JP2009116252A - Device array and optical module - Google Patents

Device array and optical module Download PDF

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JP2009116252A
JP2009116252A JP2007292027A JP2007292027A JP2009116252A JP 2009116252 A JP2009116252 A JP 2009116252A JP 2007292027 A JP2007292027 A JP 2007292027A JP 2007292027 A JP2007292027 A JP 2007292027A JP 2009116252 A JP2009116252 A JP 2009116252A
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optical
bumps
device array
wiring
bump
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JP5012437B2 (en
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Mitsuaki Tamura
充章 田村
Tomomi Moriya
知巳 守屋
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Sumitomo Electric Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract

<P>PROBLEM TO BE SOLVED: To accurately connect an ultrasonic flip chip and an optical ferrule even when the ultrasonic flip chip is mounted by pressing bumps by preventing a tilt or a shift on the connection face. <P>SOLUTION: A device array 21 can be connected to an optical ferrule 25 having an electric wires 23, a plurality of optical devices 31 are arranged in a line on the connection face 29, a plurality of bumps 33 to be connected to the electric wires 23 are disposed at each of a first side 35 and a second side 37 opposite to the first side interposing an optical device line. When the number of the bumps 33B on the second side is smaller than that of the bumps 33A on the first side, it is preferable that the bottom area SB of the bumps 33B on the second side is larger than the bottom area SA of the bumps 33A on the first side. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、複数の光素子が一列に配置され、この光素子の接続端子となるバンプが、光フェルールの電気配線に超音波フリップチップ実装により接続されるデバイスアレイおよび光モジュールに関する。   The present invention relates to a device array and an optical module in which a plurality of optical elements are arranged in a line, and bumps serving as connection terminals of the optical elements are connected to electrical wiring of an optical ferrule by ultrasonic flip chip mounting.

近年の電子デバイスの飛躍的な動作速度の向上に対し、それを実装するプリント基板上の動作速度は電子デバイスの内部動作より低く抑えられている。これは、電気配線の伝送損失や雑音、電磁障害の増大等に起因する。そこで、光ファイバと面発光レーザ等の光素子を直接光結合させた光電変換部品（光モジュール）が提案されている（例えば特許文献１参照）。   In contrast to the dramatic improvement in the operating speed of electronic devices in recent years, the operating speed on a printed circuit board on which the electronic device is mounted is kept lower than the internal operation of the electronic device. This is due to transmission loss and noise of electrical wiring, an increase in electromagnetic interference, and the like. Therefore, a photoelectric conversion component (optical module) in which an optical fiber and an optical element such as a surface emitting laser are directly optically coupled has been proposed (see, for example, Patent Document 1).

この種の光モジュールは、図３に示すデバイスアレイ１と、光フェルール３とを備えてなる。デバイスアレイ１は、結合面５が光フェルール３の結合面７に結合される。デバイスアレイ１の結合面５の中央部近傍には複数の光素子９が一列に配置され、光素子９は光素子列と平行に配設された複数のバンプ１１を接続端子としている。複数のバンプ１１は光素子９のアノード及びカソードにそれぞれ接続した配線パターン１０上に形成されている。光フェルール３の結合面７には光ファイバ１３を位置決め保持する複数のファイバ挿入孔１５が光素子９に応じて一列に配置される。また、結合面７にはバンプ１１に接続される複数の電気配線（金属メッキ部）１７がファイバ挿入孔１５の列方向と平行に並べられ、結合面７に隣接する直交面１９に連続して形成されている。光フェルール３は、ポリエステル樹脂、ＰＰＳ樹脂およびエポキシ樹脂のいずれかを含む材料で形成される。   This type of optical module includes a device array 1 and an optical ferrule 3 shown in FIG. In the device array 1, the coupling surface 5 is coupled to the coupling surface 7 of the optical ferrule 3. A plurality of optical elements 9 are arranged in a row near the central portion of the coupling surface 5 of the device array 1, and the optical elements 9 have a plurality of bumps 11 arranged in parallel to the optical element arrays as connection terminals. The plurality of bumps 11 are formed on the wiring pattern 10 connected to the anode and cathode of the optical element 9. In the coupling surface 7 of the optical ferrule 3, a plurality of fiber insertion holes 15 for positioning and holding the optical fiber 13 are arranged in a line according to the optical element 9. In addition, a plurality of electrical wirings (metal plating portions) 17 connected to the bumps 11 are arranged on the coupling surface 7 in parallel with the column direction of the fiber insertion holes 15, and continue to the orthogonal surface 19 adjacent to the coupling surface 7. Is formed. The optical ferrule 3 is formed of a material containing any one of a polyester resin, a PPS resin, and an epoxy resin.

結合面５と結合面７とをアライメントすることで、ファイバ挿入孔１５に光素子９の能動領域９ａを位置合わせするとともに、電気配線１７にバンプ１１を位置合わせし、バンプ１１を溶融することで電気配線１７に固定し、光フェルール３を介して光ファイバ１３に対しデバイスアレイ１を直接光結合した光モジュールを得ることができた。
特開２００６−５９８６７号公報 By aligning the coupling surface 5 and the coupling surface 7, the active region 9 a of the optical element 9 is aligned with the fiber insertion hole 15, the bump 11 is aligned with the electric wiring 17, and the bump 11 is melted. An optical module in which the device array 1 was directly optically coupled to the optical fiber 13 via the optical ferrule 3 was obtained.
JP 2006-59867 A

ところで、電気配線１７の設けられた光フェルール３に、光素子９を収容したデバイスアレイ１を結合する際には、光フェルール３が樹脂製で熱に弱いため、２７０℃程度に加熱される一般的な半田リフロー処理は行えず、結合面５，７同士を加圧しながら超音波振動を印加する超音波フリップチップ実装にて結合が行われている。
しかしながら、圧接部となるバンプ１１は、図４に示すように、光素子列を挟んで片側（図４の下側）に配列され、光素子列を境に上下非対称であるため、結合方向に圧力Ｆが加えられると、バンプ１１の設けられない反対側の耐押圧力が小さく、デバイスアレイ１の片側（上側）のみが結合面７に接近する方向へ傾き、ずれの生じる問題があった。
本発明は上記状況に鑑みてなされたもので、バンプを押圧して超音波フリップチップ実装する場合であっても、結合面に傾斜やずれが生じないデバイスアレイおよび光モジュールを提供し、もって、光フェルールとの高精度実装を可能にすることを目的とする。 By the way, when the device array 1 containing the optical element 9 is coupled to the optical ferrule 3 provided with the electrical wiring 17, the optical ferrule 3 is made of resin and is weak against heat, so that it is generally heated to about 270 ° C. A typical solder reflow process cannot be performed, and bonding is performed by ultrasonic flip-chip mounting in which ultrasonic vibration is applied while pressing the bonding surfaces 5 and 7 together.
However, as shown in FIG. 4, the bumps 11 serving as the pressure contact portions are arranged on one side (lower side in FIG. 4) across the optical element row and are vertically asymmetric with respect to the optical element row. When the pressure F is applied, the pressure resistance on the opposite side where the bumps 11 are not provided is small, and there is a problem that only one side (upper side) of the device array 1 is tilted in the direction approaching the coupling surface 7 and is displaced.
The present invention has been made in view of the above situation, and provides a device array and an optical module that do not tilt or shift on the coupling surface even when ultrasonic flip chip mounting is performed by pressing a bump, An object is to enable high-precision mounting with an optical ferrule.

本発明に係る上記目的は、下記構成により達成される。
（１） 電気配線を備えた光フェルールと結合可能なデバイスアレイであって、
結合面に、複数の光素子が一列に配置され、
光素子列を挟む第１の側と、反対側の第２の側のそれぞれに前記電気配線と接続される複数のバンプを備えたことを特徴とするデバイスアレイ。 The above object of the present invention is achieved by the following configuration.
(1) A device array that can be combined with an optical ferrule with electrical wiring,
A plurality of optical elements are arranged in a row on the coupling surface,
A device array comprising a plurality of bumps connected to the electric wiring on each of a first side sandwiching an optical element array and a second side opposite to the first side.

このデバイスアレイによれば、光フェルールの電気配線に、バンプを押圧して超音波フリップチップ実装されると、光素子列を挟む第１の側とその反対の第２の側とで、略均等に圧力が加わり、片側に圧力が集中することによる結合面の傾斜やずれが生じない。   According to this device array, when the bumps are pressed on the electrical wiring of the optical ferrule and ultrasonic flip chip mounting is performed, the first side sandwiching the optical element array and the second side opposite to the first side are substantially equal. No pressure is applied to the joint surface, and the coupling surface is not inclined or displaced due to the pressure concentration on one side.

（２） 前記第２の側の前記バンプの数は前記第１の側の前記バンプの数より少なく、
前記第２の側の前記バンプの底面積は前記第１の側の前記バンプの底面積よりも大きいことを特徴とする（１）記載のデバイスアレイ。 (2) The number of the bumps on the second side is less than the number of the bumps on the first side,
The device array according to (1), wherein a bottom area of the bump on the second side is larger than a bottom area of the bump on the first side.

このデバイスアレイによれば、光フェルールの配線パターン形状に依存して第２の側のバンプ数が少ない場合であっても、第２の側に設けられるバンプの底面積が大きくなることにより耐押圧力が大きくなり、バンプ数が少ないことによる耐押圧力の不足が補完される。   According to this device array, even if the number of bumps on the second side is small depending on the wiring pattern shape of the optical ferrule, the bottom area of the bumps provided on the second side is increased, so that Insufficient pressure resistance due to increased pressure and fewer bumps is compensated.

（３） 前記第１の側の前記バンプの底面積の和と、前記第２の側の前記バンプの底面積の和が略等しいことを特徴とする（１）又は（２）記載のデバイスアレイ。 (3) The device array according to (1) or (2), wherein a sum of bottom areas of the bumps on the first side and a sum of bottom areas of the bumps on the second side are substantially equal. .

このデバイスアレイによれば、第１の側と第２の側で、バンプ数に関わりなく、バンプ底面積の和が等しくなることで、第１の側と第２の側とに加わる耐押圧力が略均衡し、片側に圧力が集中することによる結合面の傾斜やずれが生じない。   According to this device array, the pressure resistance applied to the first side and the second side is the same on the first side and the second side by making the sum of the bump bottom areas equal regardless of the number of bumps. Are substantially balanced, and there is no inclination or displacement of the coupling surface due to concentration of pressure on one side.

（４） （１）〜（３）のいずれか１つのデバイスアレイと、１列に配置した光ファイバ挿入孔を有し、結合面に電気配線を備えた光フェルールと、を前記バンプを介して結合した光モジュールであって、
前記電気配線が、光ファイバ挿入孔列を横断する長尺配線と、該長尺配線に平行で光ファイバ挿入孔列に近接する短尺配線とからなり、
前記第１の側の前記バンプが、前記長尺配線および前記短尺配線と接続され、
前記第２の側の前記バンプが、前記長尺配線のみと接続されたことを特徴とする光モジュール。 (4) The device array according to any one of (1) to (3) and an optical ferrule having an optical fiber insertion hole arranged in one row and having an electrical wiring on the coupling surface, via the bumps A combined optical module,
The electrical wiring consists of a long wiring that traverses the optical fiber insertion hole row, and a short wiring that is parallel to the long wiring and close to the optical fiber insertion hole row,
The bump on the first side is connected to the long wiring and the short wiring,
The optical module, wherein the bump on the second side is connected only to the long wiring.

この光モジュールによれば、デバイスアレイを光フェルールに超音波フリップチップ実装する際、光ファイバ挿入孔列を横断して延出した長尺配線の先端に第２の側のバンプが押圧され、従来構造のように、第１の側のバンプのみが押圧される場合に比べ、光ファイバ挿入孔列を挟む第１の側と第２の側とで押圧力が略均衡する。   According to this optical module, when the device array is ultrasonically flip-chip mounted on the optical ferrule, the second-side bump is pressed against the tip of the long wiring extending across the optical fiber insertion hole row, Compared to the case where only the first-side bump is pressed as in the structure, the pressing force is substantially balanced between the first side and the second side across the optical fiber insertion hole row.

本発明に係るデバイスアレイによれば、電気配線を備えた光フェルールと結合可能なデバイスアレイであって、光素子列を挟む第１の側と、反対側の第２の側のそれぞれに電気配線と接続される複数のバンプを備えたので、光フェルールの電気配線に、バンプを押圧して超音波フリップチップ実装する場合であっても、光素子列を挟む第１の側とその反対の第２の側とで、略均等に圧力が加わることとなり、片側に圧力が集中することによる結合面の傾斜やずれを防止し、光フェルールと高精度に結合することができる。   According to the device array of the present invention, a device array that can be coupled to an optical ferrule provided with electrical wiring, the electrical wiring on each of the first side and the second side opposite to the optical element array. Since the bumps are pressed to the electrical wiring of the optical ferrule and ultrasonic flip-chip mounting is performed, the first side sandwiching the optical element array and the opposite one are provided. On the second side, pressure is applied substantially evenly, and the inclination and displacement of the coupling surface due to pressure concentration on one side can be prevented, and the optical ferrule can be coupled with high accuracy.

本発明に係る光モジュールによれば、請求項１〜請求項３のいずれか１項記載のデバイスアレイと、光フェルールとを結合した光モジュールであって、光フェルールの電気配線を、光ファイバ挿入孔列を横断する長尺配線と、光ファイバ挿入孔列に近接する短尺配線とで形成し、第１の側のバンプを、長尺配線および短尺配線と接続し、第２の側のバンプを、長尺配線のみと接続したので、光ファイバ挿入孔列を横断して延出した長尺配線の先端に第２の側のバンプが押圧され、従来構造のように、第１の側のバンプのみが押圧される場合に比べ、光ファイバ挿入孔列を挟む第１の側と第２の側とで押圧力が略均衡し、デバイスアレイが傾斜やずれのない高い位置精度で光フェルールに超音波フリップチップ実装できる。   According to an optical module of the present invention, an optical module in which the device array according to any one of claims 1 to 3 and an optical ferrule are coupled, and the electrical wiring of the optical ferrule is inserted into the optical fiber. A long wiring crossing the hole array and a short wiring close to the optical fiber insertion hole array are formed, the first side bump is connected to the long wiring and the short wiring, and the second side bump is connected Since only the long wiring is connected, the second-side bump is pressed against the tip of the long wiring extending across the optical fiber insertion hole row, and the first-side bump as in the conventional structure. Compared to the case where only the optical fiber is pressed, the pressing force is substantially balanced between the first side and the second side across the optical fiber insertion hole row, and the device array is more than the optical ferrule with high positional accuracy without tilting or shifting. Sonic flip chip mounting is possible.

以下、本発明に係るデバイスアレイおよび光モジュールの好適な実施の形態を図面を参照して説明する。
図１は本発明に係るデバイスアレイを（ａ）、デバイスアレイに結合される光フェルールを（ｂ）に示した斜視図、図２は図１に示したデバイスアレイと光フェルールとを結合してなる光モジュールの断面図である。
本実施の形態に係るデバイスアレイ２１は、電気配線２３を備えた光フェルール２５と結合され、光モジュール２７（図２参照）を構成する。 Preferred embodiments of a device array and an optical module according to the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view showing a device array according to the present invention in (a) and an optical ferrule to be coupled to the device array in (b), and FIG. 2 is a combination of the device array and optical ferrule shown in FIG. It is sectional drawing of the optical module which becomes.
The device array 21 according to the present embodiment is combined with an optical ferrule 25 having an electrical wiring 23 to constitute an optical module 27 (see FIG. 2).

デバイスアレイ２１は、結合面２９に複数（本実施の形態では４つ）の光電変換素子（光素子）３１を一列に配置したアレイ状に形成される。光電変換素子３１は、光源部として用いる場合は面発光レーザ（ＶＣＳＥＬ）、受光部として用いる場合はフオトディテクタ（ＰＤ）が代表的である。配列ピッチは例えば２５０μｍとすることができるが、これより大きくても小さくても良い。   The device array 21 is formed in an array shape in which a plurality (four in this embodiment) of photoelectric conversion elements (optical elements) 31 are arranged in a line on the coupling surface 29. The photoelectric conversion element 31 is typically a surface emitting laser (VCSEL) when used as a light source unit, and a photodetector (PD) when used as a light receiving unit. The arrangement pitch can be 250 μm, for example, but it may be larger or smaller than this.

デバイスアレイ２１の結合面２９には光電変換素子３１に電源供給や信号を伝送するための電極となる複数のバンプ３３が設けられている。バンプ３３は、光電変換素子３１を挟む第１の側（図１の下側）３５と、反対側の第２の側（図１の上側）３７のそれぞれに光素子列と平行に複数配設される。第１の側３５のバンプ３３Ａは光電変換素子３１の電極であるアノード及びカソードにそれぞれ接続した配線パターン３０上に形成されている。第２の側３７のパンプ３３Ｂは光電変換素子３１のいずれの電極とも接続しないフローティング状態にある。   On the coupling surface 29 of the device array 21, a plurality of bumps 33 serving as electrodes for supplying power and transmitting signals to the photoelectric conversion elements 31 are provided. A plurality of bumps 33 are arranged in parallel to the optical element array on each of a first side (lower side in FIG. 1) 35 sandwiching the photoelectric conversion element 31 and a second side (upper side in FIG. 1) 37 on the opposite side. Is done. The bumps 33 </ b> A on the first side 35 are formed on the wiring pattern 30 connected to the anode and the cathode that are the electrodes of the photoelectric conversion element 31. The pump 33B on the second side 37 is in a floating state where it is not connected to any electrode of the photoelectric conversion element 31.

デバイスアレイ２１の結合面２９において、上側３７のバンプ３３Ｂの数ｎＢ（本実施の形態では５つ）は下側３５のバンプ３３Ａの数ｎＡ（本実施の形態では９つ）より少なく（ｎＢ＜ｎＡ）、上側３７のバンプ３３Ｂの底面積ＳＢは下側３５のバンプ３３Ａの底面積ＳＡよりも大きく（ＳＢ＞ＳＡ）形成されている。   In the coupling surface 29 of the device array 21, the number nB (five in the present embodiment) of the bumps 33B on the upper side 37 is less than the number nA (nine in the present embodiment) of the bumps 33A on the lower side 35 (nB < nA), the bottom area SB of the bumps 33B on the upper side 37 is formed larger than the bottom area SA of the bumps 33A on the lower side 35 (SB> SA).

これにより、光モジュール２７の配線パターン形状に依存して上側３７のバンプ３３Ｂの数ｎＢが少ない場合であっても、上側３７に設けられるバンプ３３Ｂの底面積ＳＢが大きくなることにより耐押圧力が大きくなり、バンプ数が少ないことによる耐押圧力の不足が補完されている。   Thereby, even if the number nB of the bumps 33B on the upper side 37 is small depending on the wiring pattern shape of the optical module 27, the pressure resistance is increased by increasing the bottom area SB of the bumps 33B provided on the upper side 37. The lack of pressure resistance due to the increased number of bumps is compensated for.

また、下側３５のバンプ３３Ａの底面積ＳＡの和と、上側３７のバンプ３３Ｂの底面積ＳＢの和は略等しくなるように各バンプ３３の底面積が設定されている。上側３７と下側３５で、バンプ数に関わりなく、バンプ底面積の和が等しくなることで、超音波フリップチップ実装時において、下側３５と上側３７とに加わる耐押圧力が略均衡し、片側に圧力が集中することによる結合面２９の上下方向の傾斜やずれが生じないようになっている。   Further, the bottom area of each bump 33 is set such that the sum of the bottom areas SA of the bumps 33A on the lower side 35 and the sum of the bottom areas SB of the bumps 33B on the upper side 37 are substantially equal. The sum of the bump bottom areas is the same on the upper side 37 and the lower side 35 regardless of the number of bumps, so that the pressing force applied to the lower side 35 and the upper side 37 is substantially balanced during ultrasonic flip chip mounting. The coupling surface 29 is prevented from being inclined or displaced in the vertical direction due to pressure concentration on one side.

さらに、下側３５のバンプ３３Ａおよび上側３７のバンプ３３Ｂは、結合面２９の中心部を境に左右にも対称となっている。これにより、超音波フリップチップ実装時において、左右に加わる耐押圧力が略均衡し、片側に圧力が集中することによる結合面２９の左右方向の傾斜やずれも生じないようになっている。   Further, the bumps 33 </ b> A on the lower side 35 and the bumps 33 </ b> B on the upper side 37 are symmetrical on the left and right sides of the central portion of the coupling surface 29. Thereby, when the ultrasonic flip chip is mounted, the pressing resistance applied to the left and right is substantially balanced, and the coupling surface 29 is not inclined or displaced in the left-right direction due to the concentration of pressure on one side.

光フェルール２５には、光ファイバ３９を挿通して先端部３９ａを突出させるための光ファイバ挿入孔４１が１列に設けられている。光ファイバ３９は例えば２５０μｍのピッチで配置されるように保持されており、その保持部分は、光ファイバ挿入孔４１内に充填される例えば熱硬化性の接着剤で光ファイバ３９を固着する。光ファイバ３９の先端部３９ａはファイバ端面がちょうど光電変換素子３１の受発光部３１ａの近傍に一致するように、予め突出長さが設定される。   The optical ferrule 25 is provided with optical fiber insertion holes 41 in one row for inserting the optical fiber 39 and projecting the tip portion 39a. The optical fibers 39 are held so as to be arranged at a pitch of, for example, 250 μm, and the holding portions fix the optical fibers 39 with, for example, a thermosetting adhesive filled in the optical fiber insertion holes 41. The protruding length of the distal end portion 39a of the optical fiber 39 is set in advance so that the end surface of the fiber is exactly in the vicinity of the light emitting / receiving portion 31a of the photoelectric conversion element 31.

光ファイバ３９は、複数本（本実施の形態では４本）並列され、テープ被覆４３により被覆されてテープ心線４５を形成している。なお、光ファイバ３９としてはマルチモードの光ファイバを用いるのが望ましい。例えば、コア径はφ５０μｍ、クラッド径φ８０μｍ、被覆外径φ１２５μｍのものを使用することができる。マルチモードの光ファイバを用いることにより、軸線方向あるいは調心方向に多少のずれを許容して取り付けることができる。   A plurality of optical fibers 39 (four in this embodiment) are juxtaposed and covered with a tape coating 43 to form a tape core wire 45. As the optical fiber 39, it is desirable to use a multimode optical fiber. For example, a core having a diameter of 50 μm, a cladding diameter of 80 μm, and a coating outer diameter of 125 μm can be used. By using a multimode optical fiber, it can be attached with some deviation in the axial direction or alignment direction.

デバイスアレイ２１の結合面２９が対面する光フェルール２５の結合面４７には、上記バンプ３３が接続される電気配線２３が設けられている。電気配線２３は、結合面４７に隣接する直交面（下面）４９に連続して形成される。後述するように、これにより光電変換素子３１に対して容易に電気を供給したり光電変換素子３１から信号を取り出したりすることができるようになっている。   On the coupling surface 47 of the optical ferrule 25 that the coupling surface 29 of the device array 21 faces, the electrical wiring 23 to which the bumps 33 are connected is provided. The electrical wiring 23 is continuously formed on an orthogonal surface (lower surface) 49 adjacent to the coupling surface 47. As will be described later, this makes it possible to easily supply electricity to the photoelectric conversion element 31 and to extract a signal from the photoelectric conversion element 31.

電気配線２３は、光ファイバ挿入孔４１を横断する長尺配線２３Ｌと、この長尺配線２３Ｌに平行で光ファイバ挿入孔４１に近接する短尺配線２３Ｓとからなる。つまり、長尺配線２３Ｌと短尺配線２３Ｓとは、光ファイバ挿入孔４１の並びに沿って交互に配置されている。長尺配線２３Ｌには下側３５のバンプ３３Ａと上側３７のバンプ３３Ｂが接続され、短尺配線２３Ｓには下側３５のバンプ３３Ａのみが接続される。換言すれば、下側３５のバンプ３３Ａは長尺配線２３Ｌおよび短尺配線２３Ｓに接続され、上側３７のバンプ３３Ｂは長尺配線２３Ｌのみと接続される。   The electrical wiring 23 includes a long wiring 23L that traverses the optical fiber insertion hole 41 and a short wiring 23S that is parallel to the long wiring 23L and close to the optical fiber insertion hole 41. That is, the long wires 23L and the short wires 23S are alternately arranged along the arrangement of the optical fiber insertion holes 41. Bump 33A on the lower side 35 and bump 33B on the upper side 37 are connected to the long wiring 23L, and only the bump 33A on the lower side 35 is connected to the short wiring 23S. In other words, the bumps 33A on the lower side 35 are connected to the long wires 23L and the short wires 23S, and the bumps 33B on the upper side 37 are connected only to the long wires 23L.

上記したデバイスアレイ２１と光フェルール２５を結合することで光モジュール２７が構成される。デバイスアレイ２１は、光フェルール２５の電気配線２３に、バンプ３３を押圧して超音波フリップチップ実装されると、光電変換素子３１を挟む下側３５とその反対の上側３７で、略均等に圧力が加わり、片側に圧力が集中することによる結合面２９の傾斜やずれが生じないようになされる。デバイスアレイ２１を光フェルール２５に超音波フリップチップ実装して光モジュール２７を得る際、光ファイバ挿入孔４１を横断して延出した長尺配線２３Ｌの先端に上側３７のバンプ３３Ｂが押圧され、従来構造のように、下側３５のバンプ３３Ａのみが押圧される場合に比べ、光ファイバ挿入孔４１を挟む下側３５と上側３７とで押圧力が略均衡することとなる。   An optical module 27 is configured by combining the device array 21 and the optical ferrule 25 described above. When the device array 21 is ultrasonically flip-chip mounted on the electrical wiring 23 of the optical ferrule 25 by pressing the bumps 33, the pressure is approximately evenly applied between the lower side 35 sandwiching the photoelectric conversion element 31 and the upper side 37 opposite thereto. Is added to prevent the coupling surface 29 from being inclined or displaced due to pressure concentration on one side. When the device array 21 is ultrasonically flip-chip mounted on the optical ferrule 25 to obtain the optical module 27, the bumps 33B on the upper side 37 are pressed against the distal ends of the long wires 23L extending across the optical fiber insertion holes 41, Compared with the case where only the bump 33A on the lower side 35 is pressed as in the conventional structure, the pressing force is substantially balanced between the lower side 35 and the upper side 37 with the optical fiber insertion hole 41 interposed therebetween.

デバイスアレイ２１と光フェルール２５とを結合すると、光電変換素子３１の電極であるバンプ３３Ａに導通した電気配線２３Ｌ，２３Ｓは光フェルール２５の下面４９に露出配置されることになる。光モジュール２７は、光フェルール２５を、電気配線２３が接触するように下面４９を基板等に実装することにより、電気配線２３（２３Ｌ，２３Ｓ）を介して光電変換素子３１に対して容易に電気を供給したり光電変換素子３１から信号を取り出したりすることができるようになっている。   When the device array 21 and the optical ferrule 25 are combined, the electrical wirings 23L and 23S conducted to the bumps 33A that are the electrodes of the photoelectric conversion element 31 are exposed on the lower surface 49 of the optical ferrule 25. The optical module 27 can be easily electrically connected to the photoelectric conversion element 31 via the electrical wiring 23 (23L, 23S) by mounting the optical ferrule 25 on the substrate or the like so that the electrical wiring 23 contacts. And a signal can be taken out from the photoelectric conversion element 31.

したがって、上記のデバイスアレイ２１によれば、電気配線２３を備えた光フェルール２５と結合可能であって、光素子列を挟む下側３５と、上側３７のそれぞれに電気配線２３と接続される複数のバンプ３３を備えたので、光フェルール２５の電気配線２３に、バンプ３３を押圧して超音波フリップチップ実装する場合であっても、光素子列を挟む下側３５と上側３７とで、略均等に圧力が加わることとなり、片側に圧力が集中することによる結合面２９の傾斜やずれを防止し、光フェルール２５と高精度に結合することができる。   Therefore, according to the device array 21 described above, a plurality of optical ferrules 25 provided with the electrical wiring 23 can be coupled to each of the lower side 35 and the upper side 37 sandwiching the optical element array. Therefore, even when the bump 33 is pressed on the electrical wiring 23 of the optical ferrule 25 and ultrasonic flip chip mounting is performed, the lower side 35 and the upper side 37 sandwiching the optical element array are substantially omitted. The pressure is evenly applied, and the inclination and displacement of the coupling surface 29 due to the concentration of the pressure on one side can be prevented, and the optical ferrule 25 can be coupled with high accuracy.

また、上記の光モジュール２７によれば、光モジュール２７の電気配線２３を、光ファイバ挿入孔４１を横断する長尺配線２３Ｌと、光ファイバ挿入孔４１に近接する短尺配線２３Ｓとで形成し、下側３５のバンプ３３Ａを、長尺配線２３Ｌおよび短尺配線２３Ｓと接続し、上側３７のバンプ３３Ｂを、長尺配線２３Ｌのみと接続したので、光ファイバ挿入孔４１を横断して延出した長尺配線２３Ｌの先端に上側３７のバンプ３３Ｂが押圧され、従来構造のように、下側３５のバンプ３３Ａのみが押圧される場合に比べ、光ファイバ挿入孔４１を挟む下側３５と上側３７とで押圧力が略均衡し、デバイスアレイ２１が傾斜やずれのない高い位置精度で光モジュール２７に超音波フリップチップ実装することができる。   Further, according to the optical module 27, the electrical wiring 23 of the optical module 27 is formed by the long wiring 23L crossing the optical fiber insertion hole 41 and the short wiring 23S close to the optical fiber insertion hole 41, The bumps 33A on the lower side 35 are connected to the long wires 23L and the short wires 23S, and the bumps 33B on the upper side 37 are connected only to the long wires 23L, so that the length extending across the optical fiber insertion hole 41 is extended. The lower side 35 and the upper side 37 sandwiching the optical fiber insertion hole 41 are compared with the case where the bump 33B on the upper side 37 is pressed against the tip of the length wiring 23L and only the bump 33A on the lower side 35 is pressed as in the conventional structure. Thus, the pressing force is substantially balanced, and the device array 21 can be ultrasonically flip-chip mounted on the optical module 27 with high positional accuracy without tilting or displacement.

なお、本発明に係るデバイスアレイおよび光モジュールは、上記した実施の形態に限定されるものでなく、適宜な変形、改良等が可能である。
例えば、実施の形態においては、４本の光ファイバ３９を４個の光電変換素子３１に接続する場合を例示したが、光ファイバ３９の本数あるいは光電変換素子３１の数はこれに限定されるものではない。また、実施の形態においては、テーテ心線４５を接続する場合について説明したが、光導波路の形態はこれに限定されるものではない。また、実施の形態においては、上側３７のバンプ３３Ｂは光電変換素子３１のいずれの電極とも接続せず、単に超音波フリップチップ実装時の耐押圧力が片側に集中しないようにした、所謂ダミーダンプとして設定されているが、例えば、光電変換素子３１の一方の電極と接続することによって、下側３５のバンプ３３Ａと並列接続されていてもよい。これにより、上側３７または下側３５の一方のバンプ３３を形成した配線パターン３０が万一に断線しても、光モジュール２７は不作動状態になることがない。 The device array and the optical module according to the present invention are not limited to the above-described embodiments, and appropriate modifications and improvements can be made.
For example, in the embodiment, the case where four optical fibers 39 are connected to four photoelectric conversion elements 31 is exemplified, but the number of optical fibers 39 or the number of photoelectric conversion elements 31 is limited to this. is not. In the embodiment, the case where the core wire 45 is connected has been described. However, the form of the optical waveguide is not limited to this. Further, in the embodiment, the bumps 33B on the upper side 37 are not connected to any electrode of the photoelectric conversion element 31, and the so-called dummy dump is formed so that the pressure resistance during the ultrasonic flip chip mounting is not concentrated on one side. However, for example, by connecting to one electrode of the photoelectric conversion element 31, it may be connected in parallel to the bump 33A on the lower side 35. Thereby, even if the wiring pattern 30 on which one bump 33 on the upper side 37 or the lower side 35 is formed is disconnected, the optical module 27 does not become inoperative.

本発明に係るデバイスアレイを（ａ）、デバイスアレイに結合される光フェルールを（ｂ）に示した斜視図である。It is the perspective view which showed the device array which concerns on this invention in (a), and the optical ferrule couple | bonded with a device array in (b). 図１に示したデバイスアレイと光フェルールとを結合してなる光モジュールの断面図である。It is sectional drawing of the optical module formed by couple | bonding the device array and optical ferrule shown in FIG. 従来のデバイスアレイを（ａ）、デバイスアレイに結合される光フェルールを（ｂ）に示した斜視図である。It is the perspective view which showed the conventional device array to (a) and the optical ferrule couple | bonded with a device array to (b). 図３に示したデバイスアレイと光フェルールとを結合してなる従来の光モジュールの断面図である。It is sectional drawing of the conventional optical module formed by couple | bonding the device array and optical ferrule shown in FIG.

符号の説明Explanation of symbols

２１ デバイスアレイ
２３ 電気配線
２３Ｌ 長尺配線
２３Ｓ 短尺配線
２５ 光フェルール
２７ 光モジュール
２９，４７ 結合面
３１ 光電変換素子（光素子）
３３ バンプ
３５ 下側（第１の側）
３７ 上側（第２の側）
４１ 光ファイバ挿入孔
ＳＢ 第２の側のバンプの底面積
ＳＡ 第１の側のバンプの底面積 21 Device Array 23 Electrical Wiring 23L Long Wiring 23S Short Wiring 25 Optical Ferrule 27 Optical Module 29, 47 Coupling Surface 31 Photoelectric Conversion Element (Optical Element)
33 Bump 35 Lower side (first side)
37 Upper side (second side)
41 Optical fiber insertion hole SB Bottom area of bump on second side SA Bottom area of bump on first side

Claims (4)

電気配線を備えた光フェルールと結合可能なデバイスアレイであって、
結合面に、複数の光素子が一列に配置され、
光素子列を挟む第１の側と、反対側の第２の側のそれぞれに前記電気配線と接続される複数のバンプを備えたことを特徴とするデバイスアレイ。 A device array that can be combined with an optical ferrule with electrical wiring,
A plurality of optical elements are arranged in a row on the coupling surface,
A device array comprising a plurality of bumps connected to the electric wiring on each of a first side sandwiching an optical element array and a second side opposite to the first side. 前記第２の側の前記バンプの数は前記第１の側の前記バンプの数より少なく、
前記第２の側の前記バンプの底面積は前記第１の側の前記バンプの底面積よりも大きいことを特徴とする請求項１記載のデバイスアレイ。 The number of bumps on the second side is less than the number of bumps on the first side,
2. The device array according to claim 1, wherein a bottom area of the bump on the second side is larger than a bottom area of the bump on the first side. 前記第１の側の前記バンプの底面積の和と、前記第２の側の前記バンプの底面積の和が略等しいことを特徴とする請求項１又は請求項２記載のデバイスアレイ。   3. The device array according to claim 1, wherein a sum of bottom areas of the bumps on the first side and a sum of bottom areas of the bumps on the second side are substantially equal. 請求項１〜請求項３のいずれか１項記載のデバイスアレイと、１列に配置した光ファイバ挿入孔を有し、結合面に電気配線を備えた光フェルールと、を前記バンプを介して結合した光モジュールであって、
前記電気配線が、光ファイバ挿入孔列を横断する長尺配線と、該長尺配線に平行で光ファイバ挿入孔列に近接する短尺配線とからなり、
前記第１の側の前記バンプが、前記長尺配線および前記短尺配線と接続され、
前記第２の側の前記バンプが、前記長尺配線のみと接続されたことを特徴とする光モジュール。 The device array according to any one of claims 1 to 3 and an optical ferrule having an optical fiber insertion hole arranged in a row and having an electric wiring on a coupling surface are coupled via the bumps. Optical module,
The electrical wiring consists of a long wiring that traverses the optical fiber insertion hole row, and a short wiring that is parallel to the long wiring and close to the optical fiber insertion hole row,
The bump on the first side is connected to the long wiring and the short wiring,
The optical module, wherein the bump on the second side is connected only to the long wiring.
JP2007292027A 2007-11-09 2007-11-09 Optical module Expired - Fee Related JP5012437B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204421A (en) * 2011-03-24 2012-10-22 Sumitomo Electric Ind Ltd Optical fiber holding member, photoelectric conversion terminal, photoelectric conversion module, and manufacturing method of photoelectric conversion module

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Publication number Priority date Publication date Assignee Title
JPH10300979A (en) * 1997-04-23 1998-11-13 Oki Electric Ind Co Ltd Method of coupling optical transmission paths and device therefor, and jig for optical axis self-alignment
JP2001281504A (en) * 2000-03-30 2001-10-10 Seiko Epson Corp Optical element member and optical module using the same
JP2007041267A (en) * 2005-08-03 2007-02-15 Sumitomo Electric Ind Ltd Optical connecting component and connecting method of the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300979A (en) * 1997-04-23 1998-11-13 Oki Electric Ind Co Ltd Method of coupling optical transmission paths and device therefor, and jig for optical axis self-alignment
JP2001281504A (en) * 2000-03-30 2001-10-10 Seiko Epson Corp Optical element member and optical module using the same
JP2007041267A (en) * 2005-08-03 2007-02-15 Sumitomo Electric Ind Ltd Optical connecting component and connecting method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204421A (en) * 2011-03-24 2012-10-22 Sumitomo Electric Ind Ltd Optical fiber holding member, photoelectric conversion terminal, photoelectric conversion module, and manufacturing method of photoelectric conversion module

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