JPS6448432A - Molding die and manufacture of semiconductor device by using said die - Google Patents

Molding die and manufacture of semiconductor device by using said die

Info

Publication number
JPS6448432A
JPS6448432A JP20407287A JP20407287A JPS6448432A JP S6448432 A JPS6448432 A JP S6448432A JP 20407287 A JP20407287 A JP 20407287A JP 20407287 A JP20407287 A JP 20407287A JP S6448432 A JPS6448432 A JP S6448432A
Authority
JP
Japan
Prior art keywords
air
corners
package
semiconductor device
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20407287A
Other languages
Japanese (ja)
Inventor
Shoichi Kobayashi
Kazushi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP20407287A priority Critical patent/JPS6448432A/en
Publication of JPS6448432A publication Critical patent/JPS6448432A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the adhesion of a molding material onto an outer lead by forming air vent holes to a top force and a bottom force so that air is taken out of the eight corners of a package for a semiconductor device. CONSTITUTION:First air vent holes 4 are shaped at the four corners of a section forming the top face of a package 13 in an upper cavity 3, air in the upper cavity 3 passes through the outside of a top force 2, second air vent holes 7 are shaped at the four corners of a section forming the underside of the package in a lower cavity 6, and air in the lower cavity 6 passes through the outside of a bottom force 5. Consequently, air passing at the time of molding passes from the eight corners of cavities 3, 6 for shaping the package 13, thus preventing passing-through from outer leads 15 for a semiconductor device 12. Accordingly, the adhesion of a molding material onto the outer leads 15 can be reduced.
JP20407287A 1987-08-19 1987-08-19 Molding die and manufacture of semiconductor device by using said die Pending JPS6448432A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20407287A JPS6448432A (en) 1987-08-19 1987-08-19 Molding die and manufacture of semiconductor device by using said die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20407287A JPS6448432A (en) 1987-08-19 1987-08-19 Molding die and manufacture of semiconductor device by using said die

Publications (1)

Publication Number Publication Date
JPS6448432A true JPS6448432A (en) 1989-02-22

Family

ID=16484301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20407287A Pending JPS6448432A (en) 1987-08-19 1987-08-19 Molding die and manufacture of semiconductor device by using said die

Country Status (1)

Country Link
JP (1) JPS6448432A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02121910U (en) * 1989-03-20 1990-10-04
JPH05196173A (en) * 1991-11-27 1993-08-06 Fuji Seiki Kk Vacuum slide valve
US11879506B2 (en) 2018-08-09 2024-01-23 Eagle Industry Co., Ltd. Coupling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02121910U (en) * 1989-03-20 1990-10-04
JPH05196173A (en) * 1991-11-27 1993-08-06 Fuji Seiki Kk Vacuum slide valve
US11879506B2 (en) 2018-08-09 2024-01-23 Eagle Industry Co., Ltd. Coupling

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