WO2005078807A1 - Photoelectric conversion plug and photoelectric conversion module using it, and production method for photoelectric conversion plug - Google Patents

Photoelectric conversion plug and photoelectric conversion module using it, and production method for photoelectric conversion plug Download PDF

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Publication number
WO2005078807A1
WO2005078807A1 PCT/JP2005/001373 JP2005001373W WO2005078807A1 WO 2005078807 A1 WO2005078807 A1 WO 2005078807A1 JP 2005001373 W JP2005001373 W JP 2005001373W WO 2005078807 A1 WO2005078807 A1 WO 2005078807A1
Authority
WO
WIPO (PCT)
Prior art keywords
photoelectric conversion
plug
conversion plug
optical
conversion element
Prior art date
Application number
PCT/JP2005/001373
Other languages
French (fr)
Japanese (ja)
Inventor
Shinji Harada
Jun'ichi Kimura
Kouji Nomura
Akira Ishikawa
Kazunari Kawabe
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004039401A external-priority patent/JP2005235815A/en
Priority claimed from JP2004039402A external-priority patent/JP2005233995A/en
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO2005078807A1 publication Critical patent/WO2005078807A1/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4251Sealed packages
    • G02B6/4253Sealed packages by embedding housing components in an adhesive or a polymer material
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4255Moulded or casted packages
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Definitions

  • Photoelectric conversion plug photoelectric conversion module using the same, and method of manufacturing the photoelectric conversion plug
  • the present invention relates to, for example, a photoelectric conversion plug used in an optical transmission system, a photoelectric conversion module using the same, and a method for manufacturing the photoelectric conversion plug.
  • Optical transmission systems which have excellent characteristics such as low noise and broadband, have been widely used for wiring of automobiles, audios and other consumer devices as well as communications and cable televisions. I have.
  • FIG. 6 is a cross-sectional view showing a conventional photoelectric device used for an optical transmission system.
  • the photoelectric conversion element 30 emits light or receives light.
  • the photoelectric conversion element 30 is attached to the lead frame 31.
  • the first envelope 32 is formed by molding a part of the lead frame 31 to which the photoelectric conversion element 30 is attached with epoxy resin or the like.
  • the optical connector 33 is composed of a flange 34 and an optical fiber cord 35 connected to the flange 34.
  • the end face 36a of the optical fiber 36 coated on the optical fiber cord 35 is optically polished.
  • the second envelope 37 couples the first envelope 32 and the flange 34, and optically couples the photoelectric conversion element 30 and the end face 36a of the optical fiber 36.
  • the circuit board 38 mounts the lead frame 31 extending from the first envelope 32.
  • the pins 39 are for stably mounting the second envelope 37 on the circuit board 38 and are implanted in the second envelope 37.
  • the following operation is required to optically couple the photoelectric conversion element 30 and the end face 36a of the optical fiber 36. That is, with the optical connector 33 snapped into the second envelope 37, the first envelope 32 is incorporated into the second envelope 37, and light is emitted or collected from the end face 36a of the optical fiber 36. Light and photoelectric conversion element 30 The position of the photoelectric conversion element 30 must be adjusted so that light is optically coupled.
  • the "optical axis alignment work” for adjusting the position of the first envelope 32 in which the photoelectric conversion element 30 is molded and performing optical coupling is performed. You will need it. In this "optical axis alignment work”, very precise work is required because the optical axes of the photoelectric conversion element 30 and the end face 36a of the optical fiber 36 must be aligned. Further, after this “optical axis alignment work”, a work of fixing the first envelope 32 to the second envelope 37 must be performed.
  • the present invention solves such a conventional problem, realizes an optical axis alignment with a simple method, realizes a photoelectric conversion plug with good productivity, and realizes a low-cost photoelectric conversion plug and a photoelectric conversion plug.
  • the purpose is to provide a conversion module.
  • the photoelectric conversion plug of the present invention is provided adjacent to the photoelectric conversion element, an optical lens unit for condensing an optical signal output from the photoelectric conversion element on an optical fiber, and the optical lens unit. And a fiber holding portion provided at an end of the lens barrel portion for supporting an optical fiber, wherein the optical lens portion, the lens barrel portion, and the fiber holding portion are covered with a resin. It is characterized in that it is integrally molded and a photoelectric conversion element is disposed inside the resin molded body.
  • a photoelectric conversion module of the present invention includes a photoelectric conversion plug, a substrate on which the photoelectric conversion plug is mounted, and a signal processing circuit mounted on the substrate. It has.
  • the optical lens unit, the lens barrel unit, and the holding unit supporting the optical fiber are integrally formed as a photoelectric conversion plug with a resin.
  • the photoelectric conversion element is disposed inside the resin molded body, and this configuration facilitates the alignment of the optical axis of the photoelectric conversion element, the optical lens unit, and the optical fiber, which is conventionally troublesome. Can be.
  • a low-cost photoelectric conversion plug and a photoelectric conversion module can be provided.
  • the method for manufacturing a photoelectric conversion plug of the present invention includes a pair of an element joining frame to which a photoelectric conversion element is joined and an electrical connection lead frame to which the photoelectric conversion element is electrically connected.
  • a hoop base material forming step of continuously providing the hoop base material at predetermined intervals on a hoop-shaped base material, and bonding a photoelectric conversion element to a predetermined position of an element bonding frame, and forming an anode and a cathode of the photoelectric conversion element.
  • An element bonding step of connecting each to the lead frame for electrical connection, and a step of placing the photoelectric conversion element at a predetermined position of the injection mold and condensing an optical signal output from the photoelectric conversion element on an optical fiber.
  • a photoelectric conversion plug having an optical lens part, a fiber holding part to which an optical fiber is coupled, and a lens barrel part formed between the optical lens part and the fiber holding part is molded with a photoelectric conversion element and a part of each frame.
  • FIG. 1 is a cross-sectional view showing a photoelectric conversion module according to Embodiment 1 of the present invention.
  • FIG. 2A is a sectional view of a photoelectric conversion plug according to Embodiment 2 of the present invention.
  • FIG. 2B is a sectional view of a socket to which the photoelectric conversion plug shown in FIG. 2A is coupled.
  • FIG. 3 is a cross-sectional view showing a photoelectric conversion module in which the photoelectric conversion plug shown in FIG. 2A is coupled to the socket shown in FIG. 2B.
  • FIG. 4 is a manufacturing process diagram of the photoelectric conversion plug shown in FIG. 2A.
  • FIG. 5A is a cross-sectional view of an injection mold used in the photoelectric conversion plug forming step shown in FIG.
  • FIG. 5B is a side view of the injection mold shown in FIG. 5A.
  • FIG. 5C is a sectional view taken along the line 5C-5C of the injection mold shown in FIG. 5A.
  • FIG. 6 is a cross-sectional view showing a conventional photoelectric device.
  • the photoelectric conversion plug of the present invention is provided adjacent to the photoelectric conversion element, an optical lens unit for condensing an optical signal output from the photoelectric conversion element on an optical fiber, and the optical lens unit. And a fiber holding portion provided at an end of the lens barrel portion for supporting an optical fiber, wherein the optical lens portion, the lens barrel portion, and the fiber holding portion are covered with a resin. It is characterized in that it is integrally molded and a photoelectric conversion element is disposed inside the resin molded body.
  • a photoelectric conversion module includes a photoelectric conversion plug, a substrate on which the photoelectric conversion plug is mounted, and a signal processing circuit mounted on the substrate. It has.
  • FIG. 1 is a sectional view showing a photoelectric conversion module according to Embodiment 1 of the present invention.
  • This photoelectric conversion module is for converting an electric signal formed of a semiconductor or the like into an optical signal by the photoelectric conversion element 101 and transmitting the optical signal to the optical fiber 135.
  • the main structure of the photoelectric conversion module is composed of a photoelectric conversion plug 104 for inserting and fixing an optical fiber 135 and a socket 105 for inserting and connecting the photoelectric conversion plug 104.
  • the photoelectric conversion plug 104 is adjacent to the photoelectric conversion element 101, an optical lens unit 106 for condensing an optical signal output from the photoelectric conversion element 101 on the optical fiber 135, and the optical lens unit 106. And a fiber holding unit 113 provided at an end of the lens barrel 107 for supporting the optical fiber 135.
  • the optical lens unit 106, the lens barrel unit 107, and the fiber holding unit 113 are integrally formed of resin, and the photoelectric conversion element 101 is disposed inside the resin molded body 108.
  • the socket 105 includes a board 112 on which the photoelectric conversion plug 104 is mounted, and the board 1 And a signal processing circuit 110 attached to the device 12.
  • the photoelectric conversion plug 104 includes a photoelectric conversion element 101 for converting an electric signal into an optical signal, and an optical lens unit 10 for condensing the optical signal generated by the photoelectric conversion element 101 on the tip of the optical fiber 135. And a lens barrel 107 formed between the optical lens 106 and the optical fiber 135.
  • the lens barrel 107 has a tubular shape, and a fiber holder 113 for inserting and supporting the optical fiber 135 is provided at one end of the lens barrel.
  • the fiber holding portion 113 is provided with a step so that the inner diameter is different. With this step, the insertion amount of the optical fiber 135 is defined.
  • the photoelectric conversion plug 104 is formed by injection molding using an optical resin.
  • the optical lens portion 106, the lens barrel portion 107, and the fiber holding portion 113 are integrally formed, and the photoelectric conversion element 101 is molded inside the resin molded body 108 by molding.
  • the shapes of the optical lens unit 106 and the lens barrel unit 107 are formed with high precision by the mold, and the mounting position and the direction of the photoelectric conversion element 101 are also precisely defined by the mold. .
  • the optical axis alignment between the photoelectric conversion element 101, the optical lens unit 106, and the optical fiber 135 is no longer necessary, so that the optical axis alignment work, which was conventionally extremely troublesome, can be eliminated in the production process.
  • productivity can be significantly improved.
  • one end of a lead frame 109 derived from the photoelectric conversion element 101 provided inside the resin molding 108 is used as a resin molding terminal 109a. Pulled out to the side of body 108. Further, in addition to the external connection terminal 109a, an exposed portion 109b for exposing a part of the lead frame to the surface of the resin molded body 108 is separately provided. By increasing the exposed portion of the resin molded body 108 in the lead frame 109, heat generated from the photoelectric conversion element 101 is released from both ends of the connection terminal 109a of the lead frame 109 and the exposed portion 109b. The heat radiation effect is enhanced.
  • terminals 1 for external connection of the lead frame 109 are provided on the side surface of the resin molded body 108.
  • a portion 09a and an exposed portion 109b are provided on opposite side surfaces.
  • the socket 105 includes a signal processing circuit element 110 for processing an electric signal input to the photoelectric conversion element 101, a housing 111 for detachably connecting the photoelectric conversion plug 104, and the housing 111 and the signal processing circuit element 110. And a substrate 112 to be mounted.
  • the housing 111 has an entrance 11 la into which the resin molded body 108 of the photoelectric conversion plug 104 fits, and a connection terminal 117 with which a lead frame 109 for external connection of the photoelectric conversion plug 104 abuts. are doing.
  • the connection terminal 117 has a configuration in which the housing 111 is insert-molded.
  • the substrate 112 is a resin wiring substrate or a ceramic multilayer wiring substrate generally used in electronic devices and the like.
  • the resin molded body 108 having low heat resistance can be handled independently of the socket 105. become. Therefore, when the photoelectric conversion module is mounted on the mother board (not shown), only the socket 105 is reflow mounted on the mother board in advance, and the photoelectric conversion plug 104 can be inserted into the socket 105 later.
  • the photoelectric conversion module can be treated as a device that can be practically mounted on a surface.
  • the signal processing circuit element 110 may be connected directly to the outer periphery of the socket 105 or indirectly connected to the substrate 112, in addition to being directly connected to the substrate 112. It is.
  • a surface-emitting type photoelectric conversion element 101 is used.
  • the photoelectric conversion element 101 is usually directly mounted on the substrate 112 for use.
  • the light emission direction is output in the direction perpendicular to the substrate 112
  • the photoelectric conversion element 101, the optical lens unit 106, and the fiber holding unit 113, which require optical axis adjustment, are integrally formed of optical resin, and the photoelectric conversion plug 104 is formed. Has been consolidated. Thus, it is not necessary to separately provide a component such as a reflecting mirror. Further, the insertion direction of the photoelectric conversion plug 104 into the inlet 111a can be adjusted, and the connection direction of the optical fiber 135 can be freely set.
  • the photoelectric conversion plug 104 can be downsized.
  • a locking projection 114 is provided on a side surface of the photoelectric conversion plug 104.
  • an engaging portion 115 for engaging with the locking projection 114 is provided on the wall surface of the opening 111a of the socket 105.
  • a pressing member 116 for pressing and fixing the photoelectric conversion plug 104 is provided in the insertion port 111a.
  • connection terminal 117 provided on the socket 105 side as the pressing member 116 protrudes into the insertion port 111a so as to be curved toward the photoelectric conversion element 101. This makes it possible to utilize the elasticity of the connection terminal 117 due to the bending, and to stabilize the characteristics of the photoelectric conversion module without providing a separate pressing member.
  • the pressing direction of the photoelectric conversion plug 104 by the pressing member 116 is set to a direction orthogonal to the insertion direction of the photoelectric conversion plug 104.
  • the photoelectric conversion plug 104 is pressed against the wall surface opposite to the wall surface on which the pressing member 116 is provided in the insertion opening 11 la, and the integration of the photoelectric conversion plug 104 and the socket 105 is performed. Can be further increased.
  • the socket 105 is provided with a heat radiating member 118 connected to the exposed portion 109b of the lead frame exposed on the surface of the photoelectric conversion plug 104.
  • the heat dissipating member 118 is preferably made of a material having high thermal conductivity such as copper. With this structure, the heat radiation effect of the photoelectric conversion element 101 can be enhanced via the exposed portion 109b of the lead frame and the heat radiation member 118. (Embodiment 2)
  • FIG. 2A is a sectional view of a photoelectric conversion plug according to Embodiment 2 of the present invention
  • FIG. 2B is a sectional view of a socket to which the photoelectric conversion plug shown in FIG. 2A is coupled
  • FIG. 3 is a photoelectric conversion plug shown in FIG. 2A.
  • FIG. 3B is a sectional view showing the photoelectric conversion module coupled to the socket shown in FIG. 2B.
  • a combination of the photoelectric conversion plug 201 shown in FIG. 2A and the socket 213 shown in FIG. 2B is called a photoelectric conversion module.
  • main body 202 of photoelectric conversion plug 201 is made of an optical resin.
  • the optical lens unit 203 is provided for light emission or light collection of the photoelectric conversion element 204, and is formed integrally with the main body unit 202.
  • a resin molded body 238 is formed.
  • the photoelectric conversion element 204 As the photoelectric conversion element 204, a surface-emitting type element is used. Lead frame
  • the photoelectric conversion element 204 is connected to 205 via a wire 206.
  • the photoelectric conversion element 204 is insert-molded together with the wire 206 and a part of the lead frame 205 into the main body 202 having the above-described optical resin.
  • the fiber holding section 207 is provided for coupling the optical fiber 235 to the main body 202 of the photoelectric conversion plug 201.
  • the lens barrel unit 208 is formed between the fiber holding unit 207 and the optical lens unit 203.
  • the optical fiber 235 is a fiber holding portion provided in the main body 202 of the photoelectric conversion plug 201.
  • the optical fiber 235 includes a core 210 and a clad 211.
  • the optical fiber 235 is fixed to the main body 202 with an adhesive 212.
  • the socket 213 includes a resin housing 214.
  • the housing 214 is provided with a hollow portion into which the main body portion 202 of the photoelectric conversion plug 201 is fitted, and a locking projection 214a for locking the main body portion 202 fitted into the hollow portion. Further, a terminal 215 to which the lead frame 205 of the photoelectric conversion plug 201 abuts is insert-molded in the housing 214.
  • the terminal 215 is formed by bending a material having spring properties so as to abut on the lead frame 205 in a biased state.
  • the socket 213 and the photoelectric conversion module For this purpose, an integrated circuit 217 and an electronic component 218 are mounted on a wiring board 216.
  • FIG. 4 is a manufacturing process diagram of the photoelectric conversion plug shown in Fig. 2A
  • Fig. 5A is a cross-sectional view of an injection molding die used in the photoelectric conversion plug forming process shown in Fig. 4
  • Fig. 5B is a side view of the same.
  • FIG. 5C is a sectional view taken along the line 5C-5C of the injection mold shown in FIG. 5A.
  • the method for manufacturing a photoelectric conversion plug includes a hoop base material forming step, an element bonding step, a photoelectric conversion plug forming step, a cutting step, and a frame processing step.
  • a method for manufacturing the photoelectric conversion plug shown in FIG. 4 will be described while being applied to the photoelectric conversion plug 201 shown in FIG. 2A.
  • an element bonding frame 219a to which the photoelectric conversion element 204 is bonded and an electrical connection lead frame 219e to which the photoelectric conversion element 204 is electrically connected are formed as one set, This is continuously formed at predetermined intervals on the hoop-shaped base material 219.
  • the photoelectric conversion element 204 is bonded to a predetermined position of the element bonding frame 219a, and the anode and the cathode of the photoelectric conversion element 204 are connected to the electrical connection lead frame 219e.
  • the photoelectric conversion element 204 is placed at a predetermined position of an injection molding die, and has a photoelectric conversion unit including an optical lens unit 203, a fiber holding unit 207, and a lens barrel unit 208.
  • the plug 201 is insert-molded so that the photoelectric conversion element 204 and a part of each of the lead frames 219e are molded.
  • the photoelectric conversion plug formed in the photoelectric conversion plug forming step is formed.
  • the element bonding frame 219a and the electrical connection lead frame 219e of the photoelectric conversion plug 201 cut in the cutting step are cut.
  • a process in which the above-described dividing process and the frame processing process are combined that is, a process in which the photoelectric conversion plug 201 is separated from the hoop-shaped base material 219 into individual pieces is referred to as a processing process in a broad sense. I do.
  • one set of lead frames is mounted on the hoop-shaped base material 219. It is provided continuously at a predetermined interval.
  • This set of lead frames includes an element bonding frame 219a to which the photoelectric conversion element 204 is connected, and an electrical connection lead frame 219e to which the photoelectric conversion element 204 is electrically connected.
  • the electrical connection lead frame 219e also has a force with the anode lead frame 219b to which the anode of the photoelectric conversion element 204 is connected and the cathode lead frame 219c to which the cathode of the photoelectric conversion element 204 is connected.
  • the hoop base material forming step may be appropriately selected in consideration of dimensional accuracy, cost, and the like, which may be performed by either etching force punching or punching using a die.
  • the hoop-shaped base material 219 has a through hole 219d into which the pilot pin 221 fits.
  • the photoelectric conversion element 204 is bonded to a predetermined position of the element bonding frame 219a using a conductive adhesive. Also, the anode of the photoelectric conversion element 204 is connected to the anode lead frame 219b, and the cathode of the photoelectric conversion element 204 is connected to the cathode lead frame 219c. This connection is made by wire bonding using a wire 206.
  • the photoelectric conversion element 204 bonded to the hoop-shaped base material 219 is disposed in an injection molding die 220, and the above-described frames 219a, 2
  • the main body 202 is formed while the photoelectric conversion element 204 including the wire 206 is inserted into the mold 220 such that a part of 19b and 219c is molded.
  • the photoelectric conversion plug 201 includes an optical lens unit 203 for receiving or emitting light from the photoelectric conversion element 204 and a fiber holding unit to which an optical fiber for receiving or emitting light from the optical lens unit 203 is coupled. 207, and a lens barrel 208 formed between the fiber holding part 207 and the optical lens part 203. Then, in this photoelectric conversion plug forming step, the optical lens unit 203, the fiber holding unit 207, and the lens barrel unit 208 are also integrally formed at the same time when the main unit 202 is formed.
  • pilot pin 221 is provided on mold 220.
  • the pilot pin 221 is positioned by being fitted into the through hole 219d provided in the base material 219, and serves as a reference when bonding the photoelectric conversion element 204 to a predetermined position of the element bonding frame 219a. It is.
  • FIG. 5A is a cross-sectional view of the injection mold
  • FIG. 5B is a side view of the same.
  • FIG. 5C is a sectional view taken along section line 5C-5C in FIG. 5A.
  • the mold 220 shown in FIG. 4 is provided with a cavity 222 for forming the main body 202 of the photoelectric conversion plug 201.
  • slide pin 223 can slide in the X direction shown in FIG. 5C.
  • a semicircular arc portion 224 formed into an arc shape is formed to form the optical lens portion 203.
  • the mold 220 is provided with a lens barrel forming part 225 for forming the lens barrel 208 and a fiber holding part forming part 226 for forming the fiber holding part 207 in succession. You.
  • the slide pin 223 is used to form the lens barrel 208 and the fiber holding part 207.
  • the slide pin 223 is slid in the X direction to pull out the slide pin 223 from the formed barrel section 208 and the fiber holding section 207. It is possible to reduce the taper of the inner diameter part.
  • the mold 220 is provided with a backup pin 227 which also holds the back surface force of the photoelectric conversion element 204 in order to prevent the photoelectric conversion element 204 from being moved by the resin injected by the photoelectric conversion element 204 bonded to the element bonding frame 219a. T! /
  • Reference numeral 230 in Fig. 5A indicates a tunnel gate.
  • the tunnel gate 230 is provided to be inclined from the parting line 209 toward the peripheral surfaces on both sides of the main body 202 of the photoelectric conversion plug 201. Further, it is formed so as to face the lens barrel forming portion 225 of the exit rocker slide pin 223 of the tunnel gate 230. Note that the parting line 209 in this embodiment is located on the back of the element bonding frame 219a to which the photoelectric conversion element 204 is bonded. The surface side. This simplifies the structure of the mold.
  • the photoelectric conversion element 204 is connected to the element bonding frame 219a and the connected electrical connection lead frame 219e (ie, the anode lead frame 219b and the cathode lead frame 219c) in the mold 220. Place in place.
  • the back-up pin 227 also holds the back surface force of the photoelectric conversion element 204.
  • the molten resin is injected through the tunnel gate 230 to form the main body 202 of the photoelectric conversion plug 201.
  • a semicircle is required to form the optical lens unit 203.
  • the injection speed when filling resin into the circular arc portion 224 is reduced. As a result, bubbles do not accumulate in the optical lens unit 203 to form bubbles or sink marks, and the optical lens unit 203 having excellent accuracy and quality can be formed.
  • the element bonding frame 219a and the electrical connection lead frame 219e (ie, the electric anode lead frame 219b and the cathode lead frame 219c) Has been described as a set of lead frames.
  • the present invention is not limited to this, and the element bonding frame 219a may be configured to also serve as either the anode lead frame 219b or the cathode lead frame 219c.
  • the joining between the element joining frame 219a and the photoelectric conversion element 204 is performed using a conductive adhesive, but the present invention is not limited to this.
  • connection between the anode of the photoelectric conversion element 204 and the anode lead frame 219b and the connection between the cathode of the photoelectric conversion element 204 and the cathode lead frame 219c are performed by wire bonding. It is not limited to this.
  • the photoelectric conversion element 204, the optical lens unit 203, and the fiber holding unit 207 can be integrally molded. Will be possible. This eliminates the need for optical axis alignment work. The assembling process can be simplified. In addition, the photoelectric conversion plug 201 having excellent alignment accuracy and reliability of the optical axis can be manufactured at a low cost, and has a special function and effect.
  • the photoelectric conversion plug and the photoelectric conversion module according to the present invention have the effect of improving productivity, and are useful in an optical transmission system.

Abstract

A photoelectric conversion plug (104) for forming a photoelectric conversion module, comprising a photoelectric conversion element (101), an optical lens unit (106) for condensing an optical signal output from the photoelectric conversion element (101) to an optical fiber (135), a lens-barrel unit (107) provided adjacent to the optical lens unit (106), and a fiber holding unit (113) provided at the end of the lens-barrel unit (107), for supporting the optical fiber (135), wherein the optical lens unit (106), the lens-barrel unit (107) and the fiber holding unit (113) are integrally molded by resin, and the photoelectric conversion element (101) is disposed inside this resin molding (108).

Description

光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換 プラグの製造方法  Photoelectric conversion plug, photoelectric conversion module using the same, and method of manufacturing the photoelectric conversion plug
技術分野  Technical field
[0001] 本発明は、例えば光伝送システムに使用される光電変換プラグ、それを用いた光 電変換モジュール、及びその光電変換プラグの製造方法に関する。  The present invention relates to, for example, a photoelectric conversion plug used in an optical transmission system, a photoelectric conversion module using the same, and a method for manufacturing the photoelectric conversion plug.
背景技術  Background art
[0002] 光伝送システムは、低雑音や広帯域などの優れた特徴を有することから、通信、ケ 一ブルテレビは勿論、自動車、オーディオその他の民生機器の配線に広く使用され るようになってきている。  [0002] Optical transmission systems, which have excellent characteristics such as low noise and broadband, have been widely used for wiring of automobiles, audios and other consumer devices as well as communications and cable televisions. I have.
[0003] 図 6は光伝送システムに使用される従来の光電装置を示す断面図である。図 6にお いて、光電変換素子 30は発光又は受光を行う。その光電変換素子 30はリードフレー ム 31に取り付けられる。第 1の外囲器 32は、光電変換素子 30が取り付けられたリー ドフレーム 31の一部をエポキシ榭脂等でモールドしたものである。光コネクタ 33は、 フランジ 34と、このフランジ 34に結合された光ファイバコード 35とから構成されて!、る 。この光ファイバコード 35に被覆された光ファイバ 36の端面 36aは、光学研摩されて いる。  FIG. 6 is a cross-sectional view showing a conventional photoelectric device used for an optical transmission system. In FIG. 6, the photoelectric conversion element 30 emits light or receives light. The photoelectric conversion element 30 is attached to the lead frame 31. The first envelope 32 is formed by molding a part of the lead frame 31 to which the photoelectric conversion element 30 is attached with epoxy resin or the like. The optical connector 33 is composed of a flange 34 and an optical fiber cord 35 connected to the flange 34. The end face 36a of the optical fiber 36 coated on the optical fiber cord 35 is optically polished.
[0004] 第 2の外囲器 37は、第 1の外囲器 32及びフランジ 34を結合し、光電変換素子 30と 光ファイバ 36の端面 36aを光結合する。回路基板 38は、第 1の外囲器 32から延びた リードフレーム 31を実装している。ピン 39は、第 2の外囲器 37を回路基板 38に安定 して実装するためのものであり、第 2の外囲器 37に植設されている。  [0004] The second envelope 37 couples the first envelope 32 and the flange 34, and optically couples the photoelectric conversion element 30 and the end face 36a of the optical fiber 36. The circuit board 38 mounts the lead frame 31 extending from the first envelope 32. The pins 39 are for stably mounting the second envelope 37 on the circuit board 38 and are implanted in the second envelope 37.
[0005] なお、この出願の発明に関連する先行技術文献情報としては、例えば、 日本特許 出願特公昭 62-44832号公報が知られて ヽる。  [0005] As prior art document information related to the invention of this application, for example, Japanese Patent Application No. Sho 62-44832 is known.
[0006] し力しながら上記従来の光電装置において、光電変換素子 30と光ファイバ 36の端 面 36aを光結合するためには次のような作業が必要となる。すなわち、第 2の外囲器 37に光コネクタ 33をスナップインした状態で、第 1の外囲器 32を第 2の外囲器 37に 組み込み、光ファイバ 36の端面 36aから発光又は集光される光と光電変換素子 30と が光結合するように、光電変換素子 30の位置を調整しなければならな 、。 [0006] In the conventional photoelectric device described above, the following operation is required to optically couple the photoelectric conversion element 30 and the end face 36a of the optical fiber 36. That is, with the optical connector 33 snapped into the second envelope 37, the first envelope 32 is incorporated into the second envelope 37, and light is emitted or collected from the end face 36a of the optical fiber 36. Light and photoelectric conversion element 30 The position of the photoelectric conversion element 30 must be adjusted so that light is optically coupled.
[0007] このように上記従来の光電装置にお!、ては、光電変換素子 30をモールドした第 1 の外囲器 32の位置を調整して光結合するための「光軸合わせ作業」が必ず必要に なる。この「光軸合わせ作業」では、光電変換素子 30と光ファイバ 36の端面 36aとの 光軸を合わせなければならないので、非常に緻密な作業を要する。そしてさらに、こ の「光軸合わせ作業」の後で、第 2の外囲器 37に対して第 1の外囲器 32を固定する 作業を行わなければならな 、。 [0007] As described above, in the conventional photoelectric device described above, the "optical axis alignment work" for adjusting the position of the first envelope 32 in which the photoelectric conversion element 30 is molded and performing optical coupling is performed. You will need it. In this "optical axis alignment work", very precise work is required because the optical axes of the photoelectric conversion element 30 and the end face 36a of the optical fiber 36 must be aligned. Further, after this “optical axis alignment work”, a work of fixing the first envelope 32 to the second envelope 37 must be performed.
[0008] このように、上記従来の光電装置にお!、ては、光軸の精度と信頼性を確保するため に緻密な作業が必要となり、光電装置がコストアップするという課題を有していた。 発明の開示 [0008] As described above, in the above-mentioned conventional photoelectric device, there is a problem that precise work is required to secure the accuracy and reliability of the optical axis, and the cost of the photoelectric device is increased. Was. Disclosure of the invention
[0009] 本発明はこのような従来の課題を解決し、簡単な方法で光軸合わせを行うことがで き、生産性の良好な光電変換プラグを実現し、低価格な光電変換プラグ及び光電変 換モジュールを提供することを目的とする。  [0009] The present invention solves such a conventional problem, realizes an optical axis alignment with a simple method, realizes a photoelectric conversion plug with good productivity, and realizes a low-cost photoelectric conversion plug and a photoelectric conversion plug. The purpose is to provide a conversion module.
[0010] 本発明の光電変換プラグは、光電変換素子と、その光電変換素子から出力された 光信号を光ファイバに集光するための光学レンズ部と、その光学レンズ部に隣接して 設けられた鏡筒部と、その鏡筒部の端部に設けられ光ファイバを支持するためのファ ィバ保持部とを含み、ここに、光学レンズ部と鏡筒部とファイバ保持部を榭脂により一 体成形するとともに、この榭脂成形体の内部に光電変換素子を配設したことを特徴と する。  [0010] The photoelectric conversion plug of the present invention is provided adjacent to the photoelectric conversion element, an optical lens unit for condensing an optical signal output from the photoelectric conversion element on an optical fiber, and the optical lens unit. And a fiber holding portion provided at an end of the lens barrel portion for supporting an optical fiber, wherein the optical lens portion, the lens barrel portion, and the fiber holding portion are covered with a resin. It is characterized in that it is integrally molded and a photoelectric conversion element is disposed inside the resin molded body.
[0011] また、本発明の光電変換モジュールは、光電変換プラグと、その光電変換プラグを 取り付ける基板と、その基板に取り付けられた信号処理回路とを含み、その光電変換 プラグは上記本発明の構成を有するものである。  [0011] Further, a photoelectric conversion module of the present invention includes a photoelectric conversion plug, a substrate on which the photoelectric conversion plug is mounted, and a signal processing circuit mounted on the substrate. It has.
[0012] このように本発明による光電変換プラグ及び光電変換モジュールは、光電変換ブラ グとして、光学レンズ部、鏡筒部、光ファイバを支持する保持部とを榭脂により一体成 形するとともに、この榭脂成形体の内部に光電変換素子を配設したものであり、この 構成により、従来手間の掛カつていた光電変換素子、光学レンズ部及び光ファイバ の光軸合せを容易に行うことができる。その結果、低価格な光電変換プラグ及び光 電変換モジュールを提供することができる。 [0013] さらにまた、本発明の光電変換プラグの製造方法は、光電変換素子が接合される 素子接合用フレームと、光電変換素子が電気的に接続される電気接続用リードフレ 一ムとを 1組とし、これをフープ状の基材に所定の間隔で連続して設けるフープ基材 形成工程と、素子接合用フレームの所定の位置に光電変換素子を接合し、この光電 変換素子の陽極と陰極を電気接続用リードフレームに夫々接続する素子接合工程と 、光電変換素子を射出成形金型の所定の位置に載置し、光電変換素子から出力さ れた光信号を光ファイバに集光するための光学レンズ部と、光ファイバが結合される ファイバ保持部と、光学レンズ部とファイバ保持部間に形成される鏡筒部とを有する 光電変換プラグを、光電変換素子と各フレームの一部がモールドされるようにしてィ ンサート成形する光電変換プラグ成形工程と、成形された光電変換プラグをフープ 状の基材から分断して個片とする加工工程とを含むことを特徴とする。 As described above, in the photoelectric conversion plug and the photoelectric conversion module according to the present invention, the optical lens unit, the lens barrel unit, and the holding unit supporting the optical fiber are integrally formed as a photoelectric conversion plug with a resin. The photoelectric conversion element is disposed inside the resin molded body, and this configuration facilitates the alignment of the optical axis of the photoelectric conversion element, the optical lens unit, and the optical fiber, which is conventionally troublesome. Can be. As a result, a low-cost photoelectric conversion plug and a photoelectric conversion module can be provided. [0013] Furthermore, the method for manufacturing a photoelectric conversion plug of the present invention includes a pair of an element joining frame to which a photoelectric conversion element is joined and an electrical connection lead frame to which the photoelectric conversion element is electrically connected. A hoop base material forming step of continuously providing the hoop base material at predetermined intervals on a hoop-shaped base material, and bonding a photoelectric conversion element to a predetermined position of an element bonding frame, and forming an anode and a cathode of the photoelectric conversion element. An element bonding step of connecting each to the lead frame for electrical connection, and a step of placing the photoelectric conversion element at a predetermined position of the injection mold and condensing an optical signal output from the photoelectric conversion element on an optical fiber. A photoelectric conversion plug having an optical lens part, a fiber holding part to which an optical fiber is coupled, and a lens barrel part formed between the optical lens part and the fiber holding part is molded with a photoelectric conversion element and a part of each frame. Is Characterized in that it comprises as a photoelectric conversion plug forming step of forming I concert in the, and a machining step to be divided photoelectric conversion plug molded from a hoop-like substrate pieces.
[0014] この方法により、従来手間の掛カつていた光電変換素子と光ファイバとの光軸合せ を容易に行うことができる。その結果、低価格な光電変換プラグ及び光電変換モジュ ールを提供することができる。  [0014] According to this method, optical axis alignment between the photoelectric conversion element and the optical fiber, which has conventionally been troublesome, can be easily performed. As a result, a low-cost photoelectric conversion plug and a photoelectric conversion module can be provided.
図面の簡単な説明  Brief Description of Drawings
[0015] [図 1]図 1は本発明の実施形態 1における光電変換モジュールを示す断面図である。  FIG. 1 is a cross-sectional view showing a photoelectric conversion module according to Embodiment 1 of the present invention.
[図 2A]図 2Aは本発明の実施の形態 2における光電変換プラグの断面図である。  FIG. 2A is a sectional view of a photoelectric conversion plug according to Embodiment 2 of the present invention.
[図 2B]図 2Bは図 2Aに示す光電変換プラグが結合されるソケットの断面図である。  FIG. 2B is a sectional view of a socket to which the photoelectric conversion plug shown in FIG. 2A is coupled.
[図 3]図 3は、図 2Aに示す光電変換プラグが図 2Bに示すソケットに結合した光電変 換モジュールを示す断面図である。  FIG. 3 is a cross-sectional view showing a photoelectric conversion module in which the photoelectric conversion plug shown in FIG. 2A is coupled to the socket shown in FIG. 2B.
[図 4]図 4は、図 2Aに示す光電変換プラグの製造工程図である。  FIG. 4 is a manufacturing process diagram of the photoelectric conversion plug shown in FIG. 2A.
[図 5A]図 5Aは図 4に示す光電変換プラグ成形工程に使用される射出成形金型の断 面図である。  FIG. 5A is a cross-sectional view of an injection mold used in the photoelectric conversion plug forming step shown in FIG.
[図 5B]図 5Bは図 5Aに示す射出成形金型の側面図である。  FIG. 5B is a side view of the injection mold shown in FIG. 5A.
[図 5C]図 5Cは図 5Aに示す射出成形金型の 5C—5C断面図である。  FIG. 5C is a sectional view taken along the line 5C-5C of the injection mold shown in FIG. 5A.
[図 6]図 6は従来の光電装置を示す断面図である。  FIG. 6 is a cross-sectional view showing a conventional photoelectric device.
符号の説明  Explanation of symbols
[0016] 101, 204 光電変換素子 104, 201 光電変換プラグ[0016] 101, 204 photoelectric conversion element 104, 201 Photoelectric conversion plug
105, 213 ソケット 105, 213 socket
106, 203 光学レンズ部 106, 203 Optical lens
107, 208 鏡筒部 107, 208 Lens barrel
108, 238 樹脂成形体 108, 238 molded resin
109, 109a, 109b, 205 リ109, 109a, 109b, 205 l
110 信号処理回路素子110 signal processing circuit element
111a 揷入口 111a 揷 entrance
112, 216 基板  112, 216 substrates
113, 207 ファイバ保持部 113, 207 Fiber holder
114, 214a 係止用突起114, 214a Locking projection
116 押圧部材 116 Pressing member
118 放熱部材  118 Heat dissipation member
135, 235 光ファイノ 135, 235 Optical Phino
202 本体部 202 Main unit
206 ワイヤー  206 wire
209 パーテイングライン 209 Parting Line
219 基材 219 substrate
219a 素子接合用フレーム 219a Element bonding frame
219b 陽極リードフレーム219b Anode lead frame
219c 陰極リードフレーム219c cathode lead frame
219e 電気接続用リードフレ219e Lead frame for electrical connection
219d 貫通孔 219d through hole
220 金型  220 mold
221 パイロットピン  221 Pilot pin
222 空洞部  222 cavity
223 スライドピン  223 slide pin
224 円弧部 225 鏡筒形成部 224 arc 225 Lens tube forming part
226 ファイバ保持部形成部  226 Fiber holding part forming part
227 バックアップピン  227 Backup pin
230 トンネノレゲート  230 Tonnes Nolegate
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0017] 本発明の光電変換プラグは、光電変換素子と、その光電変換素子から出力された 光信号を光ファイバに集光するための光学レンズ部と、その光学レンズ部に隣接して 設けられた鏡筒部と、その鏡筒部の端部に設けられ光ファイバを支持するためのファ ィバ保持部とを含み、ここに、光学レンズ部と鏡筒部とファイバ保持部を榭脂により一 体成形するとともに、この榭脂成形体の内部に光電変換素子を配設したことを特徴と する。 [0017] The photoelectric conversion plug of the present invention is provided adjacent to the photoelectric conversion element, an optical lens unit for condensing an optical signal output from the photoelectric conversion element on an optical fiber, and the optical lens unit. And a fiber holding portion provided at an end of the lens barrel portion for supporting an optical fiber, wherein the optical lens portion, the lens barrel portion, and the fiber holding portion are covered with a resin. It is characterized in that it is integrally molded and a photoelectric conversion element is disposed inside the resin molded body.
[0018] また、本発明の光電変換モジュールは、光電変換プラグと、その光電変換プラグを 取り付ける基板と、その基板に取り付けられた信号処理回路とを含み、その光電変換 プラグは上記本発明の構成を有するものである。  Further, a photoelectric conversion module according to the present invention includes a photoelectric conversion plug, a substrate on which the photoelectric conversion plug is mounted, and a signal processing circuit mounted on the substrate. It has.
[0019] 以下、本発明の実施形態について、図面を用いて詳細に説明する。  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0020] (実施の形態 1)  (Embodiment 1)
図 1は本発明の実施形態 1における光電変換モジュールを示す断面図である。この 光電変換モジュールは、半導体などで形成された電気信号を光電変換素子 101に より光信号に変換し光ファイバ 135に伝送するためのものである。  FIG. 1 is a sectional view showing a photoelectric conversion module according to Embodiment 1 of the present invention. This photoelectric conversion module is for converting an electric signal formed of a semiconductor or the like into an optical signal by the photoelectric conversion element 101 and transmitting the optical signal to the optical fiber 135.
[0021] 光電変換モジュールの主な構成は、光ファイバ 135を挿入固定する光電変換ブラ グ 104と、その光電変換プラグ 104を挿入接続するソケット 105とで構成される。  The main structure of the photoelectric conversion module is composed of a photoelectric conversion plug 104 for inserting and fixing an optical fiber 135 and a socket 105 for inserting and connecting the photoelectric conversion plug 104.
[0022] 光電変換プラグ 104は、光電変換素子 101と、その光電変換素子 101から出力さ れた光信号を光ファイバ 135に集光するための光学レンズ部 106と、その光学レンズ 部 106に隣接して設けられた鏡筒部 107と、その鏡筒部 107の端部に設けられ光フ アイバ 135を支持するためのファイバ保持部 113とを含んで 、る。光学レンズ部 106 と鏡筒部 107とファイバ保持部 113は、榭脂により一体成形されるとともに、この榭脂 成形体 108の内部に光電変換素子 101を配設している。  The photoelectric conversion plug 104 is adjacent to the photoelectric conversion element 101, an optical lens unit 106 for condensing an optical signal output from the photoelectric conversion element 101 on the optical fiber 135, and the optical lens unit 106. And a fiber holding unit 113 provided at an end of the lens barrel 107 for supporting the optical fiber 135. The optical lens unit 106, the lens barrel unit 107, and the fiber holding unit 113 are integrally formed of resin, and the photoelectric conversion element 101 is disposed inside the resin molded body 108.
[0023] また、ソケット 105は、上記光電変換プラグ 104を取り付ける基板 112と、その基板 1 12に取り付けられた信号処理回路 110とを含んで 、る。 The socket 105 includes a board 112 on which the photoelectric conversion plug 104 is mounted, and the board 1 And a signal processing circuit 110 attached to the device 12.
[0024] さらにより詳しぐ光電変換モジュールの構成を説明する。光電変換プラグ 104は、 電気信号を光信号に変換するための光電変換素子 101と、この光電変換素子 101 力も発せられた光信号を光ファイバ 135の先端に集光させるための光学レンズ部 10 6と、光学レンズ部 106と光ファイバ 135との間に形成される鏡筒部 107で構成される The configuration of the photoelectric conversion module will be described in further detail. The photoelectric conversion plug 104 includes a photoelectric conversion element 101 for converting an electric signal into an optical signal, and an optical lens unit 10 for condensing the optical signal generated by the photoelectric conversion element 101 on the tip of the optical fiber 135. And a lens barrel 107 formed between the optical lens 106 and the optical fiber 135.
[0025] 鏡筒部 107は、筒状であり、この鏡筒部の一端側には、光ファイバ 135を挿入支持 するためのファイバ保持部 113が設けられている。このファイバ保持部 113には、内 周径が異なるように段差が設けられている。この段差により、光ファイバ 135の挿入量 を規定する構成となって ヽる。 The lens barrel 107 has a tubular shape, and a fiber holder 113 for inserting and supporting the optical fiber 135 is provided at one end of the lens barrel. The fiber holding portion 113 is provided with a step so that the inner diameter is different. With this step, the insertion amount of the optical fiber 135 is defined.
[0026] また、光電変換プラグ 104は、光学榭脂を用いた射出成形により形成されている。  The photoelectric conversion plug 104 is formed by injection molding using an optical resin.
この射出成形の際、光学レンズ部 106と鏡筒部 107とファイバ保持部 113とを一体成 形するとともに、その榭脂成形体 108の内部に光電変換素子 101を合せてモールド 成形している。  During this injection molding, the optical lens portion 106, the lens barrel portion 107, and the fiber holding portion 113 are integrally formed, and the photoelectric conversion element 101 is molded inside the resin molded body 108 by molding.
[0027] それにより、光学レンズ部 106や鏡筒部 107の形状が、金型により高精度に形成さ れるとともに、光電変換素子 101の取り付け位置や方向も金型によって高精度に規 定される。その結果、光電変換素子 101、光学レンズ部 106、光ファイバ 135間の光 軸合せが不要となることから、従来非常に手間の掛カつていた光軸合せの作業が生 産工程力 排除できることで生産性を格段に向上することができる。  [0027] Thereby, the shapes of the optical lens unit 106 and the lens barrel unit 107 are formed with high precision by the mold, and the mounting position and the direction of the photoelectric conversion element 101 are also precisely defined by the mold. . As a result, the optical axis alignment between the photoelectric conversion element 101, the optical lens unit 106, and the optical fiber 135 is no longer necessary, so that the optical axis alignment work, which was conventionally extremely troublesome, can be eliminated in the production process. Thus, productivity can be significantly improved.
[0028] さらに、この光電変換プラグ 104においては、榭脂成形体 108の内部に設けられた 光電変換素子 101から導出されるリードフレーム 109の一端が、外部接続用の端子 1 09aとして榭脂成形体 108の側面に引き出されている。さらに、この外部接続用の端 子 109a部分以外にも、リードフレームの一部が、別途、榭脂成形体 108の表面に露 出する露出部 109bが設けられている。リードフレーム 109における榭脂成形体 108 力もの露出部分を増すことにより、光電変換素子 101から発せられる熱が、リードフレ ーム 109の接続端子 109a部分と露出部 109bの両端力 放出されるようになり放熱 効果が高められる。  Further, in this photoelectric conversion plug 104, one end of a lead frame 109 derived from the photoelectric conversion element 101 provided inside the resin molding 108 is used as a resin molding terminal 109a. Pulled out to the side of body 108. Further, in addition to the external connection terminal 109a, an exposed portion 109b for exposing a part of the lead frame to the surface of the resin molded body 108 is separately provided. By increasing the exposed portion of the resin molded body 108 in the lead frame 109, heat generated from the photoelectric conversion element 101 is released from both ends of the connection terminal 109a of the lead frame 109 and the exposed portion 109b. The heat radiation effect is enhanced.
[0029] なお、榭脂成形体 108の側面において、リードフレーム 109の外部接続用の端子 1 09a部分と、露出部 109bとを対向する側面に設けている。それにより、リードフレーム 109を一直線状に形成できることからリードフレーム 109に実装される光電変換素子 101のモールド成形における位置ずれを抑制できる。 [0029] Note that, on the side surface of the resin molded body 108, terminals 1 for external connection of the lead frame 109 are provided. A portion 09a and an exposed portion 109b are provided on opposite side surfaces. Thereby, since the lead frame 109 can be formed in a straight line, the displacement of the photoelectric conversion element 101 mounted on the lead frame 109 during molding can be suppressed.
[0030] 次に、ソケット 105について説明する。ソケット 105は、光電変換素子 101に入力す る電気信号を処理する信号処理回路素子 110と、光電変換プラグ 104を着脱可能に 接続するハウジング 111と、このハウジング 111と信号処理回路素子 110とを一体ィ匕 する基板 112とにより構成されて 、る。  Next, the socket 105 will be described. The socket 105 includes a signal processing circuit element 110 for processing an electric signal input to the photoelectric conversion element 101, a housing 111 for detachably connecting the photoelectric conversion plug 104, and the housing 111 and the signal processing circuit element 110. And a substrate 112 to be mounted.
[0031] ハウジング 111は、光電変換プラグ 104の榭脂成形体 108が嵌まり込む揷入口 11 laと、光電変換プラグ 104の外部接続用のリードフレーム 109が当接するための接 続端子 117を有している。ここで、接続端子 117は、ハウジング 111にインサート成形 された構成となっている。なお、基板 112は電子機器などで一般的に使用されている 榭脂配線基板やセラミック多層配線基板を用いて 、る。  The housing 111 has an entrance 11 la into which the resin molded body 108 of the photoelectric conversion plug 104 fits, and a connection terminal 117 with which a lead frame 109 for external connection of the photoelectric conversion plug 104 abuts. are doing. Here, the connection terminal 117 has a configuration in which the housing 111 is insert-molded. Note that the substrate 112 is a resin wiring substrate or a ceramic multilayer wiring substrate generally used in electronic devices and the like.
[0032] 光電変換モジュールを、上述したような光電変換プラグ 104と、上述したようなソケ ット 105で構成することで、耐熱性の低い榭脂成形体 108がソケット 105から独立して 取り扱えるようになる。したがって、光電変換モジュールをマザ一基板(図示せず)に 実装する際、ソケット 105のみをマザ一基板に予めリフロー実装しておき、追って光 電変換プラグ 104をソケット 105に挿入できるようになり、光電変換モジュールを実質 的に面実装可能なデバイスとして扱える。  By forming the photoelectric conversion module with the above-described photoelectric conversion plug 104 and the above-described socket 105, the resin molded body 108 having low heat resistance can be handled independently of the socket 105. become. Therefore, when the photoelectric conversion module is mounted on the mother board (not shown), only the socket 105 is reflow mounted on the mother board in advance, and the photoelectric conversion plug 104 can be inserted into the socket 105 later. The photoelectric conversion module can be treated as a device that can be practically mounted on a surface.
[0033] なお、信号処理回路素子 110は、基板 112上に直接接続する形態のほかに、ソケ ット 105の外周部などに接続するといつた基板 112に対して間接的に接続することも 可能である。  [0033] The signal processing circuit element 110 may be connected directly to the outer periphery of the socket 105 or indirectly connected to the substrate 112, in addition to being directly connected to the substrate 112. It is.
[0034] また、本実施の形態 1の光電変換モジュールにおいては、光電変換素子 101として 面発光式のものを用いている。従来は通常、このような面発光式のものを用いる場合 、光電変換素子 101を基板 112に直接実装して用いる。この場合、発光方向が基板 112に対して垂直方向に出力されるので、その光路を調節するために光路上に反射 鏡などを別途設けなければならず、光軸調整が一層困難なものとなる。  Further, in the photoelectric conversion module of Embodiment 1, a surface-emitting type photoelectric conversion element 101 is used. Conventionally, when such a surface-emitting type device is used, the photoelectric conversion element 101 is usually directly mounted on the substrate 112 for use. In this case, since the light emission direction is output in the direction perpendicular to the substrate 112, it is necessary to separately provide a reflecting mirror or the like on the optical path to adjust the optical path, and it becomes more difficult to adjust the optical axis. .
[0035] そこで、本実施形態では、光軸調整が必要となる光電変換素子 101、光学レンズ 部 106、ファイバ保持部 113とを光学榭脂により一体に成形し、光電変換プラグ 104 に集約している。これにより、反射鏡のような部品を別途設ける必要がない。また、光 電変換プラグ 104の揷入口 111aへの挿入方向を調節でき、光ファイバ 135の接続 方向を自在に設定することができる。 Therefore, in the present embodiment, the photoelectric conversion element 101, the optical lens unit 106, and the fiber holding unit 113, which require optical axis adjustment, are integrally formed of optical resin, and the photoelectric conversion plug 104 is formed. Has been consolidated. Thus, it is not necessary to separately provide a component such as a reflecting mirror. Further, the insertion direction of the photoelectric conversion plug 104 into the inlet 111a can be adjusted, and the connection direction of the optical fiber 135 can be freely set.
[0036] なお、信号処理回路素子 110をソケット 105側に配置したことで、光電変換プラグ 1 04の小型化が実現できる。  By arranging the signal processing circuit element 110 on the socket 105 side, the photoelectric conversion plug 104 can be downsized.
[0037] さらに、この光電変換モジュールにおいては、光電変換プラグ 104の側面に係止用 突起 114が設けられている。一方、ソケット 105の揷入口 111aの壁面には、係止用 突起 114が係合するための係合部 115が設けられている。さらに、挿入口 111a内に 光電変換プラグ 104を押圧固定するための押圧部材 116が設けられている。  Further, in this photoelectric conversion module, a locking projection 114 is provided on a side surface of the photoelectric conversion plug 104. On the other hand, an engaging portion 115 for engaging with the locking projection 114 is provided on the wall surface of the opening 111a of the socket 105. Further, a pressing member 116 for pressing and fixing the photoelectric conversion plug 104 is provided in the insertion port 111a.
[0038] この構造により、光電変換プラグ 104をソケット 105に挿入した際のがたつきを抑制 している。その結果、光電変換素子 101から導出されたリードフレーム 109と、ソケット 105側の接続端子 117との接続安定性が増すため、その接続部分における電気信 号の伝送ロスが低減でき、光電変換モジュールの電気特性を安定させることができる 。さらには、榭脂成形体 108の成形に用いられる金型の加工が容易になる。  With this structure, rattling when the photoelectric conversion plug 104 is inserted into the socket 105 is suppressed. As a result, the connection stability between the lead frame 109 derived from the photoelectric conversion element 101 and the connection terminal 117 on the socket 105 increases, so that the transmission loss of the electric signal at the connection can be reduced, and the photoelectric conversion module Electrical characteristics can be stabilized. Further, the processing of the mold used for molding the resin molded body 108 is facilitated.
[0039] なお、押圧部材 116としてソケット 105側に設けられた接続端子 117は、光電変換 素子 101側に湾曲するように挿入口 111a内に突出させている。それにより、その湾 曲に伴う接続端子 117の弾性を利用でき、別途の押圧部材を設けることなく光電変 換モジュールの特性を安定させることができる。  The connection terminal 117 provided on the socket 105 side as the pressing member 116 protrudes into the insertion port 111a so as to be curved toward the photoelectric conversion element 101. This makes it possible to utilize the elasticity of the connection terminal 117 due to the bending, and to stabilize the characteristics of the photoelectric conversion module without providing a separate pressing member.
[0040] また、押圧部材 116による光電変換プラグ 104の押圧方向を光電変換プラグ 104 の挿入方向に対して直交する向きに設定して 、る。それにより、挿入口 11 la内にお ける押圧部材 116が設けられた壁面と対向する壁面に対して、光電変換プラグ 104 が押さえ付けられるようになり、光電変換プラグ 104とソケット 105との一体性を一層 増すことができる。  The pressing direction of the photoelectric conversion plug 104 by the pressing member 116 is set to a direction orthogonal to the insertion direction of the photoelectric conversion plug 104. As a result, the photoelectric conversion plug 104 is pressed against the wall surface opposite to the wall surface on which the pressing member 116 is provided in the insertion opening 11 la, and the integration of the photoelectric conversion plug 104 and the socket 105 is performed. Can be further increased.
[0041] さらにまた、ソケット 105には、光電変換プラグ 104の表面に露出したリードフレーム の露出部 109bと接続する放熱部材 118が設けられている。この放熱部材 118は、銅 などの熱伝導性の高い材質のものが好適である。この構造により、リードフレームの 露出部 109b、放熱部材 118を介して、光電変換素子 101の放熱効果を高めること ができる。 [0042] (実施の形態 2) Further, the socket 105 is provided with a heat radiating member 118 connected to the exposed portion 109b of the lead frame exposed on the surface of the photoelectric conversion plug 104. The heat dissipating member 118 is preferably made of a material having high thermal conductivity such as copper. With this structure, the heat radiation effect of the photoelectric conversion element 101 can be enhanced via the exposed portion 109b of the lead frame and the heat radiation member 118. (Embodiment 2)
以下、実施の形態 2について図面を用いて説明する。図 2Aは本発明の実施の形 態 2における光電変換プラグの断面図、図 2Bは図 2Aに示す光電変換プラグが結合 されるソケットの断面図であり、図 3は図 2Aに示す光電変換プラグが図 2Bに示すソ ケットに結合した光電変換モジュールを示す断面図である。  Hereinafter, Embodiment 2 will be described with reference to the drawings. 2A is a sectional view of a photoelectric conversion plug according to Embodiment 2 of the present invention, FIG. 2B is a sectional view of a socket to which the photoelectric conversion plug shown in FIG. 2A is coupled, and FIG. 3 is a photoelectric conversion plug shown in FIG. 2A. FIG. 3B is a sectional view showing the photoelectric conversion module coupled to the socket shown in FIG. 2B.
[0043] 説明の都合上、図 2Aに示す光電変換プラグ 201と、図 2Bに示すソケット 213とを 組み合わせたものを光電変換モジュールと呼ぶ。 For convenience of explanation, a combination of the photoelectric conversion plug 201 shown in FIG. 2A and the socket 213 shown in FIG. 2B is called a photoelectric conversion module.
[0044] 図 2Aにおいて、光電変換プラグ 201の本体部 202は、光学榭脂により構成されて いる。光学レンズ部 203は、光電変換素子 204の発光又は集光のために設けられ、 本体部 202と一体で成形されている。こうして、榭脂成形体 238が形成されている。 In FIG. 2A, main body 202 of photoelectric conversion plug 201 is made of an optical resin. The optical lens unit 203 is provided for light emission or light collection of the photoelectric conversion element 204, and is formed integrally with the main body unit 202. Thus, a resin molded body 238 is formed.
[0045] なお、光電変換素子 204には、面発光型の素子が使用されている。リードフレームAs the photoelectric conversion element 204, a surface-emitting type element is used. Lead frame
205には、ワイヤー 206を介して光電変換素子 204が接続されている。また、光電変 換素子 204は、ワイヤー 206及びリードフレーム 205の一部とともに、上記光学榭脂 力もなる本体部 202にインサート成形されている。 The photoelectric conversion element 204 is connected to 205 via a wire 206. The photoelectric conversion element 204 is insert-molded together with the wire 206 and a part of the lead frame 205 into the main body 202 having the above-described optical resin.
[0046] ファイバ保持部 207は、光ファイバ 235を光電変換プラグ 201の本体部 202に結合 するために設けられている。鏡筒部 208は、ファイバ保持部 207と光学レンズ部 203 との間に形成されている。 The fiber holding section 207 is provided for coupling the optical fiber 235 to the main body 202 of the photoelectric conversion plug 201. The lens barrel unit 208 is formed between the fiber holding unit 207 and the optical lens unit 203.
[0047] 光ファイバ 235は、光電変換プラグ 201の本体部 202に設けられたファイバ保持部[0047] The optical fiber 235 is a fiber holding portion provided in the main body 202 of the photoelectric conversion plug 201.
207に挿入されて結合されている。なお、光ファイバ 235は、コア 210とクラッド 211と より構成されている。また、光ファイバ 235は、本体部 202に接着剤 212により固着さ れている。 207 is inserted and joined. The optical fiber 235 includes a core 210 and a clad 211. The optical fiber 235 is fixed to the main body 202 with an adhesive 212.
[0048] 図 2Bにおいて、ソケット 213は、榭脂製のハウジング 214を備えている。このハウジ ング 214には、光電変換プラグ 201の本体部 202が嵌まり込む空洞部と、この空洞部 に嵌まり込んだ本体部 202を係止する係止用突起 214aが設けられている。さらに、 ハウジング 214には、光電変換プラグ 201のリードフレーム 205が当接する端子 215 がインサート成形されて 、る。  In FIG. 2B, the socket 213 includes a resin housing 214. The housing 214 is provided with a hollow portion into which the main body portion 202 of the photoelectric conversion plug 201 is fitted, and a locking projection 214a for locking the main body portion 202 fitted into the hollow portion. Further, a terminal 215 to which the lead frame 205 of the photoelectric conversion plug 201 abuts is insert-molded in the housing 214.
[0049] また、端子 215は、リードフレーム 205に付勢状態で当接するように、ばね性を有し た材料を湾曲させて構成している。ソケット 213と、光電変換モジュールを構成するた めの、集積回路 217と電子部品 218とが、配線基板 216上に実装されている。 The terminal 215 is formed by bending a material having spring properties so as to abut on the lead frame 205 in a biased state. The socket 213 and the photoelectric conversion module For this purpose, an integrated circuit 217 and an electronic component 218 are mounted on a wiring board 216.
[0050] 次に、このように構成された光電変換プラグ 201の製造方法について図面を用いて 説明する。図 4は図 2Aに示す光電変換プラグの製造工程図、図 5Aは図 4に示す光 電変換プラグ成形工程に使用される射出成形金型の断面図、図 5Bは同側面図であ り、図 5Cは図 5Aに示す射出成形金型の 5C-5C断面図である。  Next, a method for manufacturing the photoelectric conversion plug 201 thus configured will be described with reference to the drawings. Fig. 4 is a manufacturing process diagram of the photoelectric conversion plug shown in Fig. 2A, Fig. 5A is a cross-sectional view of an injection molding die used in the photoelectric conversion plug forming process shown in Fig. 4, and Fig. 5B is a side view of the same. FIG. 5C is a sectional view taken along the line 5C-5C of the injection mold shown in FIG. 5A.
[0051] 図 4に示すように、光電変換プラグの製造方法は、フープ基材形成工程、素子接合 工程、光電変換プラグ成形工程、分断工程及びフレーム加工工程を含んでいる。一 例として、図 4に示す光電変換プラグの製造方法を、図 2Aに示す光電変換プラグ 20 1に適用しながら説明する。  As shown in FIG. 4, the method for manufacturing a photoelectric conversion plug includes a hoop base material forming step, an element bonding step, a photoelectric conversion plug forming step, a cutting step, and a frame processing step. As an example, a method for manufacturing the photoelectric conversion plug shown in FIG. 4 will be described while being applied to the photoelectric conversion plug 201 shown in FIG. 2A.
[0052] フープ基材形成工程において、光電変換素子 204が接合される素子接合用フレー ム 219aと、光電変換素子 204が電気的に接続される電気接続用リードフレーム 219 eとを 1組とし、これをフープ状の基材 219に所定の間隔で連続して形成する。  [0052] In the hoop base material forming step, an element bonding frame 219a to which the photoelectric conversion element 204 is bonded and an electrical connection lead frame 219e to which the photoelectric conversion element 204 is electrically connected are formed as one set, This is continuously formed at predetermined intervals on the hoop-shaped base material 219.
[0053] 素子接合工程において、素子接合用フレーム 219aの所定の位置に光電変換素子 204を接合し、この光電変換素子 204の陽極と陰極を電気接続用リードフレーム 219 eに夫々接続する。  [0053] In the element bonding step, the photoelectric conversion element 204 is bonded to a predetermined position of the element bonding frame 219a, and the anode and the cathode of the photoelectric conversion element 204 are connected to the electrical connection lead frame 219e.
[0054] 光電変換プラグ成形工程にぉ ヽて、光電変換素子 204を射出成形金型の所定の 位置に載置し、光学レンズ部 203とファイバ保持部 207と鏡筒部 208とを有する光電 変換プラグ 201を、光電変換素子 204と上記各リードフレーム 219eの一部がモール ドされるようにしてインサート成形する。  In the photoelectric conversion plug molding step, the photoelectric conversion element 204 is placed at a predetermined position of an injection molding die, and has a photoelectric conversion unit including an optical lens unit 203, a fiber holding unit 207, and a lens barrel unit 208. The plug 201 is insert-molded so that the photoelectric conversion element 204 and a part of each of the lead frames 219e are molded.
[0055] 分断工程にぉ ヽて、上記光電変換プラグ成形工程にて成形された光電変換プラグ[0055] In the dividing step, the photoelectric conversion plug formed in the photoelectric conversion plug forming step is formed.
201をフープ状の基材 219から分断する。 201 is separated from the hoop-shaped substrate 219.
[0056] フレーム加工工程において、上記分断工程にて分断された光電変換プラグ 201の 素子接合用フレーム 219a及び電気接続用リードフレーム 219eをカ卩ェをする。 [0056] In the frame processing step, the element bonding frame 219a and the electrical connection lead frame 219e of the photoelectric conversion plug 201 cut in the cutting step are cut.
[0057] なお、上記分断工程及びフレーム加工工程を合わせた工程、すなわち、光電変換 プラグ 201をフープ状の基材 219から分断して個片とする工程を広い意味の加工ェ 程と呼ぶことにする。 Note that a process in which the above-described dividing process and the frame processing process are combined, that is, a process in which the photoelectric conversion plug 201 is separated from the hoop-shaped base material 219 into individual pieces is referred to as a processing process in a broad sense. I do.
[0058] 図 4に示す光電変換プラグの製造方法の各工程について、より詳細な説明を加え る。まず、フープ基材形成工程では、フープ状の基材 219に 1組のリードフレームを 所定の間隔で連続して設ける。この 1組のリードフレームは、光電変換素子 204が接 合される素子接合用フレーム 219aと、光電変換素子 204が電気的に接続される電 気接続用リードフレーム 219eとからなる。また、その電気接続用リードフレーム 219e は、光電変換素子 204の陽極が接続される陽極リードフレーム 219bと、光電変換素 子 204の陰極が接続される陰極リードフレーム 219cと力もなる。 [0058] Each step of the method for manufacturing the photoelectric conversion plug shown in Fig. 4 will be described in more detail. First, in the hoop base material forming step, one set of lead frames is mounted on the hoop-shaped base material 219. It is provided continuously at a predetermined interval. This set of lead frames includes an element bonding frame 219a to which the photoelectric conversion element 204 is connected, and an electrical connection lead frame 219e to which the photoelectric conversion element 204 is electrically connected. Further, the electrical connection lead frame 219e also has a force with the anode lead frame 219b to which the anode of the photoelectric conversion element 204 is connected and the cathode lead frame 219c to which the cathode of the photoelectric conversion element 204 is connected.
[0059] なお、このフープ基材形成工程は、エッチング力卩ェ、又は金型を用いた打ち抜き加 ェのいずれで行っても良ぐ寸法精度、コスト等を考慮して適宜採択すればよい。な お、フープ状の基材 219にはパイロットピン 221が嵌まり込む貫通孔 219dが設けら れている。 The hoop base material forming step may be appropriately selected in consideration of dimensional accuracy, cost, and the like, which may be performed by either etching force punching or punching using a die. The hoop-shaped base material 219 has a through hole 219d into which the pilot pin 221 fits.
[0060] 次に、素子接合工程では、素子接合用フレーム 219aの所定の位置に導電性接着 剤を用いて光電変換素子 204を接合する。また、この光電変換素子 204の陽極を陽 極リードフレーム 219bに接続し、かつ、光電変換素子 204の陰極を陰極リードフレー ム 219cへ接続する。なお、この接続は、ワイヤー 206を用いて、ワイヤーボンディン グすることで接続している。  Next, in the element bonding step, the photoelectric conversion element 204 is bonded to a predetermined position of the element bonding frame 219a using a conductive adhesive. Also, the anode of the photoelectric conversion element 204 is connected to the anode lead frame 219b, and the cathode of the photoelectric conversion element 204 is connected to the cathode lead frame 219c. This connection is made by wire bonding using a wire 206.
[0061] 次に、光電変換プラグ成形工程では、フープ状の基材 219に接合された光電変換 素子 204を射出成形用の金型 220内に配置し、基材 219の上記各フレーム 219a、 2 19b、 219cの一部がモールドされるようにして、ワイヤー 206を含む光電変換素子 2 04を金型 220内にインサートした状態で本体部 202の成形を行う。  Next, in the photoelectric conversion plug forming step, the photoelectric conversion element 204 bonded to the hoop-shaped base material 219 is disposed in an injection molding die 220, and the above-described frames 219a, 2 The main body 202 is formed while the photoelectric conversion element 204 including the wire 206 is inserted into the mold 220 such that a part of 19b and 219c is molded.
[0062] なお、光電変換プラグ 201は、光電変換素子 204の受光又は発光のための光学レ ンズ部 203と、この光学レンズ部 203の受又は発光のための光ファイバが結合される ファイバ保持部 207と、このファイバ保持部 207と光学レンズ部 203との間に形成さ れる鏡筒部 208を有している。そして、この光電変換プラグ成形工程では、光学レン ズ部 203、ファイバ保持部 207、鏡筒部 208も、本体部 202の成形と同時に一体で 成形される。  [0062] The photoelectric conversion plug 201 includes an optical lens unit 203 for receiving or emitting light from the photoelectric conversion element 204 and a fiber holding unit to which an optical fiber for receiving or emitting light from the optical lens unit 203 is coupled. 207, and a lens barrel 208 formed between the fiber holding part 207 and the optical lens part 203. Then, in this photoelectric conversion plug forming step, the optical lens unit 203, the fiber holding unit 207, and the lens barrel unit 208 are also integrally formed at the same time when the main unit 202 is formed.
[0063] また、パイロットピン 221は金型 220に設けられる。パイロットピン 221は、基材 219 に設けられた貫通孔 219dが嵌まり込んで位置決めされるとともに、素子接合用フレ ーム 219aの所定の位置に光電変換素子 204を接合する際の基準となるものである。  Further, pilot pin 221 is provided on mold 220. The pilot pin 221 is positioned by being fitted into the through hole 219d provided in the base material 219, and serves as a reference when bonding the photoelectric conversion element 204 to a predetermined position of the element bonding frame 219a. It is.
[0064] 次に分断工程では、上記成形を終えた本体部 202をフープ状の基材 219から分断 し、その後のフレーム加工工程では、本体部 202から表出した上記各フレーム 219aNext, in the cutting step, the main body 202 after the above-mentioned molding is cut from the hoop-shaped base material 219. Then, in the subsequent frame processing step, each of the above frames 219a
、 219b, 219cを折り曲げカ卩ェすることにより光電変換プラグ 201を得る。 219b and 219c are bent to obtain the photoelectric conversion plug 201.
[0065] ここで、図 4に示す光電変換プラグ成形工程にて用いられる射出成形金型の一例 について説明する。図 5Aは射出成形金型の断面図、図 5Bは同側面図であり、図 5Here, an example of an injection mold used in the photoelectric conversion plug forming step shown in FIG. 4 will be described. FIG. 5A is a cross-sectional view of the injection mold, and FIG. 5B is a side view of the same.
Cは図 5A中の断面線 5C—5Cにおける断面図である。 FIG. 5C is a sectional view taken along section line 5C-5C in FIG. 5A.
[0066] 図 4に示す金型 220には、図 5Aに示すように、光電変換プラグ 201の本体部 202 を形成するための空洞部 222が設けられている。 As shown in FIG. 5A, the mold 220 shown in FIG. 4 is provided with a cavity 222 for forming the main body 202 of the photoelectric conversion plug 201.
[0067] なお、スライドピン 223は、図 5Cに示す X方向にスライド可能である。このスライドピ ン 223の先端には、光学レンズ部 203を形成するために、円弧状に加工された半円 状の円弧部 224が設けられて ヽる。 Note that the slide pin 223 can slide in the X direction shown in FIG. 5C. At the tip of the slide pin 223, a semicircular arc portion 224 formed into an arc shape is formed to form the optical lens portion 203.
[0068] さらに、金型 220には、鏡筒部 208を形成するための鏡筒形成部 225と、ファイバ 保持部 207を形成するためのファイバ保持部形成部 226とが連続して設けられてい る。 Further, the mold 220 is provided with a lens barrel forming part 225 for forming the lens barrel 208 and a fiber holding part forming part 226 for forming the fiber holding part 207 in succession. You.
[0069] このように、鏡筒部 208とファイバ保持部 207を形成するために、スライドピン 223を 用いている。これにより、射出成形後に、スライドピン 223を X方向にスライドさせて、 形成された鏡筒部 208及びファイバ保持部 207からスライドピン 223を引き抜くため に必要となる鏡筒部 208及びファイバ保持部 207の内径部の抜きテーパを小さくで きる。  As described above, the slide pin 223 is used to form the lens barrel 208 and the fiber holding part 207. Thus, after the injection molding, the slide pin 223 is slid in the X direction to pull out the slide pin 223 from the formed barrel section 208 and the fiber holding section 207. It is possible to reduce the taper of the inner diameter part.
[0070] したがって、ファイバ保持部 207へ光ファイバ 235が挿入された際のがたつきなどを 小さくでき、光電変換素子 204に対して光ファイバ 235を精度良く位置決めできる。  [0070] Therefore, rattling when the optical fiber 235 is inserted into the fiber holding portion 207 can be reduced, and the optical fiber 235 can be accurately positioned with respect to the photoelectric conversion element 204.
[0071] さらに、金型 220には、素子接合用フレーム 219aに接合された光電変換素子 204 力 射出される榭脂によって移動しないために、光電変換素子 204を裏面力も保持 するバックアップピン 227を設けて!/、る。  Further, the mold 220 is provided with a backup pin 227 which also holds the back surface force of the photoelectric conversion element 204 in order to prevent the photoelectric conversion element 204 from being moved by the resin injected by the photoelectric conversion element 204 bonded to the element bonding frame 219a. T! /
[0072] また、図 5A中の符号 230はトンネルゲートを示す。このトンネルゲート 230は、パー ティングライン 209から、光電変換プラグ 201の本体部 202の両側の周面に向かって 傾斜して設けられている。さらに、トンネルゲート 230の射出ロカ スライドピン 223の 鏡筒形成部 225に向力 ように形成されている。なお、本実施の形態におけるパーテ イングライン 209は、光電変換素子 204が接合された素子接合用フレーム 219aの裏 面側としている。これにより、金型の構造が簡単になる。 [0072] Reference numeral 230 in Fig. 5A indicates a tunnel gate. The tunnel gate 230 is provided to be inclined from the parting line 209 toward the peripheral surfaces on both sides of the main body 202 of the photoelectric conversion plug 201. Further, it is formed so as to face the lens barrel forming portion 225 of the exit rocker slide pin 223 of the tunnel gate 230. Note that the parting line 209 in this embodiment is located on the back of the element bonding frame 219a to which the photoelectric conversion element 204 is bonded. The surface side. This simplifies the structure of the mold.
[0073] 次に、このように構成された射出成形用の金型 220を用いた光電変換プラグ 201の 成形方法について説明する。  Next, a method of forming the photoelectric conversion plug 201 using the injection-molding mold 220 configured as described above will be described.
[0074] まず、光電変換素子 204が、接合された素子接合用フレーム 219aと、接続された 電気接続用リードフレーム 219e (すなわち、陽極リードフレーム 219b、陰極リードフ レーム 219c)とを金型 220内の所定の位置に載置する。バックアップピン 227により 光電変換素子 204を裏面力も保持する。  First, the photoelectric conversion element 204 is connected to the element bonding frame 219a and the connected electrical connection lead frame 219e (ie, the anode lead frame 219b and the cathode lead frame 219c) in the mold 220. Place in place. The back-up pin 227 also holds the back surface force of the photoelectric conversion element 204.
[0075] その後に、トンネルゲート 230を通して溶融状態の榭脂を射出することにより、光電 変換プラグ 201の本体部 202を成形する。このとき、溶融状態の榭脂を射出する際 には、ファイバ保持部 207から鏡筒部 208へと樹脂が充填されるまでの射出速度に 比べて、光学レンズ部 203を形成するために半円状の円弧部 224へ榭脂を充填する ときの射出速度を遅くするようにする。これによつて、光学レンズ部 203には、泡が溜 まって気泡ができたり、ひけが発生したりすることがなくなり、精度、品質に優れた光 学レンズ部 203を形成することができる。  After that, the molten resin is injected through the tunnel gate 230 to form the main body 202 of the photoelectric conversion plug 201. At this time, when injecting the resin in a molten state, compared to the injection speed until the resin is filled from the fiber holding unit 207 to the lens barrel unit 208, a semicircle is required to form the optical lens unit 203. The injection speed when filling resin into the circular arc portion 224 is reduced. As a result, bubbles do not accumulate in the optical lens unit 203 to form bubbles or sink marks, and the optical lens unit 203 having excellent accuracy and quality can be formed.
[0076] なお、本実施の形態においては、フープ基材形成工程において、素子接合用フレ ーム 219aと、電気接続用リードフレーム 219e (すなわち、電気陽極リードフレーム 21 9b、陰極リードフレーム 219c)とを 1組のリードフレームとして構成したものを説明した 。しかし、本発明はこれに限定されるものではなぐ素子接合用フレーム 219aが、陽 極リードフレーム 219b又は陰極リードフレーム 219cのいずれかを兼ねるような構成 にしてもよい。  In the present embodiment, in the hoop base material forming step, the element bonding frame 219a and the electrical connection lead frame 219e (ie, the electric anode lead frame 219b and the cathode lead frame 219c) Has been described as a set of lead frames. However, the present invention is not limited to this, and the element bonding frame 219a may be configured to also serve as either the anode lead frame 219b or the cathode lead frame 219c.
[0077] また、素子接合用フレーム 219aと光電変換素子 204との接合は、導電性接着剤を 用いて行うようにしたが、本発明はこれに限定されるものではな!/、。  [0077] Also, the joining between the element joining frame 219a and the photoelectric conversion element 204 is performed using a conductive adhesive, but the present invention is not limited to this.
[0078] また、光電変換素子 204の陽極と陽極リードフレーム 219bとの接続、及び光電変 換素子 204の陰極と陰極リードフレーム 219cとの接続は、ワイヤーボンディングで行 うようにした力 本発明はこれに限定されるものではない。  The connection between the anode of the photoelectric conversion element 204 and the anode lead frame 219b and the connection between the cathode of the photoelectric conversion element 204 and the cathode lead frame 219c are performed by wire bonding. It is not limited to this.
[0079] 以上のように、本実施の形態による光電変換プラグ 201の製造方法では、光電変 換素子 204と、光学レンズ部 203と、ファイバ保持部 207とを一体ィ匕して成形すること が可能になる。したがって、光軸合わせ作業が不要になるので、部品点数の削減と 組み立て工程の簡素化を図ることができる。また、光軸の合わせ精度と信頼性に優 れた光電変換プラグ 201を安価に製造することができるという格別の作用効果を奏す るものである。 As described above, in the method for manufacturing the photoelectric conversion plug 201 according to the present embodiment, the photoelectric conversion element 204, the optical lens unit 203, and the fiber holding unit 207 can be integrally molded. Will be possible. This eliminates the need for optical axis alignment work. The assembling process can be simplified. In addition, the photoelectric conversion plug 201 having excellent alignment accuracy and reliability of the optical axis can be manufactured at a low cost, and has a special function and effect.
産業上の利用可能性 Industrial applicability
本発明による光電変換プラグ及び光電変換モジュールは、生産性を向上できると V、う効果を有し、光伝送システムにお 、て有用である。  The photoelectric conversion plug and the photoelectric conversion module according to the present invention have the effect of improving productivity, and are useful in an optical transmission system.

Claims

請求の範囲 The scope of the claims
[1] 光電変換素子と、  [1] a photoelectric conversion element,
前記光電変換素子から出力された光信号を光ファイバに集光するための光学レンズ 部と、  An optical lens unit for condensing an optical signal output from the photoelectric conversion element on an optical fiber,
前記光学レンズ部に隣接して設けられた鏡筒部と、  A lens barrel provided adjacent to the optical lens,
前記鏡筒部の端部に設けられ前記光ファイバを支持するためのファイバ保持部とを 含み、  A fiber holding portion provided at an end of the lens barrel portion for supporting the optical fiber,
ここに、前記光学レンズ部と前記鏡筒部と前記ファイバ保持部を榭脂により一体成形 するとともに、この榭脂成形体の内部に前記光電変換素子を配設したことを特徴とす る光電変換プラグ。  Here, the optical lens unit, the lens barrel unit, and the fiber holding unit are integrally formed of resin, and the photoelectric conversion element is disposed inside the resin molded body. plug.
[2] 光電変換素子は、榭脂成形体の外部に引き出された外部接続用のリードフレームを 有し、前記リードフレームにおける外部接続部分以外にも前記リードフレームの端部 を前記榭脂成形体の外表面に露出させたことを特徴とする請求項 1記載の光電変換 プラグ。  [2] The photoelectric conversion element has a lead frame for external connection drawn out of the resin molded body, and an end portion of the lead frame other than the external connection portion in the lead frame. 2. The photoelectric conversion plug according to claim 1, wherein the photoelectric conversion plug is exposed on an outer surface of the plug.
[3] リードフレームにおける外部接続部分以外の榭脂成形体の表面に露出した端部は、 前記榭脂成形体における前記外部接続部分の引き出された側面と対向する側面に 配置したことを特徴とする請求項 2記載の光電変換プラグ。  [3] The end of the lead frame exposed on the surface of the resin molded body other than the external connection portion is disposed on a side surface of the resin molded body opposite to a side surface from which the external connection portion is drawn out. 3. The photoelectric conversion plug according to claim 2, wherein:
[4] 光電変換素子は、光学レンズ部と対向する面に発光部を有することを特徴とする請 求項 1記載の光電変換プラグ。 [4] The photoelectric conversion plug according to claim 1, wherein the photoelectric conversion element has a light emitting portion on a surface facing the optical lens portion.
[5] 光電変換プラグと、 [5] a photoelectric conversion plug,
前記光電変換プラグを取り付ける基板と、  A substrate on which the photoelectric conversion plug is mounted,
前記基板に取り付けられた信号処理回路とを含む光電変換モジュールであって、 ここに、前記光電変換プラグは、  A photoelectric conversion module including a signal processing circuit attached to the substrate, wherein the photoelectric conversion plug comprises:
光電変換素子と、  A photoelectric conversion element,
前記光電変換素子から出力された光信号を光ファイバに集光するための光学レンズ 部と、  An optical lens unit for condensing an optical signal output from the photoelectric conversion element on an optical fiber,
前記光学レンズ部に隣接して設けられた鏡筒部と、  A lens barrel provided adjacent to the optical lens,
前記鏡筒部の端部に設けられ前記光ファイバを支持するためのファイバ保持部を備 え、 A fiber holder provided at an end of the lens barrel for supporting the optical fiber; e,
前記光学レンズ部と前記鏡筒部と前記ファイバ保持部を榭脂により一体成形するとと もに、この榭脂成形体の内部に前記光電変換素子を配設したことを特徴とする光電 変換モジュール。  A photoelectric conversion module, wherein the optical lens unit, the lens barrel unit, and the fiber holding unit are integrally formed of resin, and the photoelectric conversion element is disposed inside the resin molded body.
[6] 基板に光電変換プラグを取り付けるにあたり、前記基板上に前記光電変換プラグを 着脱可能に挿入固定するためのソケットを備えたことを特徴とする請求項 5記載の光 電変換モジュール。  6. The photoelectric conversion module according to claim 5, further comprising a socket for detachably inserting and fixing the photoelectric conversion plug on the substrate when attaching the photoelectric conversion plug to the substrate.
[7] 光電変換プラグの側面に係止用突起を設けるとともに、ソケットにおける前記光電変 換プラグを挿入するための挿入口の内に前記光電変換プラグを押圧固定する押圧 部材を備えたことを特徴とする請求項 6に記載の光電変換モジュール。  [7] A locking projection is provided on a side surface of the photoelectric conversion plug, and a pressing member for pressing and fixing the photoelectric conversion plug is provided in an insertion opening for inserting the photoelectric conversion plug in the socket. 7. The photoelectric conversion module according to claim 6, wherein
[8] 押圧部材は、光電変換プラグの表面に引き出されたリードフレームと当接する接続端 子を用いて形成したことを特徴とする請求項 7記載の光電変換モジュール。  8. The photoelectric conversion module according to claim 7, wherein the pressing member is formed using a connection terminal that comes into contact with the lead frame drawn out of the surface of the photoelectric conversion plug.
[9] 押圧部材の光電変換プラグへの押圧方向を、前記光電変換プラグのソケットへの挿 入方向に対して直交する向きに設定したことを特徴とする請求項 7記載の光電変換 モジユーノレ。  9. The photoelectric conversion module according to claim 7, wherein a pressing direction of the pressing member against the photoelectric conversion plug is set to a direction orthogonal to a direction of inserting the photoelectric conversion plug into the socket.
[10] ソケットに光電変換プラグ力 露出したリードフレームの露出部分と当接する放熱部 材を設けたことを特徴とする請求項 6に記載の光電変換モジュール。  [10] The photoelectric conversion module according to claim 6, wherein the socket is provided with a heat dissipating member which comes into contact with the exposed portion of the lead frame where the photoelectric conversion plug force is exposed.
[11] 光電変換素子が接合される素子接合用フレームと、前記光電変換素子が電気的に 接続される電気接続用リードフレームとを 1組とし、これをフープ状の基材に所定の間 隔で連続して設けるフープ基材形成工程と、  [11] An element bonding frame to which the photoelectric conversion elements are bonded and a lead frame for electrical connection to which the photoelectric conversion elements are electrically connected are made into one set, which is provided on a hoop-shaped base material at a predetermined interval. A hoop base material forming step provided continuously in
前記素子接合用フレームの所定の位置に光電変換素子を接合し、この光電変換素 子の陽極と陰極を電気接続用リードフレームに夫々接続する素子接合工程と、 前記光電変換素子を射出成形金型の所定の位置に載置し、前記光電変換素子から 出力された光信号を光ファイバに集光するための光学レンズ部と、前記光ファイバが 結合されるファイバ保持部と、前記光学レンズ部と前記ファイバ保持部間に形成され る鏡筒部とを有する光電変換プラグを、前記光電変換素子と前記各フレームの一部 がモールドされるようにしてインサート成形する光電変換プラグ成形工程と、 成形された光電変換プラグをフープ状の基材力 分断して個片とする加工工程とを 含むことを特徴とする光電変換プラグの製造方法。 An element joining step of joining a photoelectric conversion element to a predetermined position of the element joining frame and connecting an anode and a cathode of the photoelectric conversion element to an electrical connection lead frame, respectively; An optical lens unit for placing the optical signal output from the photoelectric conversion element on an optical fiber, a fiber holding unit to which the optical fiber is coupled, and the optical lens unit. A photoelectric conversion plug molding step of insert-molding a photoelectric conversion plug having a lens barrel formed between the fiber holding portions so that the photoelectric conversion element and a part of each of the frames are molded; And the processing step of dividing the photoelectric conversion plug into A method for manufacturing a photoelectric conversion plug, comprising:
[12] 光電変換プラグ成形工程における射出成形金型は、光電変換素子が接合された素 子接合用フレームの裏面がパーテイングラインとなるようにし、このパーテイングライン 力も光電変換プラグの周面にトンネルゲートを介して榭脂を射出し、かつ、このトンネ ルゲートの射出口が鏡筒部を形成する金型部分に向かって射出されるように傾斜し て設けたことを特徴とする請求項 11記載の光電変換プラグの製造方法。  [12] In the injection molding die in the photoelectric conversion plug molding process, the back surface of the element bonding frame to which the photoelectric conversion elements are bonded is a parting line, and the parting line force is also applied to the peripheral surface of the photoelectric conversion plug. The resin is injected through a tunnel gate, and the injection port of the tunnel gate is provided so as to be inclined so as to be injected toward a mold portion forming a lens barrel. A method for producing the photoelectric conversion plug according to the above.
[13] 光電変換プラグ成形工程における射出成形において、トンネルゲートを介して榭脂 を射出する速度を、ファイバ保持部力ゝら鏡筒部へと榭脂が充填されるまでの速度に 対して、光学レンズ部へ樹脂が充填される速度を遅くしたことを特徴とする請求項 12 記載の光電変換プラグの製造方法。  [13] In the injection molding in the photoelectric conversion plug molding process, the speed at which the resin is injected through the tunnel gate is compared with the speed at which the resin is filled into the lens barrel by the force of the fiber holding portion. 13. The method for manufacturing a photoelectric conversion plug according to claim 12, wherein a speed at which the resin is filled into the optical lens portion is reduced.
[14] 素子接合工程における光電変換素子と電気接続用リードフレームの接続をワイヤー ボンディングで行うことを特徴とする請求項 11記載の光電変換プラグの製造方法。  14. The method of manufacturing a photoelectric conversion plug according to claim 11, wherein the connection between the photoelectric conversion element and the lead frame for electrical connection in the element bonding step is performed by wire bonding.
[15] フープ状の基材に所定の間隔で貫通孔を設け、この貫通孔に嵌まり込むパイロットピ ンを基準にして素子接合用フレームの所定の位置に光電変換素子を位置決めして 接合することを特徴とする請求項 11記載の光電変換プラグの製造方法。  [15] A through-hole is provided at a predetermined interval in the hoop-shaped base material, and the photoelectric conversion element is positioned and bonded to a predetermined position of the element bonding frame with reference to a pilot pin fitted into the through-hole. 12. The method for manufacturing a photoelectric conversion plug according to claim 11, wherein:
PCT/JP2005/001373 2004-02-17 2005-02-01 Photoelectric conversion plug and photoelectric conversion module using it, and production method for photoelectric conversion plug WO2005078807A1 (en)

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