JPH01171044U - - Google Patents
Info
- Publication number
- JPH01171044U JPH01171044U JP6919288U JP6919288U JPH01171044U JP H01171044 U JPH01171044 U JP H01171044U JP 6919288 U JP6919288 U JP 6919288U JP 6919288 U JP6919288 U JP 6919288U JP H01171044 U JPH01171044 U JP H01171044U
- Authority
- JP
- Japan
- Prior art keywords
- round bar
- bar lead
- jig
- semiconductor device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す半導体装置
の斜視図、第２図は第１図の側面図、第３図は従
来の半導体装置の斜視図、第４図は第３図の側面
図、第５図は従来のボンデイング部の拡大斜視図
である。
図において、１……丸棒リード、２……上型治
具、３……下型治具、４……上下型締付ねじ、５
……治具持上げねじ、６……シリコンゴム、７…
…モールド樹脂、８……ボンデイング部である。
なお、図中、同一符号は同一、または相当部分を
示す。
Fig. 1 is a perspective view of a semiconductor device showing an embodiment of this invention, Fig. 2 is a side view of Fig. 1, Fig. 3 is a perspective view of a conventional semiconductor device, and Fig. 4 is a side view of Fig. 3. FIG. 5 is an enlarged perspective view of a conventional bonding section. In the figure, 1...Round bar lead, 2...Upper die jig, 3...Lower die jig, 4...Upper and lower die tightening screw, 5
...Jig lifting screw, 6...Silicon rubber, 7...
...Mold resin, 8...Bonding part.
In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ムを介し締め付けて組立を行なう半導体装置にお
いて、前記丸棒リードを前記治具に締め付けたの
ち前記丸棒リードをモールド樹脂で固めたことを
特徴とする半導体装置。 A semiconductor device in which a round bar lead is assembled by tightening it to a jig consisting of an upper and lower mold through silicone rubber, characterized in that after the round bar lead is tightened to the jig, the round bar lead is hardened with a molding resin. semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6919288U JPH01171044U (en) | 1988-05-24 | 1988-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6919288U JPH01171044U (en) | 1988-05-24 | 1988-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171044U true JPH01171044U (en) | 1989-12-04 |
Family
ID=31294477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6919288U Pending JPH01171044U (en) | 1988-05-24 | 1988-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171044U (en) |
-
1988
- 1988-05-24 JP JP6919288U patent/JPH01171044U/ja active Pending