JPH0252338U - - Google Patents
Info
- Publication number
- JPH0252338U JPH0252338U JP12867488U JP12867488U JPH0252338U JP H0252338 U JPH0252338 U JP H0252338U JP 12867488 U JP12867488 U JP 12867488U JP 12867488 U JP12867488 U JP 12867488U JP H0252338 U JPH0252338 U JP H0252338U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- protective resin
- copper foil
- holding
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 3
- 230000002787 reinforcement Effects 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図はこの考案の一実施例に係り
、第１図Ａは半導体装置の要部拡大平面図、第１
図Ｂは半導体装置の概略断面図、第２図はベース
フイルム上に半導体素子を搭載したテープを示す
平面図、第３図は従来例のテープを示す平面図、
第４図Ａ及び第４図Ｂは従来例の半導体装置を示
す要部拡大平面図、第５図Ａ及び第５図Ｂは従来
例の半導体装置を示す概略断面図である。
２１……ベースフイルム、２３……デバイスホ
ール、２４……銅箔リード、２５……テープ、２
６……半導体素子、２８……樹脂、２９……半導
体装置、３０……膨大部。
1 and 2 relate to one embodiment of this invention, FIG. 1A is an enlarged plan view of the main part of the semiconductor device, and FIG.
Figure B is a schematic cross-sectional view of a semiconductor device, Figure 2 is a plan view showing a tape with semiconductor elements mounted on a base film, and Figure 3 is a plan view showing a conventional tape.
4A and 4B are enlarged plan views of essential parts of a conventional semiconductor device, and FIGS. 5A and 5B are schematic cross-sectional views of the conventional semiconductor device. 21...Base film, 23...Device hole, 24...Copper foil lead, 25...Tape, 2
6... Semiconductor element, 28... Resin, 29... Semiconductor device, 30... Bulk part.
Claims (1)
ルムに形成されたデバイスホール上に半導体素子
を搭載する一方、前記フイルム上に形成された銅
箔リードと半導体素子とを接続し、この半導体素
子を保護樹脂で封止するものであつて、前記半導
体素子に近接した銅箔リードの一部に、補強用と
前記保護樹脂を半導体素子表面から側方へ膨出保
持させる樹脂保持用とを兼ねた膨大部を形成した
ことを特徴とする半導体装置。 A semiconductor element is mounted on a device hole formed in a film for tape automated bonding, while a copper foil lead formed on the film is connected to the semiconductor element, and this semiconductor element is sealed with a protective resin. A swelled portion is formed in a part of the copper foil lead close to the semiconductor element, which serves both for reinforcement and for holding the protective resin by bulging and holding the protective resin laterally from the surface of the semiconductor element. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12867488U JPH0252338U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12867488U JPH0252338U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252338U true JPH0252338U (en) | 1990-04-16 |
Family
ID=31382235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12867488U Pending JPH0252338U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252338U (en) |
-
1988
- 1988-09-30 JP JP12867488U patent/JPH0252338U/ja active Pending
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