JPS61292330A - Semiconductor resin sealing device - Google Patents
Semiconductor resin sealing deviceInfo
- Publication number
- JPS61292330A JPS61292330A JP13467585A JP13467585A JPS61292330A JP S61292330 A JPS61292330 A JP S61292330A JP 13467585 A JP13467585 A JP 13467585A JP 13467585 A JP13467585 A JP 13467585A JP S61292330 A JPS61292330 A JP S61292330A
- Authority
- JP
- Japan
- Prior art keywords
- cull
- culls
- cavities
- runners
- semiconductor resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 238000007789 sealing Methods 0.000 title description 5
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 2
- 244000273928 Zingiber officinale Species 0.000 description 1
- 235000006886 Zingiber officinale Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000008397 ginger Nutrition 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、半導体樹脂封止装置（−関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a semiconductor resin sealing device (-).
従来、半導体樹脂封止装置として例えば第２図及び第３
図（＝示す下型１を備えたものが使用されている。下型
ＩＣ二は所定の製品を成型するためのキャビティ２が複
数個形成されている。Conventionally, as a semiconductor resin sealing device, for example, as shown in FIGS.
The one equipped with the lower mold 1 shown in the figure (=) is used. The lower mold IC 2 has a plurality of cavities 2 formed therein for molding a predetermined product.
キャビティ２は、第４図に示す如く、上型３のキャビテ
ィ４部とが一′体となって製品の路外形に等しい形状の
中空部を形成するようＩニなっている。相対向する一対
のキャビ−ティ２．４は・ランナー５を介して夫々のカ
ル部６（二遅通している。カル部６は、樹脂タブレット
７が投入されるポット８の底部に形成されている。而し
て、ポット８からカル部６、ランナー５を経てキャビテ
ィ２，３への樹脂の投入は、？ブト８内の樹脂タブレッ
ト１をプランジャー９にて圧入することにより行われて
いる。As shown in FIG. 4, the cavity 2 is shaped like an I-shape so that it is integrated with a cavity 4 portion of the upper die 3 to form a hollow portion having a shape equal to the outer shape of the product. A pair of cavities 2.4 facing each other pass through respective cull portions 6 (two holes) via runners 5. The cull portions 6 are formed at the bottom of the pot 8 into which the resin tablets 7 are placed. The resin is introduced into the cavities 2 and 3 from the pot 8 through the cull part 6 and the runner 5 by press-fitting the resin tablet 1 in the pot 8 with a plunger 9. .
しかしながら、夫々のカル部６は独立しているため樹脂
タブレット７０投入圧力はキャビティ２，３ごとに異な
る。このため、第５図Ｃ：示す如く、プランジャー９の
取付は部２：パ木部材１０等を設けて、デシンジャー９
の取付位置等Ｃ：よる投入圧力のばらつきを小さくする
ことが行われている。このため装置が複雑Ｃ二なり保守
管理作業が煩雑Ｃ二なる問題があった。また、成型後の
カルＪ１は、第６図Ｃ：示す如く、当然夫々のカル部６
ごと（：独立している。このためキャビティ２，３から
成型製品を取出して搬送する際にカル１１が落下したり
、或はカル１ノの取出作業は各々のカル１１ごとＣ二す
る必要があり、稼動率を著しく低下する問題があった。However, since the respective cull portions 6 are independent, the resin tablet 70 injection pressure differs between the cavities 2 and 3. For this reason, as shown in FIG.
C: Efforts are being made to reduce variations in input pressure due to mounting position, etc. For this reason, there was a problem that the device was complicated and the maintenance work was complicated. In addition, the cull J1 after molding is, as shown in Fig. 6C, of course, each cull part 6.
For this reason, when taking out the molded product from cavities 2 and 3 and transporting it, the cull 11 may fall, or it is necessary to remove each cull 11 from the cavities 2 and 3. However, there was a problem in that the operating rate was significantly reduced.
本発明は、稼動率の向上及び保守管理の簡略化を達成し
た半導体樹脂封止装置を提供することをその目的とする
ものである。An object of the present invention is to provide a semiconductor resin encapsulation device that achieves improved operating efficiency and simplified maintenance management.
本発明は、隣接するカル部を補助ランナーで連結したこ
とにより、稼動率の向上及び保守管理の簡略化を達成し
た半導体樹脂封止装置である。The present invention is a semiconductor resin encapsulation device that improves the operating rate and simplifies maintenance management by connecting adjacent cull portions with an auxiliary runner.
以下、本発明の実施例（二ついて図面を参照して説明す
る。第１図は、本発明の一実施例の平面図であり、半導
体樹脂封止装置を構成する金型の下型２Ｃを示している
。下型２０１”ニーは、成型製品を作るためのキャビテ
ィ２１が複数個設けられている。キャビティ２１は１図
示しない上型のキャビティ部と一体になって成型製品の
外形に略等しい中空部を形成するよう（ニなっている。Embodiments of the present invention will be described below with reference to the drawings. FIG. The lower mold 201'' knee is provided with a plurality of cavities 21 for making a molded product.The cavities 21 are integrated with a cavity portion of the upper mold (not shown) and have a shape approximately equal to the outer shape of the molded product. It is double-sided to form a hollow part.
相対向する夫々のキャビティ２１は、主ランナ−２２を
介してカル部２３に連通している。隣接するカル部２３
は、補助ランナー２４を介して一体；二連通している。The opposing cavities 21 communicate with a cull portion 23 via a main runner 22. Adjacent cull part 23
are integrally connected via the auxiliary runner 24.
夫々のカル部２３は、夫々の一ット（図示せず）の底部
（二形成されている。各々のキャビティ２１には、ポッ
ト内Ｃ二投入された樹脂タブレットが図示しないグジン
ジャーＣ二て抑圧されてカル部２３．主ランナ−２２を
順次介して圧入されるよう！ニなっている。Each cull part 23 is formed at the bottom (2) of each one (not shown). In each cavity 21, a resin tablet charged in the pot is filled with a Ginger C2 (not shown). It is pressed so that it is press-fitted sequentially through the cull portion 23 and the main runner 22.
このように構成された半導体樹脂封止装置（二よれば、
夫々のカル部２３が補助ランナー２４を介して一体に連
通しているので、プランジャーの取付位置等（二左右さ
れず（＝全てのキャビティ２１内も二はぼ均一な圧力で
樹脂を圧入することができる。このため高品質の成型製
品を容易（二得ることができる。しかも、プランジャー
にバネ部材等を取付ける必要がないので、装置の構造を
簡単なもの（ニジて、保守管理作業を軽減させることが
できる７また。成型後のカルは一体（：つながっている
ので、成型製品をキャビティ２１から取出して搬送する
際Ｃ二も、カルの落下による事故を防止できる。更Ｃ二
、カルの取出作業は全てのカルがつながっているので、
−回の取出作業２二より容易（：行うことができる。こ
れらの結果、装置の稼動率を著しく向上させることがで
きる。A semiconductor resin sealing device configured in this way (according to 2.
Since the respective cull portions 23 are integrally connected via the auxiliary runners 24, the plunger installation position, etc. (= the resin can be press-fitted into all cavities 21 with almost uniform pressure). As a result, high-quality molded products can be easily obtained.Furthermore, since there is no need to attach a spring member to the plunger, the structure of the device can be simplified (i.e., maintenance and management work can be simplified). 7 In addition, the cals after molding are connected, so when the molded product is taken out from the cavity 21 and transported, accidents caused by the cals falling can be prevented. Since all cals are connected in the extraction work,
- It is possible to carry out the extraction work 2 times more easily. As a result, the operating rate of the device can be significantly improved.
以上説明した如く、本発明Ｃ：係る半導体樹脂封止装置
によれば、稼動率の向上及び保守管理の簡略化を達成で
きるものである。As explained above, according to the present invention C: the semiconductor resin sealing device, it is possible to improve the operating rate and simplify maintenance management.
第１図は、本発明の一実施例の要部の平面図、第２図は
、従来の半導体樹脂封止装置の下型部の斜視図、第３図
は、同下型部の平面図、第４図は、従来の半導体樹脂封
止装置の断面図、第５図は、同半導体樹脂封止装置のプ
ランジャ一部の説明図、第６図は、同半導体樹脂封止装
置にて成型されたカルの状態を示す説明図である。
２０・・・下型、２１・−・キャビティ、２２・・・主
ランナ−，２３・・・カル部、２４・・・補助ランナー
。FIG. 1 is a plan view of essential parts of an embodiment of the present invention, FIG. 2 is a perspective view of the lower mold part of a conventional semiconductor resin encapsulation device, and FIG. 3 is a plan view of the lower mold part. , FIG. 4 is a cross-sectional view of a conventional semiconductor resin encapsulation device, FIG. 5 is an explanatory diagram of a part of the plunger of the same semiconductor resin encapsulation device, and FIG. 6 is a molding using the same semiconductor resin encapsulation device. FIG. 20...Lower mold, 21...Cavity, 22...Main runner, 23...Cull part, 24...Auxiliary runner.
Claims (1)
々の底部に設けられたカル部と、該カル部の隣接するも
の同志を連結する補助ランナーと、前記カル部の夫々か
ら導出した主ランナーと、該主ランナーの夫々に分枝し
て設けられたキャビティとを具備することを特徴とする
半導体樹脂封止装置。A plurality of pots arranged in the mold body, a cull section provided at the bottom of each pot, an auxiliary runner connecting adjacent cull sections, and a main pot derived from each of the cull sections. A semiconductor resin encapsulation device comprising a runner and a cavity branched from each of the main runners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13467585A JPS61292330A (en) | 1985-06-20 | 1985-06-20 | Semiconductor resin sealing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13467585A JPS61292330A (en) | 1985-06-20 | 1985-06-20 | Semiconductor resin sealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61292330A true JPS61292330A (en) | 1986-12-23 |
Family
ID=15133935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13467585A Pending JPS61292330A (en) | 1985-06-20 | 1985-06-20 | Semiconductor resin sealing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292330A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6328616A (en) * | 1986-07-23 | 1988-02-06 | Hitachi Micro Comput Eng Ltd | Molding equipment |
| JPH01205432A (en) * | 1987-04-27 | 1989-08-17 | Hitachi Ltd | Apparatus and method for manufacturing semiconductor element |
| JPH01235340A (en) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | Resin-sealing device for semiconductor |
| JPH01257338A (en) * | 1988-04-07 | 1989-10-13 | Hitachi Ltd | Semiconductor resin-sealing apparatus and semiconductor resin-sealing using same |
| US4946633A (en) * | 1987-04-27 | 1990-08-07 | Hitachi, Ltd. | Method of producing semiconductor devices |
| US4951122A (en) * | 1987-05-27 | 1990-08-21 | Hitachi, Ltd. | Resin-encapsulated semiconductor device |
| US4983110A (en) * | 1988-03-14 | 1991-01-08 | Hitachi, Ltd. | Resin encapsulating apparatus for semiconductor devices |
| JPH08267497A (en) * | 1996-04-22 | 1996-10-15 | Hitachi Microcomput Syst Ltd | Molding method for semiconductor device |
| JPH08335598A (en) * | 1996-07-22 | 1996-12-17 | Hitachi Ltd | Manufacture of semiconductor device |
| US6649447B1 (en) * | 1998-09-28 | 2003-11-18 | Cypress Semiconductor Corporation | Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames |
-
1985
- 1985-06-20 JP JP13467585A patent/JPS61292330A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6328616A (en) * | 1986-07-23 | 1988-02-06 | Hitachi Micro Comput Eng Ltd | Molding equipment |
| JPH0729326B2 (en) * | 1986-07-23 | 1995-04-05 | 日立マイクロコンピユ−タエンジニアリング株式会社 | Molding equipment |
| JPH01205432A (en) * | 1987-04-27 | 1989-08-17 | Hitachi Ltd | Apparatus and method for manufacturing semiconductor element |
| US4946633A (en) * | 1987-04-27 | 1990-08-07 | Hitachi, Ltd. | Method of producing semiconductor devices |
| US4951122A (en) * | 1987-05-27 | 1990-08-21 | Hitachi, Ltd. | Resin-encapsulated semiconductor device |
| US4983110A (en) * | 1988-03-14 | 1991-01-08 | Hitachi, Ltd. | Resin encapsulating apparatus for semiconductor devices |
| JPH01235340A (en) * | 1988-03-16 | 1989-09-20 | Hitachi Ltd | Resin-sealing device for semiconductor |
| JPH01257338A (en) * | 1988-04-07 | 1989-10-13 | Hitachi Ltd | Semiconductor resin-sealing apparatus and semiconductor resin-sealing using same |
| JPH08267497A (en) * | 1996-04-22 | 1996-10-15 | Hitachi Microcomput Syst Ltd | Molding method for semiconductor device |
| JPH08335598A (en) * | 1996-07-22 | 1996-12-17 | Hitachi Ltd | Manufacture of semiconductor device |
| US6649447B1 (en) * | 1998-09-28 | 2003-11-18 | Cypress Semiconductor Corporation | Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames |
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