JPH01145135U - - Google Patents
Info
- Publication number
- JPH01145135U JPH01145135U JP4142588U JP4142588U JPH01145135U JP H01145135 U JPH01145135 U JP H01145135U JP 4142588 U JP4142588 U JP 4142588U JP 4142588 U JP4142588 U JP 4142588U JP H01145135 U JPH01145135 U JP H01145135U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- groove
- viewed
- embedded
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す樹脂モール
ド半導体装置の斜視図、第２図は第１図の―
線における断面図、第３図は第１図の上面図、第
４図は従来の樹脂モールド半導体装置の断面図で
ある。
図において、１は半導体チツプ、２はリードフ
レーム、３はモールド樹脂、４は溝である。なお
、図中、同一符号は同一、又は相当部分を示す。
FIG. 1 is a perspective view of a resin-molded semiconductor device showing an embodiment of this invention, and FIG. 2 is the same as that shown in FIG. 1.
3 is a top view of FIG. 1, and FIG. 4 is a sectional view of a conventional resin-molded semiconductor device. In the figure, 1 is a semiconductor chip, 2 is a lead frame, 3 is a molding resin, and 4 is a groove. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
平面方向から見て上面または下面に溝を形成した
ことを特徴とする半導体装置。 1. A semiconductor device characterized in that a groove is formed on the upper or lower surface of a molded resin body in which a semiconductor chip is embedded when viewed from a plane direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4142588U JPH01145135U (en) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4142588U JPH01145135U (en) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145135U true JPH01145135U (en) | 1989-10-05 |
Family
ID=31267859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4142588U Pending JPH01145135U (en) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145135U (en) |
-
1988
- 1988-03-28 JP JP4142588U patent/JPH01145135U/ja active Pending