JP2001281504A - Optical element member and optical module using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce crosstalk among channels in an optical module in which an array-like optical element and a plurality of optical fibers are joined through a packaging member, while miniaturizing the module. SOLUTION: A rectangular parallelepiped block whose front 3a and back surface 3b are parallel is used as a packaging member 3. Through-holes 31a-31d which penetrate the parallel two surfaces 3a, 3b are arranged. The ends of optical fibers are inserted in the through-holes 31a-31d. The board 11 on which the optical element array is formed is fixed at the front 3a of the packaging member 3. Four integrated circuits 12a-12d for each optical element 1a-1d of the optical element array are placed alternately by being separated to the left side surface 3c of the packaging member 3 and the right side surface 3d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module in which an array of optical elements (light receiving elements and / or light emitting elements) and a plurality of optical fibers are connected via a mounting member.

[0002]

2. Description of the Related Art Parallel optical data transmission using a plurality of optical elements (light emitting elements such as semiconductor lasers and / or light receiving elements such as photodiodes) is a relatively short-distance high-speed data communication between devices or boards. In recent years, it has attracted attention as an optical interconnection.

An optical module used for parallel optical data transmission includes an optical fiber array in which a plurality of optical fibers are bundled in parallel, an optical element array in which a plurality of optical elements are arranged in parallel, and an optical element array in which It is mainly composed of a plurality of electrodes provided corresponding to each optical element and a plurality of integrated circuits connected to each of these electrodes by wiring. Of these components, those other than the optical fiber array (optical element array, electrodes, integrated circuits, etc.) are mounted on a mounting member such as a substrate. The optical fiber array is fixed to the mounting member after being positioned with respect to the optical element array of the mounting member.

In such parallel optical data transmission, crosstalk between channels becomes a problem because integrated circuits for each optical element are arranged close to each other in order to reduce the size of the module and increase the number of channels. ing. As a technique for reducing such crosstalk, for example, Japanese Unexamined Patent Application Publication No.
-283775 (Japanese Patent No. 2917903).

This publication describes an optical receiver which receives output light from a tape fiber by a light receiving element and converts the light into an electric signal. This optical receiver uses a plate-like body having a groove in the center of one surface as a mounting member, and in this groove,
Array IC having a plurality of light receiving elements, electrodes and integrated circuit
Has been fixed. The plurality of light receiving elements are arranged in a line at the center of the surface of the array IC. The plurality of integrated circuits for each light receiving element are alternately arranged on both sides of the light receiving element row in order to reduce crosstalk between channels.

[0006] Further, at the outer peripheral edge of the groove of the plate-like body,
A pair of holes facing each other with the groove interposed therebetween is formed. The tape fiber is fixed to the tape fiber fixing part.
By inserting a pair of pins into this hole, the optical fiber is fixed to the optical receiver with the end face of the optical fiber facing downward. Further, by making this hole a long hole extending in a direction perpendicular to the light receiving element row, the light emitted from the optical fiber and the position of the light receiving element can be adjusted. That is, in this optical receiver, the positioning of the core of the optical fiber and the light receiving element is performed by the pin of the tape fiber fixing portion and the hole of the plate-like body.

[0007]

However, in the optical receiver described in the above publication, as described above, the tape fiber and the pin are connected via the tape fiber fixing portion, and the light receiving element is formed in the hole. It is formed not on the array IC but on the outer peripheral edge of the groove into which it is inserted. Therefore, even if the pin and the hole are precisely aligned due to the positional deviation at the time of assembling the tape fiber and the pin, the hole and the light-receiving element, the position of the core of each optical fiber and each light-receiving element is accurately aligned. Not necessarily.

That is, in the above-described positioning method, high positioning accuracy cannot be actually obtained. Therefore, in the optical receiver described in the above publication, it is necessary to perform active alignment in which the optical element is slightly displaced and driven to the optimum position while monitoring the power of the light emitted from the optical fiber. This increases the mounting cost.

Further, since this optical receiver has a structure in which a tape fiber is attached to the upper side of the mounting member, there is room for improvement in terms of reducing the thickness of the optical module.

The present invention has been made in view of such a problem of the prior art. An optical element (light receiving element and / or light emitting element) in an array and a plurality of optical fibers are used to form a mounting member. It is an object of the present invention to reduce crosstalk between channels while reducing the size of an optical module that is coupled via an optical module, to enable easy and accurate alignment, and to reduce the thickness.

[0011]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides an optical element array in which a plurality of light receiving elements and / or light emitting elements are arranged in parallel, and each optical element of the optical element array has A plurality of electrodes provided correspondingly and a plurality of integrated circuits connected to each of these electrodes by wiring are mounted on the mounting member, and the mounting member has an optical element array mounted thereon. Face
It comprises a polyhedral block having a surface opposite to this surface, and this polyhedral block has a through hole passing through the two surfaces as positioning means for inserting and positioning the ends of a plurality of optical fibers. The through hole is formed such that each inserted optical fiber is optically coupled to each corresponding optical element of the optical element array, and a plurality of integrated circuits are provided on at least two surfaces other than the two surfaces of the polyhedron. Provided is an optical element member which is arranged separately.

In the optical element member of the present invention, it is preferable that the surface of the mounting member on which the optical element array is mounted is a plane perpendicular to the bottom surface of the mounting member.

As the optical element array, a surface emitting semiconductor laser array or a surface receiving type photodiode array can be used.

The present invention also provides an optical element member according to the present invention,
An optical module comprising a plurality of optical fibers inserted into the through holes of the optical element member, wherein each optical fiber is optically coupled to each corresponding optical element of the optical element array.

[0015]

Embodiments of the present invention will be described below.

An optical module according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the optical module of this embodiment.

This optical module comprises an optical element member 10 and an optical fiber array 20. In this embodiment, as the optical fiber array 20, a fiber ribbon in which four optical fibers 2a to 2d are arranged in a line and the coatings 21 are fixed to each other is used. The cladding 22 is exposed by removing the coating 21 at a predetermined length from the tip of each of the optical fibers 2a to 2d. Optical fiber 2a ~
The end face of 2d is formed at right angles to the optical axis (center line of the core) of the optical fibers 2a to 2d.

The optical element member 10 includes a substrate 11 having an optical element array formed on one surface, an integrated circuit 12 for each optical element of the optical element array (only 12a and 12c are visible in FIG. 1), It is mainly composed of a mounting member 3 formed of a rectangular parallelepiped block and a base 30 to which the mounting member 3 is fixed.

The rectangular parallelepiped block forming the mounting member 3 has four surfaces perpendicular to the upper surface of the base 30. Among these surfaces 3a to 3d, a surface (front) 3a to which the substrate 11 (optical element array) is attached, and a surface (back) 3 on the opposite side.
b are parallel to each other. Also, the left side 3c and the right side 3d
Are also parallel to each other.

FIG. 2 is a front view showing a state where the substrate 11 has been removed from the optical element member 10.

As can be seen from FIGS. 1 and 2, the mounting member 3 has a front surface 3a and a rear surface 3b facing each other in parallel.
And four through holes 31a to 31d. The cross sections of the through holes 31a to 31d are circles of the same size, and the diameter is formed slightly larger than the diameter of the optical fibers 2a to 2d. In addition, these through holes 3
The penetration direction of 1a to 31d is the penetration surface (the surface 3 of the mounting member 3).
a, 3b).

These through-holes 31a to 31d are arranged in a line at predetermined intervals at the center in the width direction of the rectangular surfaces 3a and 3b, and the distance between adjacent centers of the through-holes 31a to 31d is determined by the fiber ribbon used. The two optical fibers 2a to 2d are arranged so as to have a center-to-center distance therebetween.

Here, the length of exposing the cladding 22 at the tip of the optical fibers 2a to 2d is determined by the length of the through holes 31a to 31d.
Make it slightly longer than the length of d. Thereby, the mounting member 3
Each optical fiber 2 inserted in each through hole 31a-31d
a to 2d are, as shown in FIG.
Correspond to the back surface 3b of the mounting member 3, and the optical fibers 2a-2
The end surface of “d” is disposed in a state where it slightly protrudes from the front surface 3 a of the mounting member 3. In this state, the optical fibers 2a to
The end face 2 d is parallel to the front face 3 a of the mounting member 3.

The mounting member 3 for the optical fibers 2a to 2d
Protruding length L ₂₃ from the front 3a of the front 3 of the mounting member 3
in relation to the setting interval L ₁₃ between the surface (described below 11A) of the substrate 11 to a facing thereto, set between the end face and the light-emitting surface or the light receiving surface of the optical element 1a~1d optical fiber 2a~2d distance L ₁₂ is the length to be retained.

As shown in FIG. 2, the front surface 3a of the mounting member 3
, Electrodes 4a to 4d are alternately arranged on both sides of a row of four through holes 31a to 31d. That is, the electrode 4 having the same height as the uppermost through hole 31a in FIG.
a is disposed on the right side of the through hole 31a. Through hole 3
The electrode 4b having the same height as the through hole 31b immediately below 1a
It is arranged on the left side of the through hole 31b. The electrode 4c having the same height as the through hole 31c immediately below the through hole 31b is arranged on the right side of the through hole 31c. Lowermost through hole 31
The electrode 4d having the same height as d is disposed on the left side of the through hole 31d. Each of the integrated circuits 12a to 12d includes a mounting member 3
Are alternately arranged on the left side surface 3c and the right side surface 3d. That is, the integrated circuit 12a connected to the electrode 4a
Are arranged on the right side surface 3d of the mounting member 3. Electrode 4
The integrated circuit 12b connected to the component b is disposed on the left side surface 3c of the mounting member 3. The integrated circuit 12c connected to the electrode 4c is arranged on the right side 3d of the mounting member 3.
The integrated circuit 12 d connected to the electrode 4 d is arranged on the left side surface 3 c of the mounting member 3.

The arrangement of each of the integrated circuits 12a to 12d in the height direction is in accordance with the height of each of the electrodes 4a to 4d. The electrodes 4a to 4d and the corresponding integrated circuits 12a to 12d are connected by wirings 5a to 5d.

The right side surface 3d of the mounting member 3 further includes
As shown in the figure, the electrodes 6a for the integrated circuits 12a and 12c,
6c is formed at the same height as the electrodes 4a and 4c.
These electrodes 6a, 6c are integrated circuits 12a, 12c,
They are connected by wires 7a and 7c, respectively. Mounting member 3
The electrodes 6b and 6d for the integrated circuits 12b and 12d are formed at the same height as the electrodes 4b and 4d on the left side surface 3c. These electrodes 6b, 6d are integrated circuits 12b, 12d
And are connected by wires 7b and 7d, respectively. In addition,
Since the electrodes 6b and 6d and the wirings 7b and 7d are formed on the back side of the left side surface 3c of the mounting member 3, they do not appear in any of FIGS. Also, the electrodes 6a to 6d
May be formed on the base 30.

These electrodes 4a to 4d and wirings 5a to 5
d, the electrodes 6a to 6d, and the wirings 7a to 7d are formed in advance on the three surfaces 3a, 3c, 3d of the mounting member 3 by performing a series of steps of forming a metal film and patterning the metal film. ing.

FIG. 3 is a front view showing a surface of the substrate 11 facing the mounting member 3 side.

As shown in this figure, four optical elements 1a to 1d corresponding to the four optical fibers 2a to 2d of the fiber ribbon 20 are provided on the surface 11A of the substrate 11 on the mounting member 3 side.
The light emitting surface or light receiving surface of d is arranged in a line at a predetermined interval at the center in the width direction of the rectangular surface 11A. These optical elements 1a to 1d are arranged such that the distance between adjacent centers of the light emitting surface or the light receiving surface is the center distance between the adjacent optical fibers 2a to 2d of the fiber ribbon 20 to be used.

The electrodes 8a to 8d are alternately arranged on both sides of the row of the optical elements 1a to 1d. These electrodes 8a to 8d are arranged such that the surface 11A of the substrate 11 and the surface 3a of the mounting member 3 are opposed to each other, and when the substrate 11 and the mounting member 3 are connected, the electrodes 4a to 4d of the surface 3a of the mounting member 3 And are arranged in an overlapping manner. Optical elements 1a to 1d and electrode 8a
To 8d are connected by wirings 9a to 9d, respectively.

Therefore, the optical element member 10 is assembled by using the electrodes 8a to 8d and the electrodes 4a to 4d as positioning members, for example, by connecting the substrate 11 and the mounting member 3 by the following method.

First, on each of the electrodes 8a to 8d of the substrate 11,
The projection of the ball bump is formed according to the wire bonding method. Next, the surface 11A of the substrate 11 and the surface 3a of the mounting member 3 are opposed to each other at a predetermined interval. In this state, the electrodes 8a to 8d and the electrodes 4a to 4d are accurately matched by the image recognition method. After the positioning is completed, the protrusions and the electrodes 4a to 4d are heated while the tips of the protrusions on the electrodes 8a to 8d of the substrate 11 are pressed against the electrodes 4a to 4d of the mounting member 3 with a predetermined force. Ultrasonic welding. Thus, the electrodes 8a to 8d and the electrodes 4a to 4d are joined by the projections, and the substrate 11 and the mounting member 3 are joined. Note that pressing force with respect to the height form the projections and the projections of the electrodes 4a~4d is adjusted so as to correspond to the set distance of the surface 11A of the front 3a and the substrate 11 of the mounting member 3 (L ₁₃ in FIG. 4).

The optical module is assembled by inserting the tips of the optical fibers 2a to 2d of the fiber ribbon 20 into the through holes 31a to 31d of the mounting member 3 of the optical element member 10 assembled as described above. . That is, the exposed cladding portions of the optical fibers 2 a to 2 d are inserted into the through holes 31 a to 31 d of the mounting
The mounting member 1a is inserted until it comes into contact with the back surface 3b of the mounting member 3. Thus, in a state in which a predetermined distance between the end face and the light-emitting surface or the light receiving surface of the optical element 1a~1d of the optical fiber 2 a to 2 d (L ₁₂ in FIG. 4) is secured, the optical fibers 2a~2
d is fixed to the mounting member 3, and the optical axis of each of the optical elements 1a to 1d matches the optical axis of each of the optical fibers 2a to 2d.

As described above, according to the optical element member 10 of this embodiment, the mounting member 3 composed of a rectangular parallelepiped block is used, and the left and right side surfaces 3c and 3d of the rectangular parallelepiped block are respectively provided with the photoelements 1a to 1d. Since the integrated circuits 12a to 12d are divided into two and arranged alternately, and the integrated circuits on each side are also arranged at intervals in the vertical direction, crosstalk between channels is suppressed while miniaturizing the module. You. Even when the mounting member 3 formed of a rectangular parallelepiped block is used, if all the integrated circuits are arranged on one surface, a large area is required to provide a sufficient space between adjacent integrated circuits. It is difficult to reduce the size.

In this optical module, the mounting member 3
The optical fibers 2a to 2d are positioned in the through holes 31a to 31d, and the substrate (optical element array) 11
By positioning the optical fibers 2a to 2d
And the optical elements 1a to 1d are positioned. Moreover, the positioning of the mounting member 3 and the substrate 11 is performed by the electrode 8a of the substrate 11.
8d and the electrodes 4a to 4d of the mounting member 3 can be easily and accurately performed by matching them by an image recognition method. That is, according to this optical module, the positioning of the optical fibers 2a to 2d and the optical elements 1a to 1d can be easily and accurately performed without performing the active alignment described above.

Further, since the mounting member 3 can be easily manufactured by molding or machining using plastic or ceramic, the cost of the optical module can be reduced.

Further, the optical element member 10 is
The optical fibers 2a to 2a beside the mounting member 3 fixed on the
Due to the structure in which the optical module d is attached, the vertical dimension when an optical fiber is attached to form an optical module can be reduced as compared with the optical receiver described in the above publication.

It should be noted that this optical element member 10 is
When 〜1d are light emitting elements (surface emitting lasers, edge emitting lasers), they are optical transmitters, and when the optical elements 1a to 1d are light receiving elements (photodiodes), they are optical receivers. When a part of the optical elements 1a to 1d is a light emitting element and the rest are light receiving elements, the optical element member 1
0 is an optical transceiver. That is, the present invention can be applied to any of the optical transmission module, the optical reception module, and the optical transmission / reception module.

When the optical elements 1a to 1d are light emitting elements, the electrodes 4a to 4d are output terminals and the electrodes 6a to 6d
And the electrodes 8a to 8d are input terminals. Electrodes 6a-6
d is connected to an external data signal line. Integrated circuit 1
The power supplies 2a to 12d are separately supplied from the base 30. Then, from the integrated circuits 12a to 12d, the wirings 5a to 5d, the electrodes 4a to 4d, and the electrodes 8a to 8d
d, and a driving current is supplied to the optical elements 1a to 1d, which are light emitting elements, via the wirings 9a to 9d.

When the optical elements 1a to 1d are light receiving elements, the electrodes 4a to 4d are input terminals and the electrodes 6a to 6d
And the electrodes 8a to 8d are output terminals. Electrical signals that have been photoelectrically changed after being received by the optical elements 1a to 1d, which are light receiving elements, are connected to wirings 9a to 9d, electrodes 8a to 8d, and electrodes 4a.
To the integrated circuit 12 through the wirings 5a to 4d and the wirings 5a to 5d.
After being processed in a to 12d, they are output to the outside from the electrodes 6a to 6d.

The electrodes provided on the optical element member 10 are not only used for signal lines, but also when a surface emitting laser is used as the optical element, for example, a pull-up voltage or ground for driving the laser is used as the optical element. When a photodiode is used, it is necessary to provide an electrode for supplying a reverse bias voltage. These are usually provided on the back surface of the substrate 11.

In this embodiment, the optical element array (optical elements 1a to 1d) is arranged perpendicular to the surface of the base 30 (that is, the bottom surface of the mounting member). May be arranged in parallel to the surface of Figures 5 and 6
Shows an example of the mounting member 300 and the substrate 110 when the optical element array is arranged in parallel with the surface of the base 30. In this example, the integrated circuits 12a and 12d for the optical elements 1a and 1d arranged at both ends of the optical element array
The upper surface 3e of the head 00 is located just above the corresponding through holes 31a and 31d. The integrated circuit 12b for the optical element 1b adjacent to the optical element 1a is arranged on the left side surface 3c of the mounting member 300 at a position below the through holes 31a to 31d. Further, the integrated circuit 12c for the optical element 1c adjacent to the optical element 1d is arranged on the right side 3d of the mounting member 300 at a position below the through holes 31a to 31d (on the base 30 side).

The electrodes 4a and 4d are arranged on the front surface 3a of the mounting member 300 directly above the corresponding through holes 31a and 31d. These electrodes 4a, 4d and the integrated circuit 12a,
12d is connected by wirings 5a and 5d extending perpendicularly to the arrangement direction of the through holes 31a to 31d. Electrode 4
b and 4c are arranged on the front surface 3a of the mounting member 300 directly below the corresponding through holes 31b and 31c. These electrodes 4b, 4c and integrated circuits 12b, 12c are connected to wirings 5b, 5 extending in parallel with the arrangement direction of through holes 31a to 31d.
c.

The surface 11A of the substrate 110 on the mounting member 300 side
Are provided with electrodes 8a to 8d on both sides of an optical element array (optical elements 1a to 1d) for optical elements 1a and 1d arranged at both ends of the optical element array, and for other optical elements 1b and 1c. And are arranged on the opposite side. That is, these electrodes 8a to 8d are mounted on the mounting member 300 when the substrate 110 and the mounting member 300 are coupled with the surface 11A of the substrate 110 on which the optical element array is formed and the front surface 3a of the mounting member 300 facing each other. Each electrode 4a-4d on the front surface 3a of 300
And are arranged in an overlapping manner. The optical elements 1a to 1d and the electrodes 8a to 8d are connected by wirings 9a to 9d extending perpendicular to the optical element array, respectively.

Therefore, according to the optical element member obtained by combining the substrate 110 and the mounting member 300, the mounting member 300 formed of a rectangular parallelepiped block is used, and the upper surface 3a and the left and right side surfaces 3c of the rectangular parallelepiped block are used. 3d, the integrated circuits 12a to 12d for the respective photoelements 1a to 1d are separately arranged, and furthermore, the adjacent integrated circuits are arranged with a sufficient space therebetween. Crosstalk is suppressed.

The optical element member (an optical element member obtained by combining the substrate 110 and the mounting member 300) has a structure in which the optical fibers 2a to 2d are mounted beside the mounting member 300 and an optical element. Since the array is arranged parallel to the surface of the base 30, the vertical dimension when an optical module is formed by attaching optical fibers can be further reduced.

In the above embodiment, each of the optical elements 1a to 1a
Although one integrated circuit 12a to 12d is provided for each 1d, two or more integrated circuits corresponding to two or more optical elements are mounted on one array IC, and each integrated circuit is integrated in the array IC. As a configuration separated by a trench, a plurality of array ICs
May be separately arranged on two or more surfaces of a mounting member formed of a polyhedral block. In particular, when the number of channels is very large, such a structure is preferable.

In the above embodiment, since the mounting member made of the rectangular parallelepiped block is used, the two surfaces through which the through holes penetrate are parallel to each other. The two surfaces need only be opposing surfaces.
They need not necessarily be parallel to each other. However,
From the viewpoint of ease of processing of the mounting member, workability when fixing the optical element array to the surface of the mounting member, and downsizing of the mounting member, the two corresponding surfaces of the mounting member that penetrate the through hole are: Preferably they are parallel.

[0050]

As described above, according to the optical element member of the present invention, the mounting member is formed of a polyhedral block, and the integrated circuit for each optical element is divided on at least two surfaces of the polyhedral block. Since the optical module is arranged, the optical module obtained by coupling the optical element member to the optical fiber can suppress crosstalk between the channels while being downsized.

The optical fiber is positioned in a through hole (a through hole formed so that the position of each inserted optical fiber matches the position of each optical element of the optical element array) of the mounting member. When an optical module is manufactured by coupling an optical element member to an optical fiber, positioning of the optical fiber and each optical element can be performed easily and accurately without causing the optical fiber to shine.

In particular, according to the optical element member of the second aspect, since the optical fiber is attached to the side of the mounting member, the thickness of the optical module can be reduced.

According to the optical module of the present invention, the crosstalk between the channels is reduced while being small, and the alignment at the time of fabrication can be performed easily and accurately, and the thickness can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of an optical module of the present invention.

FIG. 2 is a front view of a mounting member constituting an optical element member of the optical module of FIG.

3 is a plan view showing a substrate constituting an optical element member of the optical module of FIG. 1 and showing a surface facing the mounting member (a surface on which an optical element array is formed). FIG.

FIG. 4 is a cross-sectional view showing a positional relationship between a mounting member, a substrate, and an optical fiber in a length direction of the optical fiber.

FIG. 5 is a front view showing an example of a mounting member constituting an optical element member in which an optical element array is arranged in parallel with a surface of a base.

FIG. 6 is a front view showing an example of a substrate constituting an optical element member in which an optical element array is arranged in parallel with a surface of a base.

[Explanation of symbols]

1a to 1d Optical element 10 Optical element member 11 Substrate (optical element array) 11A Surface of optical substrate on which optical element array is formed 110 Substrate (optical element array) 12 Electrode 12a to 12d Integrated circuit 2a to 2d Optical fiber 20 Fiber ribbon (Optical fiber array) 21 Coating of optical fiber 21a End face of coating 22 Cladding of optical fiber 3 Mounting member (polyhedral block) 3a Front surface of mounting member (surface on which optical element array is attached) 3b Back surface of mounting member (optical element array) 3c Left side surface of mounting member (placement surface of integrated circuit) 3d Right side surface of mounting member (placement surface of integrated circuit) 3e Upper surface 30 Base 31a to 31d Through hole of mounting member 300 Mounting member (polyhedron block) 4a to 4d Electrode 8a to 8d Electrode 5a to 5d Wiring 7a to 7d Wiring 9a to d wiring

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) H01S 5/40 H01L 31/10 A (72) Inventor Atsushi Harada 3-5-5 Yamato, Suwa-shi, Nagano Pref. Seiko Epson Corporation In-house F-term (reference) 2H037 BA05 BA14 DA04 DA15 5F049 MA01 NA04 NA09 NB01 RA02 TA14 5F073 AB02 AB16 AB28 FA07 FA23 5F088 AA01 BA03 BA16 BB01 EA03 EA11 JA14

Claims (5)

[Claims] 1. An optical element array in which a plurality of light receiving elements and / or light emitting elements are arranged in parallel, a plurality of electrodes provided corresponding to each optical element of the optical element array, and each of these electrodes A plurality of integrated circuits connected by wiring are mounted on an optical element member mounted on a mounting member, wherein the mounting member is a polyhedron block having a surface on which an optical element array is mounted and a surface facing the surface. This polyhedral block has a through hole passing through the two surfaces,
It has positioning means for inserting and positioning the ends of a plurality of optical fibers, and this through hole is formed so that the position of each inserted optical fiber matches the position of each optical element of the optical element array. An optical element member, wherein a plurality of integrated circuits are separately arranged on at least two surfaces other than the two surfaces of the polyhedron. 2. The optical element member according to claim 1, wherein the surface of the mounting member on which the optical element array is mounted is a surface perpendicular to the bottom surface of the mounting member. 3. The optical element member according to claim 1, wherein the optical element array is a surface emitting semiconductor laser array. 4. The optical element member according to claim 1, wherein the optical element array is a surface light receiving type photodiode array. 5. An optical element member according to claim 1, comprising: a plurality of optical fibers inserted into the through-hole of the optical element member. An optical module optically coupled to each corresponding optical element of the optical element array.