JPS6311723Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to the improvement of a mold device for resin-encapsulated molding of semiconductor elements, and is particularly noticeable when used in the field of manufacturing industry of resin-encapsulated molded products such as light emitting diodes. It has the following effects.

By the way, the light emitting diode is
As shown in the figure, two leads A ₁ and A ₂ and a semiconductor element B attached to one of the leads A ₁ ,
A lead wire (gold wire) C that electrically connects the element and the other lead _A2 , and the outer periphery of the two leads _A1 and _A2 , the element B, and the lead wire C are made of a transparent resin material. It is customary to be formed from a transparent body D which is densely coated with a transparent body D. Further, a lens surface D ₁ formed in a required spherical shape is provided protruding from the light emitting surface of the light emitting diode, that is, the light emitting surface portion _of the transparent body D.
The transparent body D having the above shape is molded by injecting a transparent resin material into a cavity in a resin molding mold device.

As a conventional mold apparatus for molding resin molded products of this type, those shown in FIGS. 3 to 5 are known. That is, this conventional device has a fixed upper mold 1
, a movable lower mold 2 disposed vertically movably opposite to the fixed upper mold, a cavity 3 for resin-encapsulating a semiconductor element provided between the two molds, and a resin material communicated with the cavity. It consists of an injection gate 4 and a molten resin material transfer path 5 such as a runner ₅₁ communicated with the gate. The cavity portion 3 is composed of a cavity 3 ₁ formed on the fixed upper mold 1 side and a cavity 3 ₂ formed on the movable lower mold 2 side, and a lower mold cavity 3 ₂
At the specified position, the lens surface of the resin molded product is
A spherical recess 3 ₃ for forming D ₁ is formed. In addition, at the upper position of the upper mold cavity 3 ₁ and at both the upper and lower positions of the runner 5 ₁ , when the mold is opened,
A resin molded product molded within the cavity part 3,
Projecting pins 6, 7, and 8 are provided for projecting the gate 4 and the cold slugs solidified and formed in the transfer paths 5, ₅₁ between the molds 1 and 2, respectively. Therefore, when performing resin encapsulation molding of semiconductor elements using such conventional equipment, first, the lead frames (A ₁ and A ₂ ) are set in the predetermined positions of the lower mold 2, and then the molds 1 and 2 are clamped. Next, a transparent resin material D' melted by heating and pressurization is injected into the cavity part 3 through the transfer path 5 (runner 5 ₁ ) and gate 4, and after the required time has elapsed, , the mold is opened and the molded product and the cold slug are ejected using the ejecting pins 6, 7, and 8. Here, when the lead frame is set in the predetermined position, the semiconductor element B mounted on the lead frame _A1 is placed in the recess _33.
It is required to be supported so as to protrude downward at a position above the . Also, in this state, the cavity part 3
The resin molding of the transparent body D is carried out by
D' flows into the lower mold cavity 3 ₂ side due to its own weight, and then is sequentially filled into the upper mold cavity 3 ₁ side. However, in such a conventional device, the mounting portions of the lead frames A ₁ and A ₂ and the cavity portion 3 are arranged horizontally on the parting lines P and L of the upper mold 1 and the lower mold 2. Due to the structure, the molten resin injected into the cavity part 3
As shown in Fig. 5, D' is filled in a horizontal manner in order, but the general property is that the molten resin D' easily flows into the thick part of the molding and is difficult to flow into the thin part of the molding.・Because of this tendency, there are disadvantages such as unfilled state E of resin D′ or voids (bubbles) easily formed due to residual air inside the upper mold cavity ₃₁ , which has a small capacity. . For example, as shown in FIG. 2, such a problem arises when the distance between the back surface of the transparent body D and the lens surface _D1 is determined to be a predetermined length due to various constraints, and By setting the distance 1 between the mounting surface of element B of the lead frame and the lens surface D ₁ as long as possible within the length range, _{the distance 2 between} the back surface of the transparent body D and the lead frame becomes This problem is particularly noticeable when the resin molded product is short (thin), and is considered to be a serious drawback that significantly reduces the reliability of this type of resin molded product.

The purpose of the present invention is to easily and reliably flow the molten resin into the thin molded part constructed in the cavity, thereby completely encapsulating the lead and the semiconductor element with resin. It is something.

The device of the present invention includes a fixed upper mold, a movable lower mold that is vertically movable opposite the fixed upper mold, and a resin molding cavity and a lead frame arranged on the parting line surfaces of both the upper and lower molds. In a mold device for resin encapsulation molding of a semiconductor element, the mold device is equipped with a mounting part,
The above cavity part and lead frame mounting part,
The present invention relates to a mold device for resin-encapsulating semiconductor elements, characterized in that the mold device is arranged in an inclined manner in an upward direction from the cavity side toward the lead frame mounting portion side.

Hereinafter, the present invention will be explained based on the embodiment diagrams shown in FIGS. 6 to 8.

FIG. 6 shows a mold device, which consists of a fixed upper mold 11, a movable lower mold 12 installed vertically movably opposite the fixed upper mold, and a movable lower mold 12 installed between the two molds. Cavity part 1 for resin encapsulation molding of semiconductor elements
3, a resin material injection gate 14 communicating with the cavity, and a runner 1 communicating with the gate.
5 and a transfer path 15 for the molten resin material such as ₁ . The cavity portion 13 is composed of a cavity 13 ₁ formed on the fixed upper mold 11 side and a cavity 13 ₂ formed on the movable lower mold 12 side, and at required positions of the lower mold cavity 13 ₂ . A spherical recess 13 ₃ is formed to form a lens surface D ₁ in the resin molded product.
In addition, at the upper position of the upper mold capi ty 13 ₁ and at both the upper and lower positions of the runner 15 ₁ , when the mold is opened,
The resin molded product formed in the cavity part 13 and the cold slug solidified and formed in the gate 14 and the transfer path 15, ₁₅ are placed in both molds 11 and 1.
Projection pins 16, 17, 18 for projecting between the two
are arranged respectively. However, both types 11 and 11.
On the parting line P and L surfaces of No. 12, mounting portions 19 for the lead frames A ₁ and A ₂ to which semiconductor elements B are attached, and the cavity portion 13 for molding the semiconductor elements with resin are attached to the cavity. It is arranged in an inclined manner in an upward direction from the lead frame mounting part side toward the lead frame mounting part side. In addition, in the figure, the reference numeral 20 indicates the lead frames A ₁ and A _{2 .}
21 is a push-up pin of the loading frame, and 22 and 23 are an upper return pin and a lower return pin, respectively.

The resin molding action of the mold device having the above configuration is as follows:
The molding action is the same as that in the conventional device described above, but the parting lines P and L of both dies 11 and 12 are
Lead frame with semiconductor element B attached to its surface
The mounting part 19 of A ₁ and A ₂ and the cavity part 13 for molding resin encapsulation of the element are arranged in an inclined manner in an upward direction from the cavity part side toward the lead frame mounting part side. As a result, the following remarkable effects occur. That is, the molten resin D'' injected into the cavity 13 flows into the lower mold cavity 13 ₂ side due to its own weight, and then flows to the upper mold cavity 13 ₁ side, as shown in FIG. 8.
Filling is performed horizontally in order, but the above-mentioned cavity part 1
3 is provided in an inclined manner, so that the molten resin
The molten resin D'' is gradually and horizontally filled from the tip side of the lead frames _A1 and _A2 to which the semiconductor element B is attached, and as shown in the figure, the molten resin D'' is filled in the cavity part 13. A completely filled state of `` is obtained.

In addition, in the forming action of conventional equipment,
As mentioned above, the molten resin is poured from the bottom to the top of the horizontally set lead frames _A1 and _A2 .
Since D' is sequentially filled (Fig. 5), when the molten resin D' flows from the lower surface of the lead frame (i.e., the mounting surface of semiconductor element B) to the upper surface thereof,
Since the residual air in this part is drawn in and the air forms voids in the molding resin, there are negative effects such as loss of strength and reliability of the molded product, but in the molding action of the device of the present invention, teeth,
Since the molten resin D'' is sequentially filled horizontally from below the tips of the lead frames _A1 and _A2 set in an inclined manner toward the obliquely upward direction, the molten resin D'' shown in FIG. This suppresses or eliminates the effect of wraparound toward the upper surface of the lead frame, and therefore efficiently prevents the formation of voids.

As described above, when using the device of the present invention, the molten resin can easily and reliably flow into and fill the thin molded parts such as the upper mold cavity configured in the cavity. This provides excellent practical effects such as being able to completely encapsulate the molded product and the semiconductor element with resin, thereby improving the strength and reliability of the molded product. In addition, in the device of the present invention, the residual air in the cavity can be easily discharged to the outside through an air vent, etc., so that voids or pinholes are not formed on the outer surface of the transparent body by the residual air. This has the effect that it is possible to reliably prevent the molding from occurring, and therefore, it is possible to provide a mold device that is optimal for molding this type of molded product that requires high precision and high quality. .

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway perspective view showing a resin-filled molded product for semiconductor elements such as light emitting diodes, Fig. 2 is a partially cutaway vertical side view thereof, and Figs. 3 to 5 are conventional resin-filled molds. Fig. 3 is a longitudinal side view of the apparatus, Fig. 4 is an enlarged longitudinal side view of the main parts of the apparatus, and Fig. 5 shows the resin molding action of the apparatus. The explanatory drawings, FIGS. 6 to 8, show an embodiment of the device of the present invention. FIG. 6 is a vertical side view of the device, and FIG. 7 is a vertical side view showing an enlarged main part of the device. , and FIG. 8 are explanatory diagrams of the resin molding action in the apparatus. A ₁・A ₂ ……Lead (lead frame), B……
Semiconductor element, P/L...parting line, 1
1... Fixed upper mold, 12... Movable lower mold, 13... Cavity part, 19... Lead frame mounting part.

Claims (1)

[Scope of utility model registration request] A fixed upper mold, a movable lower mold that is vertically movable opposite the fixed upper mold, and a resin molding cavity part and a lead frame mounting part arranged on the parting line surfaces of both the upper and lower molds. In the mold apparatus for resin-encapsulating semiconductor elements, the cavity portion and the lead frame mounting portion are arranged in an inclined manner in an upward direction from the cavity portion side toward the lead frame mounting portion side. A mold device for resin-encapsulating semiconductor devices, characterized by: