JPS6240433Y2 - - Google Patents
Info
- Publication number
- JPS6240433Y2 JPS6240433Y2 JP1983002031U JP203183U JPS6240433Y2 JP S6240433 Y2 JPS6240433 Y2 JP S6240433Y2 JP 1983002031 U JP1983002031 U JP 1983002031U JP 203183 U JP203183 U JP 203183U JP S6240433 Y2 JPS6240433 Y2 JP S6240433Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- resin
- gate
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 52
- 238000000465 moulding Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Description
【考案の詳細な説明】
この考案は、半導体素子の樹脂封入成形用金型
装置の改良に関するものであり、特に、発光ダイ
オード等の樹脂封入成形品の製造産業の分野にお
いて利用される場合に顕著な効果を奏するもので
ある。[Detailed description of the invention] This invention relates to an improvement to a mold device for resin encapsulation molding of semiconductor elements, and is particularly effective when used in the industrial field of manufacturing resin encapsulation molding products such as light emitting diodes.
ところで、発光ダイオードは、第１図に示すよ
うに、二本のリードA1・A2と、その一方のリー
ドA1に取り付けた半導体素子Ｂと、該素子と他
方のリードA2とを電気的に接続させるリード線
（金線ワイヤ）Ｃと、上記二本のリードA1・A2
と、素子Ｂ及びリード線Ｃの外方周囲を透明樹脂
材料にて密に被覆させた透明体Ｄとから形成され
るのが通例である。また、上記発光ダイオードに
おける発光面、即ち、上記透明体Ｄの発光表面部
には所要の球面形状に形成されたレンズ面D1が
突設されるが、このようなレンズ面D1を有する
透明体Ｄは、樹脂成形用金型装置におけるキヤビ
テイ部内へ透明樹脂材料を注入させることによつ
て成形されている。 By the way, as shown in Fig. 1, a light emitting diode consists of two leads A1 and A2 , a semiconductor element B attached to one of the leads A1 , and an electrical connection between the element and the other lead A2 . Lead wire (gold wire) C to be connected to the above two leads A 1 and A 2
and a transparent body D in which the outer periphery of the element B and the lead wire C is densely covered with a transparent resin material. Further, a lens surface D 1 formed in a required spherical shape is protruded from the light emitting surface of the light emitting diode, that is, the light emitting surface portion of the transparent body D. The body D is molded by injecting a transparent resin material into a cavity in a resin molding mold device.
従来のこの種樹脂成形品の成形用金型装置とし
ては、第２図乃至第４図に示すようなものが知ら
れている。即ち、この従来装置は、固定上型１
と、該固定上型に対して上下動可能に対設した可
動下型２と、上記両型間に設けた半導体素子の樹
脂封入成形用キヤビテイ部３と、該キヤビテイ部
３と連通させた樹脂材料注入用のゲート４と、該
ゲートと連通させた溶融樹脂材料の移送経路５と
から構成されている。また、上記キヤビテイ部３
は、固定上型１側に形成したキヤビテイ３１と、
可動下型２側に形成したキヤビテイ３２とから構
成されると共に、下型キヤビテイ３２の所定位置
には、樹脂成形品におけるレンズ面D1を形成す
るための球面状凹所３３が形成されている。ま
た、上記ゲート４は、固定上型１側に形成される
と共に、該ゲートと上型キヤビテイ３１とは該上
型キヤビテイの片隅部において連通するように配
置され、且つ、該ゲートの配設方向は、上型キヤ
ビテイ３１と、樹脂材料供給ポツト（図示なし）
側に連通して上記移送経路５の一部を構成するラ
ンナ５１とが最短距離にて連通されるように、上
記ランナ５１の配設方向に対して直交する方向に
設けられている。なお、上型キヤビテイ３１の上
部位置と上記ランナ５１の上下両位置には、型開
時において、キヤビテイ部３内にて成形される樹
脂成形品と、ゲート４及び移送経路５，５１内に
固化形成されるコールドスラツグとを両型１・２
間へ突き出すための突出ピン６・７・８が夫々配
設されている。従つて、このような従来装置にお
いて半導体素子の樹脂封入成形を行なう場合は、
まず、リードフレームA1・A2を下型２の所定位
置にセツトした後に両型１・２の型締めを行な
い、次に、加熱・加圧によつて溶融化させた透明
な樹脂材料D′をその移送経路５（ランナ５′）及
びゲート４を通してキヤビテイ部３内に注入し、
所要時間の経過後に、型開きを行なうと共に突出
ピン６・７・８により成形品と前記コールドスラ
ツグとを突き出すものである。ここで、上記リー
ドフレームの所定位置へのセツト状態は、該リー
ドフレームA1に装着した半導体素子Ｂが前記凹
所３３の上方位置において下向きに突出支持され
ていることを要する。また、この状態でキヤビテ
イ部３による透明体Ｄの樹脂成形が行なわれるの
であるが、キヤビテイ部３内に注入された溶融樹
脂D′は、自重によつて下型キヤビテイ３２側へ
流入した後に上型キヤビテイ３１側へ順次充填さ
れることになる。ところが、この従来装置の構成
においては、ゲート４がキヤビテイ部３，３１の
片隅部に連通開設されているため、キヤビテイ部
３内に注入された溶融樹脂D′の一部が、第４図
に示すように、下型キヤビテイ３２の底面から凹
所３３内に流れ込む際に渦流を生じて、該凹所３
３内の残溜空気を溶融樹脂D′中に巻き込むこと
になるのである。この空気は成形品の透明体Ｄ中
においてボイド（気泡）を形成することになり、
しかも、該ボイドは下型キヤビテイ３２及び凹所
３３において成形される透明体中に発生し易いた
め、半導体素子Ｂを発光させた場合に上記ボイド
がその光を乱反射する等の弊害がみられ、このこ
とはこの種樹脂成形品の信頼性を著しく低下させ
る重大な欠点とされている。 As a conventional mold apparatus for molding resin molded products of this type, those shown in FIGS. 2 to 4 are known. That is, this conventional device has a fixed upper mold 1
, a movable lower mold 2 disposed vertically movably opposite to the fixed upper mold, a cavity 3 for resin encapsulation molding of a semiconductor element provided between the two molds, and a resin communicated with the cavity 3. It consists of a gate 4 for material injection and a transfer path 5 for molten resin material communicated with the gate. In addition, the cavity part 3
is a cavity 31 formed on the fixed upper mold 1 side,
It consists of a cavity 32 formed on the side of the movable lower mold 2, and a spherical recess 33 for forming the lens surface D1 in the resin molded product is formed at a predetermined position of the lower mold cavity 32 . has been done. Further, the gate 4 is formed on the fixed upper mold 1 side, and the gate and the upper mold cavity 31 are arranged so as to communicate with each other at one corner of the upper mold cavity, and the arrangement of the gate is The direction is the upper mold cavity 31 and the resin material supply pot (not shown).
The runner 51 is provided in a direction perpendicular to the direction in which the runner 51 is disposed so that the runner 51 , which communicates with the runner 51 forming a part of the transfer path 5, communicates with the runner 51 through the shortest distance. In addition, at the upper position of the upper mold cavity 31 and at both the upper and lower positions of the runner 51 , there are a resin molded product molded in the cavity part 3 when the mold is opened, a gate 4, and transfer paths 5, 51. The cold slug solidified inside the molds 1 and 2
Projection pins 6, 7, and 8 for projecting into the space are provided, respectively. Therefore, when performing resin encapsulation molding of semiconductor elements using such conventional equipment,
First, the lead frames A 1 and A 2 are set in the predetermined positions of the lower mold 2, and both molds 1 and 2 are clamped. Next, the transparent resin material D is melted by heating and pressurization. ' is injected into the cavity 3 through its transfer path 5 (runner 5') and gate 4,
After the required time has elapsed, the mold is opened and the molded product and the cold slug are ejected using the ejecting pins 6, 7, and 8. Here, setting the lead frame at a predetermined position requires that the semiconductor element B mounted on the lead frame A1 be supported in a position above the recess 33 so as to protrude downward. In addition, resin molding of the transparent body D by the cavity part 3 is performed in this state, and after the molten resin D' injected into the cavity part 3 flows into the lower mold cavity 32 side by its own weight, The upper mold cavity 31 side is filled sequentially. However, in the configuration of this conventional device, since the gate 4 is opened in communication with one corner of the cavity parts 3 and 31 , a part of the molten resin D' injected into the cavity part 3 is leaked as shown in FIG. As shown in the figure, when flowing from the bottom of the lower mold cavity 32 into the recess 33 , a vortex is generated and the recess 3
This causes the residual air in the molten resin D' to be drawn into the molten resin D'. This air will form voids (bubbles) in the transparent body D of the molded product,
Moreover, since the voids are likely to occur in the transparent body molded in the lower mold cavity 32 and the recesses 33 , when the semiconductor element B emits light, the voids may cause problems such as diffuse reflection of the light. This is considered to be a serious drawback that significantly reduces the reliability of this type of resin molded product.
なお、従来装置において、キヤビテイ部内の残
溜空気を排出させる目的としてエヤベントを構成
したものがあるが、このエヤベントは両型１・２
のパーテイングライン（P.L）面に設けられるの
が通例であり、溶融樹脂をキヤビテイ部内へ注
入・充填させながら残溜空気をキヤビテイ部外に
押し出すように設けたものである。しかしなが
ら、上述したように、溶融樹脂中に巻き込まれた
空気を上記エヤベントから排出させることは不能
であつて該エヤベントの機能が有効に作用せず、
従つて、従来装置においては上記したボイドの発
生を確実に防止することができないといつた欠点
を有するものである。 Note that some conventional devices are equipped with an air vent for the purpose of discharging residual air in the cavity, but this air vent is available in both types 1 and 2.
It is usually installed on the parting line (PL) surface of the cavity, and is installed so that residual air is pushed out of the cavity while molten resin is injected and filled into the cavity. However, as mentioned above, it is impossible to discharge the air caught in the molten resin from the air vent, and the function of the air vent does not work effectively.
Therefore, the conventional device has the disadvantage that it is not possible to reliably prevent the occurrence of the above-mentioned voids.
本考案は、キヤビテイ部内への溶融樹脂の注
入・充填時に、該樹脂による残溜空気の巻き込み
作用を確実に防止させることによつて、上述した
ような従来装置における問題点を解消することを
目的とするものである。 The purpose of the present invention is to solve the above-mentioned problems with conventional devices by reliably preventing the entrainment of residual air by the resin when injecting and filling molten resin into the cavity. That is.
本考案装置は、固定上型と、該固定上型に対し
て上下動可能に対設した可動下型と、上記両型間
に設けた半導体素子の樹脂封入成形用キヤビテイ
部と、該キヤビテイ部と連通させた溶融樹脂注入
用のゲートとが設けられている金型装置におい
て、上記可動下型におけるキヤビテイの所要個所
に樹脂成形品のレンズ面形成用の球面状凹所を設
けると共に、上記ゲートの位置及び配置方向を、
上記球面状凹所の中心線上の位置及び該中心線の
方向に沿つて配設したことを特徴とする半導体素
子の樹脂封入成形用金型装置に係るものである。 The device of the present invention is a mold device that is provided with a fixed upper mold, a movable lower mold that is opposed to the fixed upper mold so as to be movable up and down, a cavity portion for resin encapsulation molding of semiconductor elements provided between the two molds, and a gate for injecting molten resin that communicates with the cavity portion. In the mold device, a spherical recess for forming a lens surface of a resin molded product is provided at a required position in the cavity of the movable lower mold, and the position and arrangement direction of the gate are determined by
The present invention relates to a mold device for resin encapsulation molding of semiconductor elements, characterized in that the mold is disposed on the center line of the spherical recess and along the direction of the center line.
以下、本考案を第５図及至第８図に示す実施例
図に基づいて説明する。 Hereinafter, the present invention will be explained based on the embodiment diagrams shown in FIGS. 5 to 8.
第５図は金型装置の要部を示すもので、この金
型装置は、固定上型１１と、該固定上型に対して
上下動可能に対設した可動下型１２と、上記両型
間に設けた半導体素子の樹脂封入成形用キヤビテ
イ部と連通させた樹脂材料注入用のゲート１４
と、該ゲートと連通させた溶融樹脂材料の移送経
路１５とから構成されている。また、上記キヤビ
テイ部１３は、固定上型１１側に形成したキヤビ
テイ１３１と、可動下型１２側に形成したキヤビ
テイ１３２とから構成されると共に、下型キヤビ
テイ１３２の所要位置には、樹脂成形品における
レンズ面D1を形成するための球面状凹所１３３
が形成されている。また、上記ゲート１４は、固
定上型１１側に形成されると共に、該ゲートの配
設位置及び配置方向は、上記凹所１３３の中心線
（Ｘ−Ｘ）上の位置及び該中心線の方向に沿つて
設けられている。更に、該ゲート１４は、樹脂材
料供給ポツト（図示なし）側に連通して上記移送
経路１５の一部を構成するランナ１５１側と連通
されている。 FIG. 5 shows the main parts of the mold device, and this mold device consists of a fixed upper mold 11, a movable lower mold 12 that is vertically movable opposite the fixed upper mold, and both of the molds. A gate 14 for injecting a resin material and communicating with a cavity portion for resin encapsulation molding of a semiconductor element provided in between.
and a molten resin material transfer path 15 communicating with the gate. The cavity portion 13 is composed of a cavity 131 formed on the fixed upper mold 11 side and a cavity 132 formed on the movable lower mold 12 side, and at required positions of the lower mold cavity 132 . Spherical recess 13 3 for forming lens surface D 1 in resin molded product
is formed. Further, the gate 14 is formed on the fixed upper mold 11 side, and the position and direction of the gate are on the center line (X-X) of the recess 133 and on the center line. It is placed along the direction. Further, the gate 14 communicates with a runner 151 that communicates with a resin material supply pot (not shown) and forms a part of the transfer path 15.
なお、上型キヤビテイ１３１の上部位置と上記
ランナ１５１の上下両位置には、型開時におい
て、キヤビテイ部１３内にて形成される樹脂成形
品と、ゲート１４及び移送経路１５，１５１内に
固化形成されるコールドスラツグとを両型１１・
１２間へ突き出すための突出ピン１６・１７・１
８が夫々配設されている。 In addition, at the upper position of the upper mold cavity 131 and at both the upper and lower positions of the runner 151 , there are a resin molded product formed in the cavity part 13, a gate 14, and transfer paths 15, 151 when the mold is opened. Both molds 11 and the cold slug solidified inside
Protrusion pins 16, 17, 1 for protruding between 12
8 are arranged respectively.
また、第６図及び第７図に示す下型キヤビテイ
１３２には、該下型キヤビテイの略中央位置に球
面状凹所１３３が配設されている場合を示した
が、この凹所は、樹脂成形品をシヤーシ等に取り
付けるときのスペース或は取付面等における緒種
の制約から、その配設位置が変更され得るもので
あり、例えば、透明体形成用のキヤビテイ部を、
第８図に示すように、矩形状に設けると共に、そ
の下型キヤビテイ１３2′の底面側端部に球面状凹
所１３3′を配設することがある。このような場合
においても、そのゲート１４の配設位置及び配置
方向は、上記凹所１３3′の中心線（Ｘ−Ｘ）上の
位置及び該中心線の方向に沿つて設ければよいの
である。 Further, in the lower mold cavity 132 shown in FIGS. 6 and 7, a spherical recess 133 is provided at approximately the center of the lower mold cavity. Due to constraints on the space or mounting surface when attaching a resin molded product to a chassis etc., its placement position may be changed.
As shown in FIG. 8, the lower mold cavity 13 2 ' may be provided in a rectangular shape, and a spherical recess 13 3 ' may be provided at the bottom end of the lower mold cavity 13 2 '. Even in such a case, the position and direction of arrangement of the gate 14 may be on the center line (X-X) of the recess 13 3 ' and along the direction of the center line. be.
また、上記第６図及び第８図に示したゲート１
４・１４は、キヤビテイ１３・１３とランナ１
５・１５とが最短距離にて連通されるように、該
ランナの配設方向に対して直交する方向に設けら
れているが、ゲートの位置及び配置方向は、前記
凹所１３３，１３3′の中心線（Ｘ−Ｘ）上の位置
及び該中心線の方向に沿つて設けられておればよ
く、従つて、上記ランナ１５・１５の配設方向に
対して傾斜する方向に配設しても差支えない。 In addition, the gate 1 shown in FIGS. 6 and 8 above
4 and 14 are cavities 13 and 13 and runner 1.
The gates are provided in a direction perpendicular to the arrangement direction of the runners so that the gates 13 3 and 15 communicate with each other at the shortest distance. It is sufficient that the runners are provided at a position on the center line (X-X) of 1 and along the direction of the center line. There is no problem.
上記構成を有する金型装置の樹脂成形作用は、
前述した従来装置における成形作用と同じである
が、ゲート１４の位置及び配置方向を、下型キヤ
ビテイ１３２，１３2′に設けた球面状凹所１３
３，１３3′の中心線（Ｘ−Ｘ）上の位置及び該中
心線の方向に沿つて配設したことにより、以下に
説明するような顕著な作用が行なわれる。即ち、
キヤビテイ部１３内に注入された溶融樹脂
D″は、自重によつて下型キヤビテイ１３２，１
３2′側に流入した後に上型キヤビテイ１３１側へ
順次充填されることになるが、その溶融樹脂の充
填状態をみると、所要の注入圧力によつて注入さ
れる溶融樹脂D″は、ゲート１４から凹所１３
３，１３3′の中心線Ｘ−Ｘに沿つて下型キヤビテ
イ１３２，１３2′内へ順次流れ込むため、その樹
脂は、第７図に示すように、ゲート１４の出口を
中心として半円弧状に広がつて上記凹所１３３，
１３3′内をスムーズに充填した後に上型キヤビテ
イ１３１側に上昇してキヤビテイ部１３内を完全
に充填するのである。また、この充填作用におい
ては、溶融樹脂D″がキヤビテイ部１３内の残溜
空気を巻き込むことが無いのみならず、この空気
をパーテイングライン（P.L）面等に設けたエヤ
ベントから効率良く外部に排出させるものであ
る。 The resin molding action of the mold device having the above configuration is as follows:
Although the forming operation is the same as that in the conventional device described above, the position and arrangement direction of the gate 14 are changed by changing the position and direction of the gate 14 by adjusting the spherical recess 13 provided in the lower die cavity 13 2 , 13 2 ′.
3 and 13 3 ' on the centerline (X-X) and along the direction of the centerline, significant effects are achieved as will be explained below. That is,
Molten resin injected into cavity part 13
D″ is the lower mold cavity 13 2 , 1 due to its own weight.
After flowing into the 3 2 ' side, it is sequentially filled into the upper die cavity 13 1 side. Looking at the filling state of the molten resin, the molten resin D'' injected with the required injection pressure is: From gate 14 to recess 13
3 and 13 3 ' into the lower mold cavities 13 2 and 13 2 ', the resin flows in a semicircle around the exit of the gate 14, as shown in FIG. The recess 13 3 expands in an arc shape,
After smoothly filling the inside of the mold cavity 13 3 ', it rises toward the upper mold cavity 13 1 side and completely fills the inside of the cavity portion 13 . In addition, in this filling action, not only does the molten resin D'' not involve the residual air in the cavity 13, but also this air is efficiently released to the outside through the air vent provided on the parting line (PL) surface, etc. It is to be discharged.
以上のように、本考案装置を用いるときは、ゲ
ートの位置及び配置方向を、下型キヤビテイに設
けた球面状凹所の中心線上の位置及び該中心線の
方向に沿つて配設させた構成により、キヤビテイ
部内への溶融樹脂の注入・充填時において、該樹
脂による残溜空気の巻き込み作用が確実に防止さ
れるため、透明体中にボイドを形成するといつた
弊害を解消することができて発光ダイオード等の
樹脂封入成形品の信頼性を著しく向上することが
できるといつた有用顕著な効果を奏するものであ
る。また、本考案装置においては、キヤビテイ部
内における溶融樹脂の渦流を防止し得るので、残
溜空気の排出作用をスムーズに行ない得て、透明
体の外表面に残溜空気によるボイド或はピンホー
ル等の形成を確実に防止するため、高精度及び高
品質が要求されるこの種成形品の成形に最適な金
型装置を提供することができるといつた効果を奏
するものである。 As described above, when using the device of the present invention, the gate is arranged in a configuration in which the position and direction of the gate are on the center line of the spherical recess provided in the lower mold cavity and along the direction of the center line. This reliably prevents the entrainment of residual air by the resin when injecting and filling the molten resin into the cavity, thereby eliminating the negative effects of forming voids in the transparent body. The present invention exhibits useful and remarkable effects such as being able to significantly improve the reliability of resin-filled molded products such as light emitting diodes. Furthermore, in the device of the present invention, swirling of the molten resin in the cavity can be prevented, so that residual air can be smoothly discharged, and voids or pinholes caused by residual air can be prevented on the outer surface of the transparent body. This has the effect that it is possible to provide a mold apparatus that is optimal for molding this type of molded product that requires high precision and high quality in order to reliably prevent the formation of.
第１図は発光ダイオード等の半導体素子の樹脂
封入成形品を示す一部切欠斜視図、第２図乃至第
４図は従来の樹脂封入成形金型装置を示すもの
で、第２図は該装置要部の縦断面図、第３図はそ
の可動下型の要部を示す平面図、第４図は該装置
における樹脂成形作用の説明図、第５図乃至第８
図は本考案の実施例を示すもので、第５図は本考
案金型装置の要部を示す縦断面図、第６図はその
可動下型の要部を示す平面図、第７図は該装置に
おける樹脂成形作用の説明図、第８図は本考案装
置の他の実施例を示す可動下型要部の平面図であ
る。
１１……固定上型、１２……可動下型、１３…
…キヤビテイ部、１３２，１３2′……下型キヤビ
テイ、１３３，１３3′……球面状凹所、１４……
ゲート、Ｘ−Ｘ……中心線。
Fig. 1 is a partially cutaway perspective view showing a resin-filled molded product of a semiconductor element such as a light emitting diode, and Figs. 2 to 4 show a conventional resin-filled molding device. 3 is a plan view showing the main parts of the movable lower mold, FIG. 4 is an explanatory diagram of the resin molding operation in the device, and FIGS. 5 to 8
The figures show an embodiment of the present invention; FIG. 5 is a vertical sectional view showing the main parts of the mold apparatus of the invention, FIG. 6 is a plan view showing the main parts of the movable lower mold, and FIG. FIG. 8 is an explanatory view of the resin molding operation in the apparatus, and is a plan view of the main part of the movable lower mold showing another embodiment of the apparatus of the present invention. 11... Fixed upper mold, 12... Movable lower mold, 13...
...Cavity part, 13 2 , 13 2 ′ ... Lower mold cavity, 13 3 , 13 3 ' ... Spherical recess, 14 ...
Gate, X-X...center line.
Claims (1)
対設した可動下型と、上記両型間に設けた半導体
素子の樹脂封入成形用キヤビテイ部と、該キヤビ
テイ部と連通させた溶融樹脂注入用のゲートが設
けられている金型装置において、上記可動下型に
おけるキヤビテイの所要個所に樹脂成形品のレン
ズ面形成用の球面状凹所を設けると共に、上記ゲ
ートの位置及び配置方向を上記球面状凹所の中心
線上の位置及び該中心線の方向に沿つて配設した
ことを特徴とする半導体素子の樹脂封入成形用金
型装置。 A fixed upper mold, a movable lower mold installed vertically movably opposite to the fixed upper mold, a cavity for molding resin encapsulation of semiconductor elements provided between the two molds, and a melting mold connected to the cavity. In a mold device equipped with a gate for resin injection, a spherical recess for forming a lens surface of a resin molded product is provided at a required location in the cavity of the movable lower mold, and the position and arrangement direction of the gate is determined. A mold device for resin-encapsulating a semiconductor element, characterized in that the spherical recess is disposed at a position on the center line and along the direction of the center line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983002031U JPS59109142U (en) | 1983-01-11 | 1983-01-11 | Mold equipment for resin encapsulation of semiconductor elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983002031U JPS59109142U (en) | 1983-01-11 | 1983-01-11 | Mold equipment for resin encapsulation of semiconductor elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59109142U JPS59109142U (en) | 1984-07-23 |
| JPS6240433Y2 true JPS6240433Y2 (en) | 1987-10-16 |
Family
ID=30133729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983002031U Granted JPS59109142U (en) | 1983-01-11 | 1983-01-11 | Mold equipment for resin encapsulation of semiconductor elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59109142U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005078807A1 (en) * | 2004-02-17 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | Photoelectric conversion plug and photoelectric conversion module using it, and production method for photoelectric conversion plug |
-
1983
- 1983-01-11 JP JP1983002031U patent/JPS59109142U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59109142U (en) | 1984-07-23 |
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