JP2000221368A - Optical semiconductor mounted device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the optical coupling operation and assembling and fixing operation of an optical semiconductor mounted device composed of an optical waveguide unit and an optical semiconductor element and to obtain an optical coupling structure which enables high-precision positioning and is free of optical coupling deviation. SOLUTION: When the optical semiconductor mounted device is constituted by optically coupling the optical waveguide unit 1 and optical semiconductor element 9 both having optical fiber connector structures, the optical waveguide unit 1 which has a surface perpendicular to the optical axis of an optical fiber 4 on the side of the optical waveguide unit where the optical semiconductor element is optically coupled and also has a positioning projection 2 on the vertical surface and a positioning substrate 5 which has a positioning recess 7 opposite the positioning projection 2 are used. Then the optical semiconductor element 9 is mounted on the positioning substrate 5, the positioning recess 7 and the positioning projection 2 of the optical waveguide unit 1 are made to abut against each other and then united to complete the optical coupling.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor mounting apparatus formed by optically coupling an optical waveguide unit having an optical fiber connector structure and an optical semiconductor element.

[0002]

2. Description of the Related Art Conventionally, as this type of optical semiconductor mounting apparatus,
For example, those having structures shown in FIGS. 9A and 9B and FIGS. 10A and 10B are known. 9 (a) and 9 (b) are perspective views showing the structure of an optical coupling portion of an optical semiconductor mounting device configured by optically coupling an optical waveguide unit having a conventional optical fiber connector structure and an optical semiconductor element. FIG. 2 is an enlarged longitudinal sectional view of a main part of the apparatus.

The structure of the optical coupling portion in this conventional example is such that the optical fiber 22 is projected from the optical waveguide unit 21 to the optical coupling side with the optical semiconductor element 24, and the mirror portion is polished diagonally downward to form the mirror portion. The optical coupling is performed by arranging the optical semiconductor element 24 on the lower surface thereof.

[0004] The optical semiconductor element 24 is
It is die-bonded together with an LSI (large-scale integrated circuit) 25 and is electrically connected by a gold wire or the like.
The alignment between the mirror portion of the optical fiber 22 and the optical semiconductor element 24 is performed by the optical waveguide unit 21 or the wiring board 23.
Is performed by adjusting the movement in the X direction and the Z direction shown in FIG. Thereafter, the optical waveguide unit 21 and the wiring board 23 are fixed with an adhesive or the like. In the Y direction (= optical axis direction), generally, the coupling tolerance is large, so that the movement adjustment is not usually performed.

FIGS. 10 (a) and 10 (b) show the structure of an optical coupling portion of an optical semiconductor mounting device constructed by optically coupling an optical semiconductor unit with an optical waveguide unit having a conventional optical fiber connector structure. It is the perspective view shown and the longitudinal cross-sectional view which expanded the principal part.

The structure of the optical coupling portion of this conventional example is such that an optical semiconductor is directly coupled with the optical semiconductor element 24 in the extending direction of the optical fiber 22 without changing the optical axis as in the above-mentioned conventional example. The elements 24 are arranged vertically. That is,
The optical semiconductor element 24 is attached to the insulating block lock 26,
These are mounted on a support 27 attached to the lower surface of the wiring board 23.

The optical fiber 22 and the optical semiconductor device 2
The alignment with 4 is performed by moving and adjusting the optical waveguide unit 21 or the wiring board 23 in the X direction and the Y direction shown in FIG. Thereafter, the optical waveguide unit 21 and the wiring board 23 are fixed with an adhesive or the like. Note that, in the optical axis direction, since the coupling tolerance is large, the movement adjustment is not performed in the case of this conventional example similarly to the above-described conventional example.

[0008]

However, as shown in FIG.
According to the optical semiconductor mounting apparatus in which the optical waveguide unit 21 having the conventional optical fiber connector structure and the optical semiconductor element 24 are optically coupled with each other as shown in FIG. After mounting the semiconductor element 24 and other components, the optical waveguide unit 21 or the wiring board 23 having a large shape is moved to perform the alignment work.
There is a disadvantage that the movement adjustment mechanism for positioning becomes large.

Further, in the above-mentioned conventional example, since the wiring board 23 is arranged vertically to the end face of the optical waveguide unit 21, it is difficult to perform a positioning operation, and in a state where the connection is fixed after the positioning operation. It is difficult to secure the mechanical strength of Therefore, there has been a problem that optical coupling shift is apt to occur due to mechanical stress accompanying attachment / detachment of the optical fiber connector.

The present invention has been made in view of such circumstances, and a first object of the present invention is to make it possible to easily perform an optical coupling operation and a fixing operation and to perform high-accuracy alignment. An object is to obtain an optical semiconductor mounting device having an optical coupling structure. A second object of the present invention is to provide an optical semiconductor mounting device having an optical coupling structure that does not cause optical coupling deviation even by a mechanical external force due to the attachment and detachment of an optical fiber connector.

[0011]

In order to meet such an object, an optical semiconductor mounting apparatus according to a first aspect of the present invention is configured such that an optical waveguide unit having an optical fiber connector structure and an optical semiconductor element are optically coupled. An optical semiconductor mounting device comprising: an optical waveguide unit having a surface perpendicular to an optical axis of an optical fiber on a side optically coupled to the optical semiconductor element and having an alignment projection on the perpendicular surface; An alignment substrate having an alignment recess at a position opposed to the alignment projection; mounting the optical semiconductor element on the alignment substrate; aligning the alignment substrate of the alignment substrate and the optical waveguide unit; The optical fiber and the semiconductor element are optically coupled by abutting the alignment projections and integrally combining them.

According to a second aspect of the present invention, in the optical semiconductor mounting apparatus according to the first aspect, the alignment is performed on a surface perpendicular to the optical axis of the optical fiber on the optical coupling side with the optical semiconductor element of the optical waveguide unit. A fixing claw for fixing the substrate is provided.

According to a third aspect of the present invention, in the optical semiconductor mounting apparatus according to the second aspect, the positioning substrate is assembled and fixed to the optical waveguide unit by heating and pressing the fixing claw to caulk. Features.

According to a fourth aspect of the present invention, in the optical semiconductor mounting apparatus according to the first aspect, the positioning substrate can be inserted into a position facing the positioning protrusion of the optical waveguide unit. It is characterized by having a positioning hole.

According to a fifth aspect of the present invention, in the optical semiconductor mounting apparatus according to the fourth aspect, the tip of the positioning protrusion inserted through the positioning hole is heated, pressed, and caulked to thereby form the positioning substrate. Is fixed to the optical waveguide unit.

An optical semiconductor mounting apparatus according to a sixth aspect of the present invention is an optical semiconductor mounting apparatus comprising an optical waveguide unit having an optical fiber connector structure and an optical semiconductor element optically coupled to each other. An optical waveguide unit having a surface perpendicular to the optical axis of the optical fiber on the side to be optically coupled to the optical fiber and having two sets of alignment projections on the vertical surface; and a position opposed to the first alignment projection. A lens array substrate having a positioning hole; and a positioning substrate having a positioning recess at a position facing the second positioning protrusion, wherein the optical waveguide is provided in the positioning hole of the lens array substrate. A first positioning projection of the unit is inserted, and a positioning recess of a positioning substrate on which the optical semiconductor element is mounted and a second positioning guide of the optical waveguide unit.
In a state where the positioning projections are abutted with each other, by integrally combining them, it is possible to optically couple the optical fiber, the lens portion of the lens array substrate, and the semiconductor element mounted on the positioning substrate. Features.

According to a seventh aspect of the present invention, in the optical semiconductor mounting apparatus according to the sixth aspect, heating and heating are performed in a state in which a tip of the first alignment projection is inserted into an alignment hole of the lens array substrate. The lens array substrate is assembled and fixed to the optical waveguide unit by pressing and caulking.

According to an eighth aspect of the present invention, in the optical semiconductor mounting apparatus according to the sixth aspect, the optical waveguide unit is configured to fix the alignment substrate to a vertical surface having a second alignment projection. It is characterized by having a fixed claw.

According to a ninth aspect of the present invention, in the optical semiconductor mounting apparatus according to the eighth aspect, the positioning substrate is assembled and fixed to the optical waveguide unit by heating, pressing, and caulking the fixing claw. Features.

According to a tenth aspect of the present invention, there is provided the optical semiconductor mounting device according to any one of the first to ninth aspects, wherein the optical waveguide unit is formed of a resin molded body made of an organic resin material. And

According to the present invention, the positioning substrate and the lens array substrate can be positioned and fixed on the surface perpendicular to the optical axis of the optical waveguide unit where the optical fibers protrude. . A semiconductor element that is optically coupled to the optical fiber is mounted on the alignment substrate in advance, and the semiconductor element is positioned and fixed to the optical waveguide unit, so that the optical coupling and fixing can be appropriately performed by a simple operation.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 1 to 3 show a first embodiment of an optical semiconductor mounting apparatus according to the present invention. In these figures, FIG. 1 is a perspective view showing an optical coupling structure between an optical waveguide unit of an optical semiconductor mounting device and an alignment substrate on which an optical semiconductor element is mounted, and FIGS.
FIG. 3B is a cross-sectional view showing an optical coupling and fixing structure between the optical waveguide unit of the optical semiconductor mounting device and the alignment substrate having the optical semiconductor element mounted thereon, and FIG. 3 is a light guide having the alignment substrate fixed of the optical semiconductor mounting device. It is a perspective view which shows the connection structure of a wave unit and a wiring board.

The optical waveguide unit 1 of the optical semiconductor mounting device according to the first embodiment is formed as a resin molded body made of an organic resin material. This optical waveguide unit 1
Has a structure in which a plurality of optical fibers 4 are arranged substantially in the center, and the left end of each optical fiber 4 in the figure can be connected to an existing optical fiber connector (for example, an MT connector). The right end face of the optical waveguide unit 1 in the figure is formed as a plane perpendicular to the optical axis of the optical fiber 4. And
On such a vertical end surface, positioning projections 2 formed of substantially inverted V-shaped projections are formed in the vertical direction and the horizontal direction. Further, a plurality of fixing claws 3 are formed near the outer edge of the vertical end face.

On the other hand, the positioning substrate 5 is formed of a silicon substrate or a quartz substrate or the like, and has a V-shaped groove at a position opposed to the positioning projection 2 of the optical waveguide unit 1 by the inverted V-shaped projection. A matching recess 7 is formed. On the surface on which the positioning recess 7 is formed, a positioning mark 6 having a predetermined positional relationship with a position of the optical waveguide unit 1 facing the optical fiber 4 is arranged. The optical semiconductor element 9 is mounted on the alignment substrate 5 by die bonding with reference to these alignment marks 6.

The alignment substrate 5 on which the optical semiconductor element 9 is mounted is, as shown in FIG.
The positioning projection (inverted V-shaped projection) 2 is mounted on the end face of the optical waveguide unit 1 such that the positioning recess (V-shaped groove) 7 is aligned. The fixing structure of the positioning board 5 is fixed by heating and softening each fixing claw 3 in the direction of the arrow in the figure while caulking as shown in FIG. 2B. .

FIG. 3 shows a connection structure between the optical waveguide unit 1 having the alignment substrate fixed as described above and the wiring substrate 10. That is, the optical waveguide unit 1 to which the positioning substrate 5 is fixed is disposed on the wiring substrate 10 on which the LSI 12 and other components are connected and mounted in advance, and these are fixed by fixing means such as screwing or bonding. Then, by electrically and mechanically connecting the electric terminals 8 on the optical waveguide unit 1 side and the wiring patterns 11 on the wiring board 10, an optical semiconductor mounting device is configured.

According to the optical semiconductor mounting device of this embodiment, the optical semiconductor element 9 is
Since the semiconductor element 9 is mounted on the alignment substrate 5 by die bonding, there is no other obstacle unlike the related art, so that the operation of aligning the semiconductor element 9 with the alignment substrate 5 becomes easy. Further, since the positioning substrate 5 has a small shape, there is an advantage that a movement adjusting mechanism for positioning is small.

The optical coupling between the optical waveguide unit 1 and the optical fiber 4 is performed by aligning the alignment projection 2 (inverted V-shaped projection) of the optical waveguide unit 1 with the alignment recess 7 (V-shaped) of the alignment substrate 5. It is completed simply by fitting the groove). Since the positioning substrate 5 is fixed by caulking the fixing claw 3 of the optical waveguide unit 1,
It can be very easily optically coupled and fixed.

In such an optical waveguide unit 1, a positioning projection 2 (an inverted V-shaped projection) having high dimensional accuracy can be obtained by resin molding techniques such as injection molding and transfer molding. Sufficient optical coupling accuracy can be ensured, and since it is excellent in mass productivity, a low-cost optical semiconductor mounting device can be configured.

Further, according to the optical semiconductor mounting apparatus according to this embodiment, since the optical semiconductor element 9 is integrated with the optical waveguide unit 1 via the alignment substrate 5, it is possible to mount and remove the optical fiber connector. There is no fear that optical coupling shift may occur even with such mechanical external force. Further, in this embodiment, the case where the optical waveguide unit 1 is formed of an organic resin material has been described, but it may be formed of a metal or an inorganic material.

[Second Embodiment] FIG. 4 shows a second embodiment of an optical semiconductor mounting apparatus according to the present invention, in which an optical coupling structure between an optical waveguide unit and a positioning substrate on which an optical semiconductor element is mounted. FIG.

In the above-described first embodiment, the positioning projection 2 of the optical waveguide unit 1 is an inverted V-shaped projection, and the positioning recess 7 of the positioning substrate 5 is a V-shaped groove. In the second embodiment, the positioning projection 2 of the optical waveguide unit 1 is formed to have a conical apex with a flat top, and the positioning recess 7 of the positioning substrate 5 is formed.
Is mortar-shaped. The other structure is the same as that of the first embodiment, and the operation and effect obtained thereby are also the same.

[Third Embodiment] FIG. 5 shows a third embodiment of the optical semiconductor mounting apparatus according to the present invention, and shows an optical coupling structure between an optical waveguide unit and a positioning substrate on which an optical semiconductor element is mounted. FIG.

In the third embodiment, the second embodiment
In the embodiment, the positioning projection 2 of the optical waveguide unit 1 has a so-called truncated pyramid shape in which the apexes of the pyramid are flattened, and the positioning recess 7 of the positioning substrate 5 conforms to the truncated pyramid shape described above. It has a shape. The other structure is the same as that of the first embodiment, and the operation and effect obtained thereby are also the same.

[Fourth Embodiment] FIG. 6 shows a fourth embodiment of the optical semiconductor mounting apparatus according to the present invention.
(B) is a cross-sectional view showing an optical coupling and fixing structure between the optical waveguide unit and the alignment substrate on which the optical semiconductor element is mounted.

In the fourth embodiment, the positioning projection 2 of the optical waveguide unit 1 has a shape obtained by stacking and combining a conical shape and a cylindrical shape. An alignment hole 13 is formed at a position facing the alignment projection 2.

In such a structure, positioning for optical coupling is performed by positioning projection 2 of optical waveguide unit 1.
Is inserted into the positioning hole 13, and after this positioning, the tip of the positioning projection 2 is heated and softened, and the pressure is crimped in the direction of the arrow in FIG. 6B. Thus, the alignment substrate 5 can be fixed while being aligned with the optical waveguide unit 1.

The structure of the heating caulking in this embodiment is the same as that of the first embodiment described above with reference to FIGS.
There is an advantage that the structure is simpler than the heating and caulking of the fixed claw 3 shown in (b), and the jig for heating and caulking may have a simpler structure. Other structures are the same as those described in the first embodiment.
This embodiment is the same as the first embodiment, and the operation and effect obtained by other structures are the same as those of the first embodiment.

[Fifth Embodiment] FIG. 7 shows a fifth embodiment of the optical semiconductor mounting apparatus according to the present invention. The optical waveguide unit, the lens array substrate and the alignment substrate on which the optical semiconductor element is mounted are shown. FIG. 8 is a cross-sectional view showing the optical coupling and fixing structure of the optical waveguide unit and the alignment substrate on which the lens array substrate and the optical semiconductor element are mounted in FIG.

In the fifth embodiment, the surface of the optical waveguide unit 1 perpendicular to the optical axis of the optical fiber 4 is defined by the first vertical surface located around the optical fiber 4 and the outer vertical surface. The second vertical surface is divided into two and the two vertical surfaces are provided with steps. Then, the positioning protrusion 2 described in the first embodiment described above is disposed on the second vertical surface, and the positioning protrusion 2 described in the fourth embodiment is disposed on the first vertical surface. I have.

The lens array substrate 14 is provided with a positioning hole 13 at a position facing the positioning projection 2 on the first vertical plane. The positioning substrate 5 on which the optical semiconductor element 9 is mounted is provided with a positioning recess 7 at a position facing the positioning protrusion 2 on the second vertical plane.

According to the structure of such an embodiment,
As shown in FIGS. 7 and 8A and 8B, the positioning projections 2 on the first vertical surface of the optical waveguide unit 1 are pushed through the positioning holes 13 of the lens array substrate 14. Then, the lens array substrate 14 can be fixed to the optical waveguide unit 1 by heating and softening the tip of the positioning projection 2 on the first vertical surface by heating and caulking.

Further, the positioning recess 7 of the positioning substrate 5 on which the optical semiconductor element 9 is mounted and the positioning protrusion 2 on the second vertical surface of the optical waveguide unit 1 are brought into contact with each other, whereby the positioning substrate 5 is fixed to the optical waveguide unit 1. Such fixing is performed by caulking the fixing claw 3 with heat.

Optical waveguide unit 1, lens array substrate 1
4. When the alignment substrate 5 on which the optical semiconductor element is mounted is assembled and fixed in the above-described state, the optical coupling between the optical fiber 4, the lens portion 15 of the lens array substrate 14, and the optical semiconductor element 9 can be easily and reliably performed. It can be carried out. Therefore, with such a structure, it is possible to realize an optical semiconductor mounting device with higher optical coupling efficiency without impairing the advantages and features associated with the structures in the above-described first to fourth embodiments.

The present invention is not limited to the structure described in the above embodiment, and it goes without saying that the shape, structure, etc. of each part constituting the optical semiconductor mounting device can be appropriately modified or changed. For example, the shape and structure of the optical waveguide unit 1,
Various modifications can be freely made with respect to the structure for incorporating the optical fiber 4 into the unit 1 and the shape of the positioning substrate 5 on which the optical semiconductor element is mounted.

Further, in the optical waveguide unit 1 according to the first and fourth embodiments described above, it has been described that the positioning substrate 5 is fixed by the fixing claw 3 by using the heating caulking. The present invention is not limited to this, and may be performed by caulking by mechanical bending, solder connection, fixing by an adhesive, or the like.

Further, in each of the above-described embodiments, the optical coupling with the semiconductor element 9 of the optical waveguide unit 1 in which the plurality of optical fibers 4 are aligned has been described, but the present invention is not limited to this, and the present invention is not limited thereto. Needless to say, optical coupling of a core fiber may be used.

Further, according to the present invention, even if an optical waveguide made of quartz or an optical waveguide made of a film is used, a block forming a plane perpendicular to the optical axis is attached to the end as an optical waveguide unit, and positioning is performed on this block. The present invention can be applied to any structure having a projection.

[0049]

As described above, according to the optical semiconductor mounting apparatus of the present invention, the optical semiconductor element is pre-aligned and fixed on a flat and small substrate. There is an advantage that the positioning operation can be easily performed, and the size of the movement adjusting mechanism for positioning can be reduced.

Further, according to the present invention, the optical coupling in the optical semiconductor mounting device is performed by the positioning protrusion of the optical waveguide unit,
It is completed simply by aligning the alignment recesses or holes on the alignment substrate or lens array substrate and mounting it, making it extremely easy to optically couple and fixing the substrate within this matching and mounting process. Since they can be performed at the same time, the number of man-hours can be significantly reduced.

Further, according to the present invention, since the optical semiconductor element is integrated with the optical waveguide unit via the positioning substrate, there is a concern that optical coupling shift may occur even when mechanical force for attaching and detaching the optical fiber connector is applied. Therefore, an optical semiconductor mounting device having high reliability can be obtained.

Further, according to the present invention, by manufacturing the optical waveguide unit using a resin molding technique such as injection molding or transfer molding, it is possible to realize an optical semiconductor mounting apparatus which is excellent in mass productivity and low in cost. it can.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an optical semiconductor mounting apparatus according to a first embodiment of the present invention, showing an optical coupling structure between an optical waveguide unit and an alignment substrate on which an optical semiconductor element is mounted.

FIG. 2 shows the optical semiconductor mounting device of FIG.
(B) is a cross-sectional view showing an optical coupling and fixing structure between the optical waveguide unit and the alignment substrate on which the optical semiconductor element is mounted.

3 is a perspective view showing a connection structure between an optical waveguide unit having a positioning substrate fixed and a wiring substrate in the optical semiconductor mounting device of FIG. 1;

FIG. 4 is a perspective view showing a second embodiment of the optical semiconductor mounting apparatus according to the present invention, showing an optical coupling structure between an optical waveguide unit and an alignment substrate on which an optical semiconductor element is mounted.

FIG. 5 is a perspective view showing a third embodiment of the optical semiconductor mounting apparatus according to the present invention and showing an optical coupling structure between an optical waveguide unit and an alignment substrate on which an optical semiconductor element is mounted.

FIG. 6 shows a fourth embodiment of the optical semiconductor mounting apparatus according to the present invention, wherein (a) and (b) show an optical coupling and fixing structure between the optical waveguide unit and an alignment substrate on which the optical semiconductor element is mounted. FIG.

FIG. 7 is a perspective view showing a fifth embodiment of the optical semiconductor mounting apparatus according to the present invention, showing an optical coupling structure between an optical waveguide unit, a lens array substrate, and a positioning substrate on which an optical semiconductor element is mounted. .

FIG. 8 shows the optical semiconductor mounting device of FIG.
(B) is a cross-sectional view showing the optical coupling and fixing structure of the optical waveguide unit, the lens array substrate, and the alignment substrate on which the optical semiconductor element is mounted.

FIG. 9 shows a first example of a conventional optical semiconductor mounting device,
(A) is a perspective view showing a structure of an optical coupling portion of the optical semiconductor mounting device, and (b) is an enlarged longitudinal sectional view of a main part thereof.

10A and 10B show a second example of a conventional optical semiconductor mounting device, in which FIG. 10A is a perspective view showing a structure of an optical coupling portion of the optical semiconductor mounting device, and FIG. It is.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Optical waveguide unit, 2 ... Positioning protrusion, 3 ... Fixed claw, 4 ... Optical fiber, 5 ... Positioning board, 6 ... Positioning mark, 7 ... Positioning recess, 8 ... Electric terminal, 9
... Optical semiconductor element, 10 ... Wiring board, 11 ... Wiring pattern, 12 ... LSI, 13 ... Positioning hole, 14 ... Lens array board, 15 ... Lens part.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kosuke Katsura 3-19-2 Nishi-Shinjuku, Shinjuku-ku, Tokyo Japan Telegraph and Telephone Co., Ltd. (72) Inventor Akira Aoki 3-192-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo No. Nippon Telegraph and Telephone Corporation (72) Inventor Ken Sakamoto 3-19-2 Nishi-Shinjuku, Shinjuku-ku, Tokyo F-term in Japan Telegraph and Telephone Corporation (reference) DA35

Claims (10)

[Claims] An optical semiconductor mounting apparatus comprising an optical waveguide unit having an optical fiber connector structure and an optical semiconductor element optically coupled to each other, wherein an optical axis of an optical fiber is provided on a side optically coupled to the optical semiconductor element. An optical waveguide unit having a vertical surface and having an alignment projection on the vertical surface; and an alignment substrate having an alignment recess at a position facing the alignment projection, Is mounted on the positioning substrate, and the positioning recess of the positioning substrate and the positioning projection of the optical waveguide unit are abutted to each other to integrally combine them, so that the optical fiber and the semiconductor element are combined. An optical semiconductor mounting device, which is optically coupled. 2. The optical semiconductor mounting device according to claim 1, wherein the alignment substrate is fixed to a surface perpendicular to an optical axis of an optical fiber on an optical coupling side with an optical semiconductor element of the optical waveguide unit. An optical semiconductor mounting device, comprising: a fixing claw. 3. The optical semiconductor mounting device according to claim 2, wherein the positioning substrate is assembled and fixed to the optical waveguide unit by heating, pressing and caulking the fixing claws. Mounting device. 4. The optical semiconductor mounting device according to claim 1, wherein the positioning substrate has a positioning hole through which the positioning substrate can be inserted at a position facing the positioning protrusion of the optical waveguide unit. An optical semiconductor mounting device comprising: 5. The optical semiconductor unit according to claim 4, wherein the positioning substrate is fixed to the optical waveguide unit by heating, pressing, and caulking a tip of a positioning protrusion inserted through the positioning hole. An optical semiconductor mounting device, wherein the optical semiconductor mounting device is assembled and fixed. 6. An optical semiconductor mounting device configured by optically coupling an optical waveguide unit having an optical fiber connector structure and an optical semiconductor element, wherein an optical axis of an optical fiber is provided on a side optically coupled to the optical semiconductor element. An optical waveguide unit having a vertical surface and having two sets of alignment projections on the vertical surface; a lens array substrate having an alignment hole at a position opposed to the first alignment projection; An alignment substrate having an alignment recess at a position opposite to the second alignment projection, wherein the first alignment projection of the optical waveguide unit is inserted into an alignment hole of the lens array substrate. At the same time, in a state where the positioning recess of the positioning substrate on which the optical semiconductor element is mounted and the second positioning projection of the optical waveguide unit are abutted, these are integrated. To by combining optical semiconductor mounting device, characterized in that optically coupled to a semiconductor element mounted between said optical fiber and lens portion of the lens array substrate to the alignment substrate. 7. The optical semiconductor mounting device according to claim 6, wherein the first alignment projection is caulked by heating and pressing with the tip of the first alignment projection inserted through the alignment hole of the lens array substrate. Wherein the lens array substrate is assembled and fixed to the optical waveguide unit. 8. The optical semiconductor mounting device according to claim 6, further comprising: a fixing claw for fixing the positioning substrate on a vertical surface of the optical waveguide unit having the second positioning protrusion. An optical semiconductor mounting device, comprising: 9. The optical semiconductor mounting device according to claim 8, wherein the positioning substrate is assembled and fixed to an optical waveguide unit by heating, pressing and caulking the fixing claws. Mounting device. 10. The optical semiconductor mounting device according to claim 1, wherein the optical waveguide unit is formed of a resin molded body made of an organic resin material. apparatus.