JPH01120356U - - Google Patents
Info
- Publication number
- JPH01120356U JPH01120356U JP1474488U JP1474488U JPH01120356U JP H01120356 U JPH01120356 U JP H01120356U JP 1474488 U JP1474488 U JP 1474488U JP 1474488 U JP1474488 U JP 1474488U JP H01120356 U JPH01120356 U JP H01120356U
- Authority
- JP
- Japan
- Prior art keywords
- resin sheet
- insulating resin
- integrated circuit
- inner lead
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 description 1
Description
第１図は一実施例を示す平面図、第２図は第１
図のＡ−Ａ線位置での断面図、第３図は他の実施
例を示す断面図、第４図は従来の実装体を示す平
面図、第５図は第４図のＢ―Ｂ線位置での断面図
である。
１…ＩＣチツプ、３…リード、３ａ…インナー
リード、４，４ａ…絶縁性樹脂シート、７…ワイ
ヤ、８…封止用プラスチツク。
FIG. 1 is a plan view showing one embodiment, and FIG. 2 is a plan view showing one embodiment.
3 is a sectional view showing another embodiment, FIG. 4 is a plan view showing a conventional mounting body, and FIG. 5 is a sectional view taken along line BB in FIG. 4. It is a sectional view at the position. DESCRIPTION OF SYMBOLS 1... IC chip, 3... Lead, 3a... Inner lead, 4, 4a... Insulating resin sheet, 7... Wire, 8... Plastic for sealing.
Claims (1)
接着され、その絶縁性樹脂シート上に半導体集積
回路装置チツプが接着され、前記インナーリード
と前記半導体集積回路装置チツプ間にワイヤボン
デイングが施こされ、プラスチツクにて封止され
ている実装体。 An insulating resin sheet is bonded from the bottom of the inner lead, a semiconductor integrated circuit device chip is bonded onto the insulating resin sheet, wire bonding is performed between the inner lead and the semiconductor integrated circuit device chip, and the plastic Mounted body sealed with .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1474488U JPH01120356U (en) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1474488U JPH01120356U (en) | 1988-02-05 | 1988-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120356U true JPH01120356U (en) | 1989-08-15 |
Family
ID=31226220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1474488U Pending JPH01120356U (en) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120356U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151953A (en) * | 1984-08-22 | 1986-03-14 | Nec Corp | Semiconductor device |
| JPS62269325A (en) * | 1986-05-16 | 1987-11-21 | Mitsubishi Electric Corp | Semiconductor device |
-
1988
- 1988-02-05 JP JP1474488U patent/JPH01120356U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151953A (en) * | 1984-08-22 | 1986-03-14 | Nec Corp | Semiconductor device |
| JPS62269325A (en) * | 1986-05-16 | 1987-11-21 | Mitsubishi Electric Corp | Semiconductor device |