JP4300878B2 - Mold and method for evaluating weld using the same - Google Patents
Mold and method for evaluating weld using the same Download PDFInfo
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- JP4300878B2 JP4300878B2 JP2003153464A JP2003153464A JP4300878B2 JP 4300878 B2 JP4300878 B2 JP 4300878B2 JP 2003153464 A JP2003153464 A JP 2003153464A JP 2003153464 A JP2003153464 A JP 2003153464A JP 4300878 B2 JP4300878 B2 JP 4300878B2
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- 238000000034 method Methods 0.000 title claims description 13
- 238000011156 evaluation Methods 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 238000000465 moulding Methods 0.000 claims description 15
- 235000014121 butter Nutrition 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、樹脂モールドの際に生じるウェルドを評価するのに用いるモールド金型及びそれを用いたウェルドの評価方法に関する。
【０００２】
【従来の技術】
ＩＣやトランジスタ等の半導体装置の製造工程において、半導体素子はリードフレームや有機配線基盤等と接着剤を介し搭載され、更にワイヤーボンディング工程を経て電気的な接合がされる。半導体素子やボンディングワイヤーを始め構成部材の位置関係により樹脂モールドする際の樹脂の流れ方は均一ではなくウェルドの発生の危険がある。ウェルドの発生は外観上の不良だけでなく、捺印不良や耐湿信頼性不良を誘発する要因として考えられる。
近年は、従来のリードフレームタイプの半導体装置だけでなく、ＢＧＡのような片面封止の半導体装置が増えてきている。ＢＧＡの中でも一括成形し後工程で個片に切断して半導体装置を製造する方法も主流化し始めている。一括成形の場合、特に金型内に複数の半導体素子が配置されるため、樹脂が流動する際に狭路と広路の差が著しくなる傾向がでている。
従って、ウェルドの発生状態を評価することは、モールド樹脂の開発時、樹脂モールドの各種条件設定時、適正な半導体素子の配置やボンディングワイヤの張り方や線材の選択時などにおいて極めて重要となる。
【０００３】
従来のウェルドの評価は、実際の半導体素子を用いて行われていた。即ち、リードフレームのアイランド部に実際の半導体素子であるＩＣチップをダイボンディングしたり、有機配線基板上にＩＣチップをダイボンディングしたり、その後ボンディングワイヤを張るというように実際の半導体装置を組み立てる際に実験を行うしか方法がなかった。
しかし、この従来の評価方法では、ＩＣチップは非常に高価であるためコストが高くなるうえ、ＩＣチップの搭載、ワイヤボンディングなどの必要があるため、非常に工数が掛かり評価の効率が低下するという問題があった。
【０００４】
【発明が解決しようとする課題】
本発明は、かかる従来の事情に鑑み、樹脂モールド工程におけるウェルド評価を、高価なＩＣチップを使用しない低コストで簡便な評価方法を提供することを目的とする。本評価方法は一括成形でのウェルドだけでなく、ＴＳＯＰや薄型ＱＦＰでのウェルドの評価の代替手法として有効である。また、本評価方法は半導体の封止成形に限らず、モールド樹脂全般においてウェルドの発生し易さを判断する代用評価としても極めて有効である。
【０００５】
【課題を解決するための手段】
このような目的は、下記［１］〜［５］に記載の本発明により達成される。
［１］ 樹脂モールドにより生じるウェルドの評価に用いるモールド金型であって、狭路及び該狭路より厚みが大きい広路を有し、前記狭路を形成する凸部を金型キャビティ内に２個以上有し、前記モールド金型の前記狭路の厚みａと前記広路の厚みｂの比率ａ／ｂが０．１〜０．４であり、前記広路の厚みｂが０．２〜１．０ｍｍであり、前記モールド金型にある１つの狭路の長さｃが５ｍｍ以上であることを特徴とするモールド金型。
［２］ 前記狭路の幅ｄと前記広路の幅ｅの比率ｄ／ｅが５未満であり、且つ前記狭路の流路面積ａ×ｄと前記広路の流路面積ｂ×ｅの関係がａｄ≦ｂｅを満足する第［１］項に記載のモールド金型。
［３］ 前記モールド金型の前記狭路を形成する凸部と凸部の間隙距離ｆが、凸部の長さｃの１／２以下である第［１］、または［２］項に記載のモールド金型。
［４］ 樹脂モールドにより生じるウェルドの評価に用いるモールド金型であって、狭路及び該狭路より厚みが大きい広路を有し、前記狭路を形成する凸部を金型キャビティ内の中央部に２個以上有し、ランナーゲートより、前記広路、前記狭路の順に形成されたことを特徴とする第［１］、［２］、または［３］項のいずれかに記載のモールド金型。
［５］ 樹脂モールドにより生じるウェルドを評価する方法であって、第［１］乃至［４］項のいずれかに記載のモールド金型を用いて樹脂モールドを行った後、発生するウェルドの大きさ、発生モードを観測することを特徴とするウェルドの評価方法。
【０００６】
【発明の実施の形態】
本発明方法においては、高価なＩＣチップを使用せず、ＩＣチップの搭載、ワイヤボンディングなどの必要がなく、非常に評価の効率が向上するという特徴がある。実素子を用いての評価とは異なりボンディングワイヤが無いことやモールド封止する体積などが異なる近似値としての評価になるが、結果の解析に支障はない。
以下、本発明のモールド金型及びそれを用いたウェルドの評価方法について詳細に説明する。
【０００７】
本発明のモールド金型は、樹脂モールドにより生じるウェルドの評価に用いるモールド金型であって、狭路及び該狭路より厚みが大きい広路を有することが必須である。また、本発明のモールド金型は、狭路を形成する凸部を金型キャビティ内に２個以上有することが必要である。凸部の数が１個であるとウェルドが発生し難く、充分な評価ができない恐れがある。また、凸部の数はより望ましくは３個以上必要である。また、本発明のモールド金型の狭路の厚みａと広路の厚みｂは、その比率ａ／ｂが０．１〜０．４であり、広路の厚みｂが０．２〜１．０ｍｍであり、且つ狭路長さ（＝凸部の長さ）ｃが５ｍｍ以上であることが望ましい。この範囲を超えると充填パターンが変化し正しい評価ができない恐れがある。
更に、本発明のモールド金型の狭路の幅ｄと広路の幅ｅの比率ｄ／ｅが５未満であることが望ましい。ｄ／ｅが５以上であると狭路と広路の流速が等しくなる傾向がでてきてウェルドの評価として適切でなくなる恐れがある。更に狭路の流路の面積ａ×ｄと広路の流路面積ｂ×ｅの関係がａｄ≦ｂｅを満足することが望ましい。ａｄ≦ｂｅを満足しないと広路の流路面積が小さすぎて狭路と広路の流速が等しくなる傾向がでてきてウェルドの評価として適切でなくなる恐れがある。また、本発明のモールド金型の狭路を形成する凸部と凸部の間隙距離ｆは凸部の長さｃの１／２以下であることが望ましい。１／２を越えると充填パターンが変化しウェルドの評価として適切でなくなる恐れがある。
【０００８】
本発明のウェルドの評価方法は、樹脂モールドにより生じるウェルドを評価する方法であって、上記記載のモールド金型を用いて樹脂モールドを行った後、発生するウェルドの大きさ、発生モードを観測することを特徴とするものである。実際の半導体装置の製造工程において樹脂モールドの際に発生するウェルドは、封止樹脂が流れる流路のサイズによって生じるものであり、ＩＣ構成材質（例えばリードフレームやＩＣ素子やボンディングワイヤなど）が存在することによって流路のサイズは変化する。封止樹脂はチキソ性を有するために流路の差によって流量や流速が大きく変化する。これによって樹脂の回り込み現象が生じ、結果としてウェルドが生じることになる。ウェルドのサイズとしては流路の差によって変化するが数１０μｍから数ｍｍのサイズが多い。ＢＧＡのように片面封止ではない半導体装置はウェルド現象による構成部材の上下シフト現象が発生するため更に大きなサイズとなる場合もある。
【０００９】
【実施例】
以下に本発明の実施例を示すが、本発明はこれらに限定されるものではない。
実施例１〜１２、比較例１
表１に記載のエポキシ樹脂組成物をミキサーにて混合し、熱ロールを用いて、１００℃で２分間混練して冷却後粉砕し、エポキシ樹脂成形材料を得た。得られたエポキシ樹脂成形材料をタブレット化したものを、図１に示す形状、表２に示す寸法のモールド金型を用いて、金型温度１７５℃、注入圧力９．８ＭＰａ、硬化時間１２０秒の条件でトランスファー成形した後、ウェルドの評価を行った。ウェルドの評価は金型から取り出した成形品の外観を目視によって確認した。ウェルドとは云えずほとんど充填しないモードは未充填とした。結果を表２に示。
【００１０】
【表１】
【表２】
【発明の効果】
本発明によれば、樹脂モールド工程におけるウェルドを、従来のごとく高価なＩＣチップを使用せずに、低コストで簡便な方法によって評価することができる。従って、本発明のウェルドの評価方法によれば、ＩＣパッケージのモールド樹脂の生産開発、樹脂モールディング工程、その他で、生産性の向上、開発時間の短縮、開発費用の圧縮、及び高品質製品の提供が可能となる。
【図面の簡単な説明】
【図１】 モールド金型の一例の下型の上面図
【図２】 モールド金型の一例の断面図
【図３】 図２の拡大図
【符号の説明】
１ モールド金型
２ 上型
３ 下型
４ スプルー
５ 樹脂溜り
６ ランナー・ゲート
７ キャビティ
８ 凸部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mold used for evaluating a weld generated during resin molding and a weld evaluation method using the mold.
[0002]
[Prior art]
In a manufacturing process of a semiconductor device such as an IC or a transistor, a semiconductor element is mounted on a lead frame, an organic wiring board, or the like via an adhesive, and further electrically connected through a wire bonding process. Depending on the positional relationship between the constituent elements such as semiconductor elements and bonding wires, the resin flow is not uniform and there is a risk of welds. The occurrence of welds can be considered as a factor that induces not only defects in appearance but also imprinting defects and poor moisture resistance reliability.
In recent years, not only conventional lead frame type semiconductor devices but also single-side sealed semiconductor devices such as BGAs are increasing. A method of manufacturing a semiconductor device by batch forming and cutting into individual pieces in a later process is also becoming mainstream among BGAs. In the case of batch molding, in particular, since a plurality of semiconductor elements are arranged in the mold, the difference between the narrow path and the wide path tends to become significant when the resin flows.
Therefore, it is very important to evaluate the occurrence of welds when developing a mold resin, setting various conditions of the resin mold, properly arranging semiconductor elements, bonding wires, and selecting a wire.
[0003]
Conventional weld evaluation has been performed using actual semiconductor elements. That is, when assembling an actual semiconductor device, such as die bonding an IC chip, which is an actual semiconductor element, to an island portion of a lead frame, die bonding an IC chip on an organic wiring substrate, and then stretching a bonding wire There was no other way but to conduct experiments.
However, in this conventional evaluation method, the cost of the IC chip is high because it is very expensive, and it is necessary to mount the IC chip, wire bonding, etc., which requires a lot of man-hours and reduces the efficiency of the evaluation. There was a problem.
[0004]
[Problems to be solved by the invention]
In view of the conventional circumstances, an object of the present invention is to provide a low-cost and simple evaluation method for weld evaluation in a resin molding process without using an expensive IC chip. This evaluation method is effective as an alternative method for evaluating welds in TSOP and thin QFP as well as welds in batch molding. Further, this evaluation method is not limited to semiconductor sealing and molding, but is also extremely effective as a substitute evaluation for determining the ease of occurrence of welds in all mold resins.
[0005]
[Means for Solving the Problems]
Such an object is achieved by the present invention described in the following [1] to [ 5 ].
[1] A mold for use in evaluation of welds generated by a resin mold, which has a narrow path and a wide path having a thickness larger than that of the narrow path, and has two protrusions forming the narrow path in the mold cavity. possess on or more, the a ratio a / b of the thickness b of the thickness a of the mold the narrow passage of the Hiroji is 0.1 to 0.4, the thickness b of the Hiroji is 0.2. 0mm der is, the molding die in which one narrow path length c is characterized der Rukoto than 5mm in the mold.
[2] a prior ratio d / e of the width e of the width d the Hiroji of Kisemaro is less than 5, and the narrow passage of the flow path area a × d and the Hiroji flow path relationship area b × e Is a mold according to the item [1 ], wherein ad ≦ be is satisfied.
[ 3 ] Item [1] or [2 ] , wherein a gap distance f between the convex portions forming the narrow path of the mold is not more than ½ of the length c of the convex portions. Mold mold.
[ 4] A mold for use in evaluation of welds generated by a resin mold, which has a narrow path and a wide path having a thickness larger than the narrow path, and a convex portion that forms the narrow path is a central portion in the mold cavity. has two or more, from the runner gate, said Hiroji, first [1], characterized in that it is formed in order of the narrow road, [2], or [3] the molding die according to any one of Items .
[ 5 ] A method for evaluating a weld generated by a resin mold, the size of the weld generated after resin molding using the mold according to any one of [1] to [ 4 ]. A method for evaluating welds, characterized by observing the mode of occurrence.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The method of the present invention is characterized in that an expensive IC chip is not used, there is no need for mounting an IC chip, wire bonding, etc., and the evaluation efficiency is greatly improved. Unlike the evaluation using the actual element, the evaluation is made as an approximate value having no bonding wire and the volume to be sealed with the mold, but there is no problem in the analysis of the result.
Hereinafter, the mold according to the present invention and the weld evaluation method using the mold will be described in detail.
[0007]
The mold according to the present invention is a mold used for evaluation of welds generated by a resin mold, and it is essential to have a narrow path and a wide path having a thickness larger than that of the narrow path. Moreover, the mold die of this invention needs to have two or more convex parts which form a narrow path in the mold cavity. If the number of convex portions is one, it is difficult for welds to occur, and sufficient evaluation may not be possible. The number of convex portions is more desirably 3 or more. Moreover, the ratio a / b of the narrow path thickness a and the wide path thickness b of the mold of the present invention is 0.1 to 0.4, and the wide path thickness b is 0.2 to 1.0 mm. It is desirable that the narrow path length (= the length of the convex portion) c is 5 mm or more. If this range is exceeded, the filling pattern may change, and correct evaluation may not be possible.
Furthermore, it is desirable that the ratio d / e between the narrow path width d and the wide path width e of the mold of the present invention is less than 5. When d / e is 5 or more, the flow speeds of the narrow road and the wide road tend to be equal, and there is a possibility that the evaluation is not appropriate for weld evaluation. Furthermore, it is desirable that the relationship between the area a × d of the narrow path and the area b × e of the wide path satisfies ad ≦ be. If ad ≦ be is not satisfied, the flow area of the wide road is too small, and the flow speeds of the narrow road and the wide road tend to be equal, which may not be appropriate for weld evaluation. In addition, it is desirable that the gap distance f between the protrusions forming the narrow path of the mold of the present invention is 1/2 or less of the length c of the protrusions. If it exceeds 1/2, the filling pattern changes, and there is a possibility that it is not suitable for evaluation of welds.
[0008]
The weld evaluation method of the present invention is a method for evaluating welds generated by a resin mold, and after performing resin molding using the mold described above, the size of the generated weld and the generation mode are observed. It is characterized by this. Weld generated during resin molding in the actual semiconductor device manufacturing process is caused by the size of the flow path through which the sealing resin flows, and there are IC components (for example, lead frames, IC elements, bonding wires, etc.). By doing so, the size of the flow path changes. Since the sealing resin has thixotropy, the flow rate and flow velocity vary greatly depending on the flow path difference. This causes a resin wraparound phenomenon, resulting in welds. The size of the weld varies depending on the difference in the flow path, but there are many sizes of several tens of μm to several mm. A semiconductor device that is not single-sided sealed, such as a BGA, may have a larger size because a vertical shift phenomenon of components due to a weld phenomenon occurs.
[0009]
【Example】
Examples of the present invention are shown below, but the present invention is not limited thereto.
Examples 1-12, Comparative Example 1
The epoxy resin composition shown in Table 1 was mixed with a mixer, kneaded at 100 ° C. for 2 minutes using a hot roll, cooled and pulverized to obtain an epoxy resin molding material. A tablet of the resulting epoxy resin molding material was molded using a mold having the shape shown in FIG. 1 and the dimensions shown in Table 2, with a mold temperature of 175 ° C., an injection pressure of 9.8 MPa, and a curing time of 120 seconds. After transfer molding under the conditions, the weld was evaluated. For the evaluation of the weld, the appearance of the molded product taken out from the mold was visually confirmed. Modes that were hardly welded but were not filled were unfilled. The results are shown in Table 2.
[0010]
[Table 1]
[Table 2]
【The invention's effect】
According to the present invention, the weld in the resin molding process can be evaluated by a simple method at low cost without using an expensive IC chip as in the past. Therefore, according to the weld evaluation method of the present invention, it is possible to improve the productivity, shorten the development time, reduce the development cost, and provide a high-quality product in the production development of the resin resin for the IC package, the resin molding process, etc. Is possible.
[Brief description of the drawings]
FIG. 1 is a top view of a lower mold as an example of a mold. FIG. 2 is a cross-sectional view of an example of a mold as a mold. FIG. 3 is an enlarged view of FIG.
1
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2003153464A JP4300878B2 (en) | 2003-05-29 | 2003-05-29 | Mold and method for evaluating weld using the same |
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|---|---|---|---|
| JP2003153464A JP4300878B2 (en) | 2003-05-29 | 2003-05-29 | Mold and method for evaluating weld using the same |
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| JP2004351808A JP2004351808A (en) | 2004-12-16 |
| JP4300878B2 true JP4300878B2 (en) | 2009-07-22 |
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| WO2011064964A1 (en) * | 2009-11-24 | 2011-06-03 | 住友ベークライト株式会社 | Metal die for measuring flow characteristics, method for measuring flow characteristics, resin composition for sealing semiconductor, and method for manufacturing semiconductor device |
| JP6757767B2 (en) * | 2018-05-08 | 2020-09-23 | 石川樹脂工業株式会社 | Molding method of fiber reinforced molded product |
| CN110747101A (en) * | 2018-07-23 | 2020-02-04 | 浙江金仪盛世生物工程有限公司 | Disposable biological process bag, manufacturing method thereof and hot-melt type annular welding machine |
| KR102212595B1 (en) * | 2018-10-08 | 2021-02-05 | 주식회사 서연이화 | Injection mold for weldline analysis |
| KR102154154B1 (en) * | 2018-10-26 | 2020-09-09 | 주식회사 서연이화 | Injection mold for weldline analysis according to contact angle |
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