JPH0262728U - - Google Patents
Info
- Publication number
- JPH0262728U JPH0262728U JP14124988U JP14124988U JPH0262728U JP H0262728 U JPH0262728 U JP H0262728U JP 14124988 U JP14124988 U JP 14124988U JP 14124988 U JP14124988 U JP 14124988U JP H0262728 U JPH0262728 U JP H0262728U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor
- coated
- substrate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 230000001788 irregular Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案の一実施例を示す樹脂モールド
型半導体装置の縦断側面図、第2図はその成形金
型へのセツト状態を示す縦断側面図、第3図は従
来の樹脂モールド型半導体装置の成形金型へのセ
ツト状態を示す縦断側面図である。
1…基板、2…半導体ペレツト、3…リード、
4…モールド樹脂、5…凹凸条溝、a…樹脂モー
ルド型半導体装置、b…上金型、c…下金型、d
…キヤビテイ、e…ポツト、f…プランジヤ、g
…ランナ、h…ゲート、i…エアベント。
FIG. 1 is a vertical side view of a resin molded semiconductor device showing an embodiment of the present invention, FIG. 2 is a vertical side view of the device set in a mold, and FIG. 3 is a conventional resin molded semiconductor device. FIG. 3 is a vertical sectional side view showing a state in which the device is set in a molding die. 1...Substrate, 2...Semiconductor pellet, 3...Lead,
4...Mold resin, 5...Irregular grooves, a...Resin mold type semiconductor device, b...Upper mold, c...Lower mold, d
...Cavity, e...Pot, f...Plunger, g
...Runner, h...gate, i...air vent.
Claims (1)
とをワイヤボンデイングして、樹脂にて上記半導
体ペレツトを含む基板の全面を、半導体ペレツト
マウント面側の樹脂厚が反対側の樹脂厚より厚く
被覆した樹脂モールド型半導体装置において、 基板の半導体ペレツトマウント面側の一部に、
樹脂の流動方向と交差する溝を形成したことを特
徴とする樹脂モールド型半導体装置。[Claim for Utility Model Registration] Semiconductor pellets mounted on a substrate and leads are wire bonded, and the entire surface of the substrate including the semiconductor pellets is coated with resin so that the thickness of the resin on the side where the semiconductor pellet is mounted is on the opposite side. In a resin-molded semiconductor device that is coated thicker than the resin, a portion of the semiconductor pellet mounting surface of the substrate is coated with
A resin molded semiconductor device characterized in that a groove is formed that intersects the flow direction of resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14124988U JPH0262728U (en) | 1988-10-28 | 1988-10-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14124988U JPH0262728U (en) | 1988-10-28 | 1988-10-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0262728U true JPH0262728U (en) | 1990-05-10 |
Family
ID=31406156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14124988U Pending JPH0262728U (en) | 1988-10-28 | 1988-10-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0262728U (en) |
-
1988
- 1988-10-28 JP JP14124988U patent/JPH0262728U/ja active Pending
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