JPH01160844U - - Google Patents
Info
- Publication number
- JPH01160844U JPH01160844U JP4898688U JP4898688U JPH01160844U JP H01160844 U JPH01160844 U JP H01160844U JP 4898688 U JP4898688 U JP 4898688U JP 4898688 U JP4898688 U JP 4898688U JP H01160844 U JPH01160844 U JP H01160844U
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- resin
- semiconductor device
- power semiconductor
- laterally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000009434 installation Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す電力半導体装
置の上面図、第２図は他の実施例を示す枠体上面
図、第３図は同枠体下面図、第４図は従来例を示
す電力半導体装置の断面図、第５図は同上面図、
第６図は取付け時を説明する側面図である。
１…電力回路基板、２…枠体、１２…補強部。
Fig. 1 is a top view of a power semiconductor device showing one embodiment of the present invention, Fig. 2 is a top view of a frame showing another embodiment, Fig. 3 is a bottom view of the frame, and Fig. 4 is a conventional example. FIG. 5 is a top view of the power semiconductor device;
FIG. 6 is a side view illustrating the installation. DESCRIPTION OF SYMBOLS 1... Power circuit board, 2... Frame body, 12... Reinforcement part.
Claims (1)
体装置において、前記外枠の上面部に縦横に延び
る補強部を一体成形してなることを特徴とする電
力半導体装置。 1. A power semiconductor device of a resin-sealed type including an outer frame for resin injection, characterized in that reinforcing portions extending vertically and laterally are integrally molded on the upper surface of the outer frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4898688U JPH01160844U (en) | 1988-04-12 | 1988-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4898688U JPH01160844U (en) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160844U true JPH01160844U (en) | 1989-11-08 |
Family
ID=31275108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4898688U Pending JPH01160844U (en) | 1988-04-12 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160844U (en) |
-
1988
- 1988-04-12 JP JP4898688U patent/JPH01160844U/ja active Pending