JPH0262729U - - Google Patents
Info
- Publication number
- JPH0262729U JPH0262729U JP14125088U JP14125088U JPH0262729U JP H0262729 U JPH0262729 U JP H0262729U JP 14125088 U JP14125088 U JP 14125088U JP 14125088 U JP14125088 U JP 14125088U JP H0262729 U JPH0262729 U JP H0262729U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor
- coated
- semiconductor device
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す樹脂モールド
型半導体装置の縦断側面図、第２図はその成形金
型へのセツト状態を示す縦断側面図、第３図は従
来の樹脂モールド型半導体装置の成形金型へのセ
ツト状態を示す縦断側面図である。
１…基板、２…半導体ペレツト、３…リード、
４…モールド樹脂、５…突起、ａ…樹脂モールド
型半導体装置、ｂ…上金型、ｃ…下金型、ｄ…キ
ヤビテイ、ｅ…ポツト、ｆ…プランジヤ、ｇ…ラ
ンナ、ｈ…ゲート、ｉ…エアベント。
FIG. 1 is a vertical side view of a resin molded semiconductor device showing an embodiment of the present invention, FIG. 2 is a vertical side view of the device set in a mold, and FIG. 3 is a conventional resin molded semiconductor device. FIG. 3 is a vertical sectional side view showing a state in which the device is set in a molding die. 1...Substrate, 2...Semiconductor pellet, 3...Lead,
4...Mold resin, 5...Protrusion, a...Resin mold type semiconductor device, b...Upper mold, c...Lower mold, d...Cavity, e...Pot, f...Plunger, g...Runner, h...Gate, i ...air vent.
Claims (1)
とをワイヤボンデイングして、樹脂にて上記半導
体ペレツトを含む基板の全面を、半導体ペレツト
マウント面側の樹脂厚が反対側の樹脂厚より熱く
被覆した樹脂モールド型半導体装置において、 基板の半導体ペレツトマウント面側の一部に、
突起を固着したことを特徴とする樹脂モールド型
半導体装置。[Claim for Utility Model Registration] Semiconductor pellets mounted on a substrate and leads are wire bonded, and the entire surface of the substrate including the semiconductor pellets is coated with resin so that the thickness of the resin on the side where the semiconductor pellet is mounted is on the opposite side. In a resin molded semiconductor device coated hotter than the resin thickness, a portion of the semiconductor pellet mounting surface of the board is coated with
A resin molded semiconductor device characterized by fixed protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14125088U JPH0262729U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14125088U JPH0262729U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262729U true JPH0262729U (en) | 1990-05-10 |
Family
ID=31406158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14125088U Pending JPH0262729U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262729U (en) |
-
1988
- 1988-10-28 JP JP14125088U patent/JPH0262729U/ja active Pending
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