JPH0729326B2 - Molding equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to a molding apparatus, and more particularly to a molding apparatus suitable for application to a transfer molding apparatus having a plurality of tablet pressing pots.

[Conventional technology]

Generally, a resin mold structure is adopted as a package of a semiconductor device, and this package is formed by a molding method using a transfer mold device or the like. Conventionally, in this type of molding device, a single pot that communicates with multiple cavities through a runner is provided, a resin tablet is placed in this pot, and this is pressed by a plunger, and the resin is pumped to each cavity through the runner. It is configured to do.

However, in this molding apparatus, the runner extending from the pot to each cavity becomes long, and the resin stopped at this runner is wasted, reducing the yield of the resin and causing the cost increase of the semiconductor device. .

For this reason, in recent years, a plurality of pots have been arranged in one molding device to reduce the number of cavities handled by these pots.
A molding apparatus has been proposed in which the length of a runner that communicates each cavity with each pot is shortened to reduce resin waste.

[Problems to be solved by the invention]

In the above-described molding apparatus having a plurality of pots, the plungers provided corresponding to the plurality of pots are pressed and driven by the same mechanism in order to simplify the structure. That is, the resin put into each pot is simultaneously pressed by each plunger, and the resin is pressure-fed to each cavity.

Therefore, if there is a difference in weight (volume) between the resin tablets put in each pot, the compression rate of the resin tablets in each pot is different, and this appears as a difference in the resin pressure pressed in each pot.

Therefore, even in the same molding apparatus, the resin mold pressures in the cavities are different, resulting in variations in the quality of the molded product, and in some cases, defective molding occurs in some parts.

In reality, it is almost impossible to manufacture or manage the resin tablets so that the weights of the resin tablets are uniform.

It is an object of the present invention to provide a molding apparatus capable of making the resin pressure in each cavity uniform and making the quality of a molded product uniform and improving the same.

The above and other objects and novel characteristics of the present invention are
It will be apparent from the description of the present specification and the accompanying drawings.

[Means for solving problems]

The outline of a typical one of the inventions disclosed in the present application will be briefly described as follows.

That is, a communication passage is formed in a plurality of pots connected to a plurality of cavities by a runner so that these pots communicate with each other, and the resin pressed in each pot is communicated with each other through this communication passage. It was done.

[Action]

According to the above-mentioned means, the resin pressed in each pot is communicated with each other through the communication passage, so that the pressing force of each resin is averaged through this communication passage, and the pressure is sent from each pot to the cavity in charge of each. The pressure of the resin to be applied can be made uniform.

〔Example〕

1 and 2 are a plan view of an embodiment of the present invention and the same.
FIG. 2 is a sectional view taken along line II-II.

In these figures, the molding apparatus comprises a lower mold 1 and an upper mold 2, and a large number of cavities 3 are formed at the interface between the upper mold 1 and the lower mold 2. Further, the lower mold 1 is configured such that the cavities 3 are divided into a plurality of groups, each group is provided with a pot 4, and each pot 4 is in charge of a predetermined number of cavities 3. The plurality of cavities 3 and the pots 4 are connected to each other by the runners 5 in each group, and the resin pressed by the pots 4 is pressure-fed to each of the cavities 3 through the runners 5. Needless to say.

The pot 4 is composed of a cylinder 6 into which a resin tablet can be inserted and a plunger 7 that is pressed in the cylinder 6. Each plunger 7 is connected to a drive mechanism 8 whose details are omitted, and all the plungers 7 are simultaneously pressed by the operation of the drive mechanism 8. The cylinders 6 of the plurality of pots 4 are provided with openings 9 in a part of their side walls, and a communication passage 10 communicating with the openings 9 allows the interiors of the cylinders 6 of the pots 4 to communicate with each other.

According to this configuration, by inserting the resin tablet R into each pot 4 and simultaneously driving each plunger 7 by the drive mechanism 8, the resin tablet R is pressed by the plunger 7 in each pot 4, and the resin is runner 5. Is pumped to each cavity 3 through.

At this time, since the inside of the cylinder 6 of each pot 4 is communicated with each other by the communication passage 10, each resin tablet R
Even if the weights of the pots are different and the pressing force of the plunger 7 is different, the resin in each pot is flowed through the communication passage 10 to make each pressure uniform. As a result, all the resin pressures in the pots 4 and the runners 5 communicating with the pots are made uniform and pressure-fed to the cavities 3, and a predetermined molding is performed. Therefore, the resin pressure in each cavity 3 is made uniform, and the quality of the molded product can be made uniform and improved.

According to the above-mentioned embodiment, the following effects can be obtained.

(1) Since a plurality of pots are communicated with each other using a communication passage, the resin pressing force in each pot is made uniform,
The resin pressure in the runner and the cavity communicating with this can be made uniform, and the quality of the molded product can be made uniform and the quality can be improved.

(2) Since a plurality of pots are provided and a large number of cavities are divided and handled by these pots, the runner that connects the pots and the cavities can be shortened, and resin waste can be reduced.

(3) Even if the plungers of a plurality of pots are operated by one drive mechanism, the resin pressure can be made uniform, and the structure of the molding apparatus can be simplified.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments and can be variously modified without departing from the scope of the invention. Nor. For example, the number and arrangement position of the pots can be changed arbitrarily, and the arrangement pattern of the communication passages can be changed arbitrarily.

In the above description, the case where the invention made by the present inventor is mainly applied to the molding apparatus of the resin mold for forming the package of the semiconductor element which is the field of application which is the background has been described, but the invention is not limited thereto. Instead, it can be applied to the case of molding various electronic components and all the molding of ordinary molded products.

〔The invention's effect〕

The following is a brief description of an effect obtained by the representative one of the inventions disclosed in the present application.

That is, a communication passage is formed in a plurality of pots that communicate with a plurality of cavities by a runner so that the pots communicate with each other, and the resins pressed in the pots are communicated with each other through the communication passages. Because
The resin pressed in each pot is communicated with each other through the communication passage, and the pressing force is averaged through this communication passage to make the pressure of the resin sent to each cavity uniform and to obtain a uniform quality of the molded product. And quality improvement.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II thereof. 1 ... lower mold, 2 ... upper mold, 3 ... cavity, 4 ... pot, 5 ... runner, 6 ... cylinder, 7 ... plunger, 8 ... driving mechanism, 9 ... opening, 10 ... … Communication passage, R…
… Resin tablets.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Fujio Ito 1479 Kamimizuhoncho, Kodaira-shi, Tokyo Hitachi Micro Computer Engineering Co., Ltd. (72) Inventor Kunihiko Nishi 1450, Kamimizuhonmachi, Kodaira-shi, Tokyo Hitachi, Ltd. Inside the Musashi Factory (72) Inventor Katsunori Tabata 1450, Kamimizuhonmachi, Kodaira-shi, Tokyo Inside the Musashi Factory, Hitachi Ltd.

Claims (3)

[Claims] 1. A molding apparatus comprising a plurality of pots arranged in a plurality of cavities, wherein a communication passage communicating with each of the pots is provided, and a resin pressed in each pot is A molding apparatus, which is configured to be communicated with each other through a communication path. 2. The pot according to claim 1, wherein a part of a cylinder side wall of the pot is opened, and a communication passage is connected through the opening.
The molding apparatus according to the item. 3. A plunger according to claim 2, wherein the plungers of the pots can be simultaneously operated by one driving mechanism.
The molding apparatus according to the item.