JPS642329A - Resin sealing metallic mold - Google Patents
Resin sealing metallic moldInfo
- Publication number
- JPS642329A JPS642329A JP15806387A JP15806387A JPS642329A JP S642329 A JPS642329 A JP S642329A JP 15806387 A JP15806387 A JP 15806387A JP 15806387 A JP15806387 A JP 15806387A JP S642329 A JPS642329 A JP S642329A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- filled
- vent
- resin sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE:To assure a resin sealing process with high precision without any cavity or recession at all avoiding any region not filled with resin yet by a method wherein a vent running outside is provided on the part near the final filled in part of a cavity. CONSTITUTION:A leadframe 7 loaded with a semiconductor chip 6 is fixed on the fitting surface of a top force 1 and a bottom force 2 while resin is filled in a cavity 3 from a gate 4 through a filling route 8. The air inside the cavity 3 is exhausted outside through a vent 5 as the resin is filled in the cavity 3 to make the resin filling process smooth. Furthermore, if the resin filling process is stopped with excessive resin filled in the vent 5, there is no risk of causing any region not filled yet inside the cavity 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15806387A JPS642329A (en) | 1987-06-24 | 1987-06-24 | Resin sealing metallic mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15806387A JPS642329A (en) | 1987-06-24 | 1987-06-24 | Resin sealing metallic mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH012329A JPH012329A (en) | 1989-01-06 |
JPS642329A true JPS642329A (en) | 1989-01-06 |
Family
ID=15663488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15806387A Pending JPS642329A (en) | 1987-06-24 | 1987-06-24 | Resin sealing metallic mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS642329A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0482236A (en) * | 1990-07-25 | 1992-03-16 | Toowa Kk | Method and apparatus for resin sealing and molding of electronic component |
JP2010258049A (en) * | 2009-04-22 | 2010-11-11 | Sanyo Electric Co Ltd | Solid electrolytic capacitor |
-
1987
- 1987-06-24 JP JP15806387A patent/JPS642329A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0482236A (en) * | 1990-07-25 | 1992-03-16 | Toowa Kk | Method and apparatus for resin sealing and molding of electronic component |
JP2010258049A (en) * | 2009-04-22 | 2010-11-11 | Sanyo Electric Co Ltd | Solid electrolytic capacitor |
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