接続されて
いることを特徴とする。(5) Structure of the invention The present invention comprises a filling part of a tablet, a plunger part for pressing the tablet, a plurality of housing parts into which resin is injected, and a filling part for delivering the resin from the filling part to each cavity part. The mold is equipped with a mold having a plurality of runners extending radially from the cavity part, at least three cavity parts are arranged in the same row, and all the runners have substantially the same length. The filling part is curved on the way from the filling part to each cavity part, and the filling part and the runner, and the connection part between the runner and the cavity are all connected in a substantially vertical direction.
(6) 考案の実施例
第１図は一般的なトランスフアー成形装置の構
造を示す断面図で、第２図は本考案の一実施例の
モールド金型の平面図である。(6) Embodiment of the invention FIG. 1 is a sectional view showing the structure of a general transfer molding apparatus, and FIG. 2 is a plan view of a mold according to an embodiment of the invention.
１はタブレツト（図示せず）の充てん部、２は
プランジヤーで、モールド金型３，４によりラン
ナー５、キヤビイテイ６が形成される。 1 is a filling part of a tablet (not shown), 2 is a plunger, and molds 3 and 4 form a runner 5 and a cavity 6.
本実施例によれば第２図に示すように、ランナ
ー５の形状は充てん部１を中心にうず巻状で、充
てん部１よりキヤビイテイ６に至る長さが全て同
一になるよう形成されている。そして充てん部１
とランナー５との接続部、及びランナー５とキヤ
ビイテイ６との接続部では略垂直方向に接続する
よう設計されている。すなわち、１対のランナー
５−１，５−２，５−３はそれぞれ対象になるよ
う形成されているので、各キヤビイテイ６に対し
同一の条件のもとで樹脂の充填が行なわれる。従
つて従来の様な特定のキヤビイテイに対し樹脂の
未充填及び型汚れが防止される。 According to this embodiment, as shown in FIG. 2, the shape of the runner 5 is spiral around the filled part 1, and the length from the filled part 1 to the cavity 6 is all the same. . and filling part 1
The connecting portion between the runner 5 and the runner 5, and the connecting portion between the runner 5 and the cavity 6 are designed to be connected in a substantially vertical direction. That is, since the pair of runners 5-1, 5-2, and 5-3 are formed symmetrically, each cavity 6 is filled with resin under the same conditions. Therefore, unfilled resin and mold contamination in a specific cavity as in the prior art are prevented.
(7) 考案の効果
本考案のトランスフアー成形装置によれば、樹
脂の未充填及び型汚れを防止することができ、複
数のキヤビイテイに均一に樹脂を供給することが
できるので、ばらつきなく成形を行なうことがで
きる。(7) Effects of the invention According to the transfer molding device of the invention, it is possible to prevent unfilled resin and mold contamination, and it is possible to uniformly supply resin to multiple cavities, so molding can be performed without variation. can be done.
第１図は一般的なトランスフアー成形装置の断
面図、第２図は本考案に係るモールド金型の平面
図である。
図中、１は充てん部、２はプランジヤー、３，
４はモールド金型、５はランナー、６はキヤビイ
テイである。
FIG. 1 is a sectional view of a general transfer molding apparatus, and FIG. 2 is a plan view of a mold according to the present invention. In the figure, 1 is a filling part, 2 is a plunger, 3,
4 is a mold, 5 is a runner, and 6 is a cavity.
Claims (1)
する為に前記充てん部から放射状に導出された複
数のランナーを有するモールド金型を具備し、 少なくとも３つキヤビテイ部が同一の列内に整
列して配置されており、 全てのランナーはその長さが略同一となる様に
前記充てん部から各キヤビテイ部へ至る途中でそ
れぞれ湾曲され、且つ充てん部とランナー，ラン
ナーとキヤビテイの接続部が全て略垂直方向に接
続されていることを特徴とするトランスフア成形
装置。[Scope of Claim for Utility Model Registration] A filling part of a tablet, a plunger part that presses the tablet, a plurality of cavity parts into which resin is injected, and a filling part for delivering resin from the filling part to each cavity part. The mold is equipped with a mold having a plurality of runners extending radially from the cavity part, at least three cavity parts are arranged in the same row, and all the runners have substantially the same length. The transfer molding apparatus is characterized in that the filling part is curved on the way from the filling part to each cavity part, and the filling part and the runner, and the connection parts of the runner and the cavity are all connected in a substantially vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP484182U JPS58118736U (en) | 1982-01-18 | 1982-01-18 | Transfer molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP484182U JPS58118736U (en) | 1982-01-18 | 1982-01-18 | Transfer molding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58118736U JPS58118736U (en) | 1983-08-13 |
| JPS635226Y2 true JPS635226Y2 (en) | 1988-02-12 |
Family
ID=30017671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP484182U Granted JPS58118736U (en) | 1982-01-18 | 1982-01-18 | Transfer molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58118736U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8206146B2 (en) * | 2009-12-08 | 2012-06-26 | Husky Injection Molding Systems Ltd. | Mold-tool system having a manifold body defining uninterrupted melt channels |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217366B2 (en) * | 1972-01-31 | 1977-05-14 | ||
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
| JPS5551738A (en) * | 1978-10-10 | 1980-04-15 | Rca Corp | Coating composition |
| JPS635226U (en) * | 1986-06-20 | 1988-01-14 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217366U (en) * | 1975-07-25 | 1977-02-07 |
-
1982
- 1982-01-18 JP JP484182U patent/JPS58118736U/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217366B2 (en) * | 1972-01-31 | 1977-05-14 | ||
| JPS54101858A (en) * | 1978-01-27 | 1979-08-10 | Hitachi Ltd | Mold |
| JPS5551738A (en) * | 1978-10-10 | 1980-04-15 | Rca Corp | Coating composition |
| JPS635226U (en) * | 1986-06-20 | 1988-01-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58118736U (en) | 1983-08-13 |
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