JPH03157942A - Manufacture of resin-sealed semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To reduce the manufacturing cost of the title circuit by a method wherein a high-quality and high-cost resin tablet is used for forming a resin- sealed IC and a low-quality and low-cost resin tablet is used for forming other parts. CONSTITUTION:A lead frame 6 is set between a bottom force 1 and a top force 2 and is clamped. A high-quality and high-cost resin tablet 5A for forming a package of an IC is set below, a low-quality and low-cost resin tablet 5B for forming other parts, such as a runner and the like, is set above and both tablets 5A and 5B are pressed by a plunger 4 and are injected in order in a metal mold from the tablet set below. As a resin to be discharged as an unnecessary part is substituted with a low-quality and low-cost resin, the manufacturing cost of a resin-sealed semiconductor integrated circuit is reduced.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a resin-encapsulated semiconductor integrated circuit,
In particular, the present invention relates to a combination of bulk resins (hereinafter referred to as tablets) to be provided to a sealing mold.

[Conventional technology]

Conventionally, in the encapsulation process of resin-molded semiconductor integrated circuits (hereinafter referred to as IC), as shown in FIG. ) 3 to form a predetermined external shape on an IC lead frame set in a mold.

Generally, three to four tablets 5 are charged into the tablef 1 to the charging hole of the mold. The tablet 5 is pushed by the pressure of the injection plunger 4 and sent to the cavity 3 through a runner 7 which is a resin flow path in the mold.

[Problem to be solved by the invention]

As described above, the resin 5 injected into the mold fills a portion of the runner and the IC portion, is cured by heat, and forms the outer shape of the IC.

The resin removed from the mold has the shape shown in FIG. What is necessary for the IC is the package portion 8 formed on the lead frame 6, and the resin 7A that is part of the runner is removed and discarded as unnecessary material.

In recent years, in order to improve the reliability and quality of ICs, the moisture resistance and other characteristics of resins have been improved, and the prices of resins have become higher. However, as described above, nearly half of the resin used becomes the resin 7A of a part of the runner and is discarded, resulting in a very large amount of waste, which hinders IC cost reduction.

In contrast to the manufacturing method using the conventional sealing process described above, the present invention uses a high-quality, high-priced resin that forms the IC package and a low-quality, low-priced resin that forms the parts other than the IC package as resins that are put into the mold. The difference is that two types of resin are used.

[Means to solve the problem]

The method for manufacturing a resin-sealed semiconductor device of the present invention uses an encapsulation mold, and injects a plurality of lumps of resin into the resin supply hole of the mold, and injects the resin into the inside of the mold, thereby sealing the semiconductor element with the resin. In the method for manufacturing a resin-sealed semiconductor integrated circuit, the plurality of lumped resins are composed of at least two types of lumped resins having mutually different characteristics.

〔Example〕 Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 illustrates a first embodiment of the invention. FIG.

A lead frame 6 is set between the lower mold 1 and the upper mold 2, and is tightened to withstand the pressure of resin injection.

As shown in the figure, the first tablet 5 of high quality and high price that forms the IC package is set on the bottom side, and the second tablet 5A of low quality and low price that forms unnecessary parts such as runners is set on the top side. be done. Thereafter, pressure is applied by the injection plunger 4, and the tablets are sequentially injected into the mold starting from the lower tablet.

FIG. 2 is a perspective view of the enclosed product obtained by the first example. In the figure, 8A is a package part made on the lead frame 6, and 7B and 7C are resin parts of a part of the runner, which are unnecessary parts. A portion of the resin 7C of the runner is a portion formed by the second tablet 5B placed in the upper part. Therefore, the number of expensive tablets can be reduced compared to conventional ones.

FIG. 3 is a perspective view for explaining a second embodiment of the present invention.

This is an example in the case of an enclosure type mold having a plurality of tablet insertion parts and a single multi-plunger type mold.

A first tablet 5A and a second tablet 5B are inserted into tablet insertion holes provided in the lower mold 1, respectively. A lead frame 6 is set on a cavity 3 that forms the outer shape of the IC.

After inserting the tablets 5A and 5B, the upper mold is lowered and resin is injected into the cavity using a plurality of plungers provided at the bottom of the lower mold. In this case, as in the embodiment of Box 1, a second tablet 5 made of low quality and low cost resin is used.
B is introduced at a position far from the cavity 3. In this embodiment, it is the lower side.

FIG. 4 is a perspective view of the enclosed product obtained in the second example. In the figure, 8A is a package made on the lead frame 6, and is molded from high quality and expensive resin.

7B and 7c are resins of the runner parts, and 7C is a part molded with low quality and low cost resin.

〔Effect of the invention〕

As explained above, the present invention uses a high-quality, high-priced resin tablet for forming the package of a resin-sealed semiconductor integrated circuit, and a low-quality, low-priced resin tablet for forming unnecessary parts. By performing the encapsulation process,
The high-quality, high-priced resin that was conventionally discarded as unnecessary parts can be replaced with a low-quality, low-priced resin, which has the effect of reducing the manufacturing cost of resin-sealed semiconductor integrated circuits.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a mold for explaining a first embodiment of the present invention, FIG. 2 is a perspective view of an enclosed product obtained by the first embodiment, and FIG. FIG. 4 is a perspective view of the enclosed product obtained by the second embodiment, and FIG. 5 is a cross-sectional view of the mold to explain the conventional example. , FIG. 6 is a perspective view of an enclosed product obtained in a conventional example. 1... Lower mold, 2... Upper mold, 3... Cavity, 4... Plunger, 5... Tablet, 5A.
...First tablet, 5B...Second tablet,
6...Lead frame, 7...Runner, 7A~7
C...Runner part resin, 8.8A...Package part.

Claims (1)

[Claims] In a method for manufacturing a resin-encapsulated semiconductor integrated circuit, in which a semiconductor element is encapsulated with resin by using an encapsulation mold and injecting a plurality of lump resins into the resin supply holes of the mold and injecting the resin into the inside of the mold, the plurality of A method for manufacturing a resin-sealed semiconductor integrated circuit, characterized in that the lumpy resin is composed of at least two types of lumpy resins having mutually different characteristics.