JPS6448432A - Molding die and manufacture of semiconductor device by using said die - Google Patents
Molding die and manufacture of semiconductor device by using said dieInfo
- Publication number
- JPS6448432A JPS6448432A JP20407287A JP20407287A JPS6448432A JP S6448432 A JPS6448432 A JP S6448432A JP 20407287 A JP20407287 A JP 20407287A JP 20407287 A JP20407287 A JP 20407287A JP S6448432 A JPS6448432 A JP S6448432A
- Authority
- JP
- Japan
- Prior art keywords
- air
- corners
- package
- semiconductor device
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To reduce the adhesion of a molding material onto an outer lead by forming air vent holes to a top force and a bottom force so that air is taken out of the eight corners of a package for a semiconductor device. CONSTITUTION:First air vent holes 4 are shaped at the four corners of a section forming the top face of a package 13 in an upper cavity 3, air in the upper cavity 3 passes through the outside of a top force 2, second air vent holes 7 are shaped at the four corners of a section forming the underside of the package in a lower cavity 6, and air in the lower cavity 6 passes through the outside of a bottom force 5. Consequently, air passing at the time of molding passes from the eight corners of cavities 3, 6 for shaping the package 13, thus preventing passing-through from outer leads 15 for a semiconductor device 12. Accordingly, the adhesion of a molding material onto the outer leads 15 can be reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20407287A JPS6448432A (en) | 1987-08-19 | 1987-08-19 | Molding die and manufacture of semiconductor device by using said die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20407287A JPS6448432A (en) | 1987-08-19 | 1987-08-19 | Molding die and manufacture of semiconductor device by using said die |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448432A true JPS6448432A (en) | 1989-02-22 |
Family
ID=16484301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20407287A Pending JPS6448432A (en) | 1987-08-19 | 1987-08-19 | Molding die and manufacture of semiconductor device by using said die |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448432A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02121910U (en) * | 1989-03-20 | 1990-10-04 | ||
JPH05196173A (en) * | 1991-11-27 | 1993-08-06 | Fuji Seiki Kk | Vacuum slide valve |
US11879506B2 (en) | 2018-08-09 | 2024-01-23 | Eagle Industry Co., Ltd. | Coupling |
-
1987
- 1987-08-19 JP JP20407287A patent/JPS6448432A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02121910U (en) * | 1989-03-20 | 1990-10-04 | ||
JPH05196173A (en) * | 1991-11-27 | 1993-08-06 | Fuji Seiki Kk | Vacuum slide valve |
US11879506B2 (en) | 2018-08-09 | 2024-01-23 | Eagle Industry Co., Ltd. | Coupling |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57147260A (en) | Manufacture of resin-sealed semiconductor device and lead frame used therefor | |
MY127378A (en) | Plastic molded type semiconductor device and fabrication process thereof | |
JPS6457738A (en) | Package for semiconductor device | |
JPS6448432A (en) | Molding die and manufacture of semiconductor device by using said die | |
JPS642329A (en) | Resin sealing metallic mold | |
JPS56103483A (en) | Manufacture of semiconductor device for photoelectric conversion | |
JPS55163866A (en) | Lead frame for semiconductor device | |
JPH0418826Y2 (en) | ||
JPS6439033A (en) | Tablet for sealing semiconductor | |
JPH02137219U (en) | ||
JPS61179746U (en) | ||
JPS6450454A (en) | Manufacture of lead frame and semiconductor device | |
JPS6167113U (en) | ||
JPS54143465A (en) | Manufacture of molded synthetic resin article | |
JPS5649547A (en) | Manufacture of semiconductor device | |
JPS6482643A (en) | Manufacture of resin sealed semiconductor device | |
JPS5724233A (en) | Integral molding method for tabular body | |
JPS574132A (en) | Manufacture of semiconductor device | |
JPS63159830U (en) | ||
JPS63164223U (en) | ||
JPS58184839U (en) | Resin mold equipment | |
JPH0262729U (en) | ||
JPS6439034A (en) | Sealing device for semiconductor resin | |
JPS54152972A (en) | Transfer molding method for semiconductor device | |
JPH01156016U (en) |