JPS56103483A - Manufacture of semiconductor device for photoelectric conversion - Google Patents

Manufacture of semiconductor device for photoelectric conversion

Info

Publication number
JPS56103483A
JPS56103483A JP545180A JP545180A JPS56103483A JP S56103483 A JPS56103483 A JP S56103483A JP 545180 A JP545180 A JP 545180A JP 545180 A JP545180 A JP 545180A JP S56103483 A JPS56103483 A JP S56103483A
Authority
JP
Japan
Prior art keywords
conversion unit
legs
chip
photoelectric conversion
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP545180A
Other languages
Japanese (ja)
Inventor
Takeo Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP545180A priority Critical patent/JPS56103483A/en
Publication of JPS56103483A publication Critical patent/JPS56103483A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes

Abstract

PURPOSE:To precisely position a lens means by a method wherein when a transparent resin is molded to permit the lens means to be formed on the photoelectric conversion unit by using a metal for a chip which is formed with the photoelectric conversion unit on the surface, legs of electrodes die-bonded with the chip are inserted into the concave formed on the metal mold. CONSTITUTION:The photoelectric conversion unit 2 is burried in the concave formed on the surface of the chip 1, with the surface being made smooth, and electrodes fitted each on the unit 2 are connected to the legs 9 of the electrodes respectively by means of wireless bonding. Then, with the legs 9 of the electrodes being projected outside, the chip 1 on the top surface is arranged with an injection opening 13 for transparent resin of silicon, epoxy and the like and an upper metal mold having a concave 12 for forming the lens corresponding to the conversion unit 2 and the chip 1 on the bottom surface with a lower metal mold 11 to permit the lens means to be produced on the conversion unit 2 by the resin injected. With this construction, concaves 15, 16 for holding the legs 9 are formed on the contact surfaces of the metal molds 10 and 11, and the legs 9 are held through rubber 17 to cause the lens means to correctly be corresponded to the conversion unit 2.
JP545180A 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion Pending JPS56103483A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP545180A JPS56103483A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP545180A JPS56103483A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Publications (1)

Publication Number Publication Date
JPS56103483A true JPS56103483A (en) 1981-08-18

Family

ID=11611567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP545180A Pending JPS56103483A (en) 1980-01-21 1980-01-21 Manufacture of semiconductor device for photoelectric conversion

Country Status (1)

Country Link
JP (1) JPS56103483A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01176954U (en) * 1988-06-01 1989-12-18
JP2007524243A (en) * 2004-02-27 2007-08-23 ヘプタゴン・オサケ・ユキチュア Micro-optical equipment by optoelectronics
JP2011009408A (en) * 2009-06-25 2011-01-13 Ricoh Co Ltd Electronic component module and manufacturing method
JP2018511069A (en) * 2015-02-10 2018-04-19 ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング Image recording system and automobile
EP3611913A4 (en) * 2017-04-12 2020-03-04 Ningbo Sunny Opotech Co., Ltd. Camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01176954U (en) * 1988-06-01 1989-12-18
JP2007524243A (en) * 2004-02-27 2007-08-23 ヘプタゴン・オサケ・ユキチュア Micro-optical equipment by optoelectronics
JP4903685B2 (en) * 2004-02-27 2012-03-28 ヘプタゴン・オサケ・ユキチュア Method for manufacturing an integrated optical system
JP2011009408A (en) * 2009-06-25 2011-01-13 Ricoh Co Ltd Electronic component module and manufacturing method
JP2018511069A (en) * 2015-02-10 2018-04-19 ローベルト ボッシュ ゲゼルシャフト ミット ベシュレンクテル ハフツング Image recording system and automobile
US10321034B2 (en) 2015-02-10 2019-06-11 Robert Bosch Gmbh Image recording system and a motor vehicle
EP3611913A4 (en) * 2017-04-12 2020-03-04 Ningbo Sunny Opotech Co., Ltd. Camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
US11094727B2 (en) 2017-04-12 2021-08-17 Ningbo Sunny Opotech Co., Ltd. Camera module, molding photosensitive assembly thereof, manufacturing method thereof and electronic device

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