JPS62128721A - Molding of resin - Google Patents
Molding of resinInfo
- Publication number
- JPS62128721A JPS62128721A JP27003385A JP27003385A JPS62128721A JP S62128721 A JPS62128721 A JP S62128721A JP 27003385 A JP27003385 A JP 27003385A JP 27003385 A JP27003385 A JP 27003385A JP S62128721 A JPS62128721 A JP S62128721A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- gate
- cavity
- product
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 48
- 239000011347 resin Substances 0.000 title claims abstract description 48
- 238000000465 moulding Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 241000218657 Picea Species 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、半導体素子等の樹脂封止に適した樹脂成形
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a resin molding method suitable for resin encapsulation of semiconductor elements and the like.
（ロ）従来の技術
従来、半導体素子等の樹脂封止に用いられている樹脂成
形方法は、第５図に示すように、２つの金型５０．５１
を合わせ、ランナ部５２及びキャビティ５３を形成し、
このキャビティ５３内には被封止物として、トランジス
タチップ等を先端部にボンディングしたり−ド５５を、
金型５０．５１間に挟むようにして支持させてお（。次
に、ランナ部５２に成形器（図示せず）により可塑化し
た樹脂を注入し、一方の金型５０の分割面ｐ−ｐ上に凹
設されたゲート５４を通じて、ランナ部５２内の樹脂を
キャビティ５３内に流入させ、リード５５先端を樹脂で
封止すると共に、素子の成形を行うものであった。(B) Conventional technology The resin molding method conventionally used for resin encapsulation of semiconductor elements, etc., consists of two molds 50 and 51, as shown in FIG.
are combined to form a runner part 52 and a cavity 53,
Inside this cavity 53, as an object to be sealed, a transistor chip or the like is bonded to the tip, or a bond 55 is placed.
The molds 50 and 51 are sandwiched between the molds 50 and 51 to be supported (Next, plasticized resin is injected into the runner part 52 using a molding machine (not shown), and the molds 50 and 51 are placed on the dividing surface p-p of the mold 50. The resin in the runner section 52 was allowed to flow into the cavity 53 through the gate 54 recessed in the hole, and the tips of the leads 55 were sealed with the resin and the element was molded.
（ハ）発明が解決しようとする問題点
上記従来の樹脂成形方法においては、被封止物がキャビ
ティ５３内で占める容積が大である場合、例えばリード
５５に放熱板が形成されている場合には、ゲート５４が
分割面ｐ−ｐに対して片側にだけしか設けられていない
ため、キャビティ５３内に流入した樹脂は、その流れを
放熱板の存在によって乱され、空気を巻込んで気泡を発
生させる。(c) Problems to be Solved by the Invention In the conventional resin molding method described above, when the volume occupied by the object to be sealed in the cavity 53 is large, for example, when a heat sink is formed on the lead 55, Since the gate 54 is provided only on one side of the dividing plane pp, the flow of the resin flowing into the cavity 53 is disturbed by the presence of the heat sink, and air is drawn in to form bubbles. generate.
この気泡（ボイド又はピンホールと呼ばれる）は、樹脂
固化後、製品中にそのまま残り、その製品は不良品とな
る不都合があった。These air bubbles (referred to as voids or pinholes) remain in the product after the resin solidifies, resulting in the product being defective.
そこで、上記不都合を解決するための手段として、ゲー
ト５４のキャビティ５３への開口面積を大きくすること
が提案され、気泡の発生の防止に関しては効果が認めら
れたが、樹脂固化後、金型５０より製品を取出し、製品
とゲート片（ゲート５４内で固化した樹脂の部分）とを
分離する際、両者の接合している面積が大であるため、
製品が欠けてしまったり、大きなパリが残り、外観上好
ましくないといった新たな不都合が生じた。Therefore, as a means to solve the above-mentioned inconvenience, it was proposed to increase the opening area of the gate 54 to the cavity 53, and although it was found to be effective in preventing the generation of air bubbles, after the resin solidified, the mold 53 When taking out the product and separating the product and the gate piece (the part of the resin solidified inside the gate 54), since the area where the two are joined is large,
New inconveniences have arisen, such as the product becoming chipped and large cracks remaining, which are undesirable in appearance.
この発明は、上記不都合に鑑みてなされたもので、製品
中に気泡が発生せず、また製品が欠けたり大きなパリが
製品に残ることのない樹脂成形方法を提供することを目
的として°いる。The present invention has been made in view of the above-mentioned disadvantages, and an object of the present invention is to provide a resin molding method that does not generate bubbles in the product, prevent the product from chipping, or leave large particles on the product.
（ニ）問題点を解決するための手段及び作用上記不都合
を解決するために、この発明の樹脂成形方法は、２つの
金型の分割面の両側にそれぞれ独立して設けられたゲー
トより、同時にキャビティ内に樹脂の流入を行うもので
あり、樹脂の流れが被封止物によって乱されないため、
空気を巻込むことがなく、樹脂中に気泡が発生しない。(d) Means and operation for solving the problems In order to solve the above-mentioned disadvantages, the resin molding method of the present invention provides a resin molding method that simultaneously The resin flows into the cavity, and the resin flow is not disturbed by the object to be sealed.
No air is trapped and no bubbles are generated in the resin.
従って、各ゲートのキャビティへの開口面積を小さくす
ることができる。Therefore, the opening area of each gate to the cavity can be reduced.
（ホ）実施例
この発明の一実施例を、第１図乃至第４図に基づいて以
下に説明する。(E) Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.
この実施例は、放熱板を有するパワートランジスタの樹
脂封止・成形を行うものであり、樹脂としては、熱硬化
性であるエポキシ系樹脂を用いる。In this embodiment, a power transistor having a heat sink is sealed and molded with a resin, and a thermosetting epoxy resin is used as the resin.
第２図は、下型１１の分割面（上面）の一部を示す斜視
図であり、分割面に凹設されたランナ溝１２に沿って、
凹部１３、・・・・・・、１３が列設されている。各凹
部１３、・旧・・、１３とランナ溝１２は、それぞれ下
型１１上面に凹設されたゲート１４、・・・・・・、１
４により連通している。また、各凹部１３、・・・・・
・、１３底面には、後述の放熱板２５の透孔２７に挿入
されるピン１５、・・・・・・、１５が突設されている
。さらに、凹部１３、・・・・・・、１３のランナ溝１
２と反対側には、後述のり−ド２２．２３．２４を挿通
ずるための挿通溝１６、・・・・・・、１６が付設され
ている。FIG. 2 is a perspective view showing a part of the dividing surface (upper surface) of the lower mold 11. Along the runner groove 12 recessed in the dividing surface,
Recesses 13, . . . , 13 are arranged in a row. Each of the recesses 13, old..., 13 and the runner groove 12 are connected to gates 14,..., 1 recessed in the upper surface of the lower die 11, respectively.
It is connected by 4. Moreover, each concave portion 13,...
A pin 15, . . . , 15, which is inserted into a through hole 27 of a heat dissipation plate 25, which will be described later, is provided protruding from the bottom surface of the radiator plate 25. Furthermore, the runner grooves 1 of the recesses 13, . . . , 13
On the side opposite to 2, there are provided insertion grooves 16, .
２１は、細長い金属薄板の側部にリード２２．２３．２
４を一組にして列設したタイバーである。21 is a lead 22.23.2 on the side of a long thin metal plate.
This is a tie bar with 4 pieces arranged in a row.
リード２３の先端には、長方形の放熱板２５が設けられ
る。放熱板２５上のり一ド２３側には、トランジスタチ
ップ２６がボンディングされ、さらにリード２２．２４
の先端とこのトランジスタチップ２６とは、金線等（図
示せず）でそれぞれワイヤボンディングされる。放熱板
２５中央には、完成したトランジスタ素子にビスを挿通
するための透孔２７が穿設されている。A rectangular heat sink 25 is provided at the tip of the lead 23. A transistor chip 26 is bonded to the top of the heat sink 25 on the side of the lead 23, and leads 22, 24 are bonded.
The tip of the transistor chip 26 is wire-bonded with a gold wire or the like (not shown). A through hole 27 is bored in the center of the heat sink 25 for inserting a screw into the completed transistor element.
第３図は、上型３１の分割面（下面）の一部を斜め下方
より見た図である。３２は、下型１１と上型３１とを合
わせた時に、下型１１のランナ溝１２と一体になり、ラ
ンナ部２を形成する（第１図参照）ランナ溝であり、こ
のランナ溝３２に沿って下型１１の凹部１３、・・・・
・・、１３と一体となり、キャビティ３、・・・・・・
、３を形成する凹部３３、・・・・・・、３３が列設さ
れており、これら凹部３３、・・・・・・、３３は、ゲ
ート３４、・・・・・・、３４により、ランナ溝３２と
各々連通している。但し、下型１１のゲート１４とこの
ゲート３４は、互いに独立している。さらに、凹部３３
、・・・・・・、３３内には、前記下型１１のピン１５
、・・・・・・、１５と突き合わされるピン３５、・・
・・・・、３５が垂設されている。FIG. 3 is a view of a part of the dividing surface (lower surface) of the upper die 31 as viewed obliquely from below. 32 is a runner groove that becomes integral with the runner groove 12 of the lower die 11 to form the runner part 2 (see Fig. 1) when the lower die 11 and the upper die 31 are combined; Along the recess 13 of the lower die 11,...
..., becomes one with 13, cavity 3, ...
, 3 are arranged in a row, and these recesses 33, . . . , 33 form gates 34, . They each communicate with the runner grooves 32. However, the gate 14 of the lower mold 11 and this gate 34 are independent from each other. Furthermore, the recess 33
, . . . , 33 includes pins 15 of the lower mold 11.
,..., pin 35 matched with 15,...
..., 35 are installed vertically.
次に、この実施例における樹脂成形の手順を、以下に説
明する。Next, the procedure of resin molding in this example will be explained below.
先ず、タイバー２１のリード２２．２３．２４を下型１
１の挿通溝１６、・・・・・・、１６内に挿通させるよ
うにして、放熱板２５を凹部１３内にセットし、上型３
１と下型１１をタイバー２１を挟むよ、うにして合わせ
る（第１図参照）、この時、放熱板２５及びリード２２
．２４の先端部は、キャビティ３内の分割面Ｐ−Ｐ上に
支持され、ピン１５上端及びピン１５上端が放熱板２５
の透孔２７内に挿入され、突き合わされる。尚、ピン１
５及びピン３５は、製品であるトランジスタ素子４４に
ビス挿通孔４５を形成するためのものである（第４図参
照）。First, connect the leads 22, 23, and 24 of the tie bar 21 to the lower mold 1.
1, the heat dissipation plate 25 is set in the recess 13 so as to be inserted into the insertion groove 16, ..., 16 of the upper mold 3.
1 and the lower mold 11 with the tie bar 21 in between (see Fig. 1). At this time, the heat sink 25 and the lead 22
．． The tip of the pin 24 is supported on the dividing plane P-P in the cavity 3, and the upper end of the pin 15 and the upper end of the pin 15 are supported on the heat sink 25.
are inserted into the through holes 27 of the two and abutted against each other. In addition, pin 1
5 and the pin 35 are for forming a screw insertion hole 45 in the transistor element 44 as a product (see FIG. 4).
次いで、上型３１と下型１１が離合しないように圧力を
加えて固定する。樹脂を固化させるため、上型３１と下
型１１は常時所定の温度に加熱保持されている。そして
、上型３１に設けられたランナ部２と連通するスプル（
図示せず）を通して、トランスファ成形機より可塑化さ
れた樹脂が、ランナ部２内に圧入される。Next, pressure is applied to fix the upper mold 31 and the lower mold 11 so that they do not separate. In order to solidify the resin, the upper mold 31 and the lower mold 11 are constantly heated and maintained at a predetermined temperature. Then, a sprue (
(not shown), plasticized resin is press-fitted into the runner section 2 by a transfer molding machine.
ランナ部２内に圧入された樹脂は、各ゲート１４、・・
・・・・、１４．３４、・・・・・・、３４よりキャビ
ティ３内に流入する。ゲート１４より流入した樹脂Ｒ１
は、主に放熱板２５の下側の凹部１３内を充填する。一
方、ゲート３４よりキャビティ３内に流入した樹脂Ｒ３
は、主に放熱板２５の上側の凹部３３内を充填する。こ
の時に、樹脂Ｒ３及びＲ１の流れの乱れは少なく、層流
に近いため、空気を巻込んで気泡を発生することはない
。The resin press-fitted into the runner part 2 is applied to each gate 14,...
. . . , 14.34, . . . , flows into the cavity 3 from 34. Resin R1 flowing from gate 14
mainly fills the inside of the recess 13 on the lower side of the heat sink 25. On the other hand, resin R3 flowing into the cavity 3 from the gate 34
mainly fills the inside of the recess 33 on the upper side of the heat sink 25. At this time, the flow of the resins R3 and R1 has little turbulence and is close to a laminar flow, so air is not drawn in and bubbles are not generated.
所定時間が経過し、樹脂が固化した後、上型３１と下型
１１を分離し、トランジスタ素子４４、・・・・・・、
４４をランナ４２及びタイバー２１ごと取出し、樹脂成
形を終了する。第４図は、取出されたトランジスタ素子
４４−個についての斜視図であり、分割面Ｐより上側で
はゲート片４３、分割面Ｐより下側ではゲート片４１に
より、ランナ４２と結ばれている。After a predetermined period of time has elapsed and the resin has solidified, the upper mold 31 and the lower mold 11 are separated, and the transistor elements 44,...
44 together with the runner 42 and tie bar 21, and the resin molding is completed. FIG. 4 is a perspective view of 44 extracted transistor elements, which are connected to the runner 42 by a gate piece 43 above the dividing plane P and by a gate piece 41 below the dividing plane P.
次の工程では、トランジスタ素子４４よりゲート片４１
．４３を切離すが、この時、ゲート片４１１４３とトラ
ンジスタ素子４４との接合部の断面積が小であるため、
パリが残ったりトランジスタ素子４４が欠けるような不
都合は生じない。In the next step, the gate piece 41 is removed from the transistor element 44.
．． 43, but at this time, since the cross-sectional area of the junction between the gate piece 41143 and the transistor element 44 is small,
Inconveniences such as residual spots or chipping of the transistor element 44 do not occur.
なお、上記実施例においては、パワートランジスタ素子
の樹脂封止・成形について、この発明の方法を適用した
ものを示しているが、この発明は、ＦＥＴ、ＳＣＲ等の
半導体素子の樹脂封止・成形のみならず、キャビティ内
において被封止物が大きな空間を占める樹脂成形品に広
く適用できるものである。In the above embodiments, the method of the present invention is applied to resin encapsulation and molding of power transistor elements, but this invention also applies to resin encapsulation and molding of semiconductor elements such as FETs and SCRs. In addition, the present invention can be widely applied to resin molded products in which the object to be sealed occupies a large space within the cavity.
また、上記実施例においては、この発明の方法をトラン
スファ成形に適用しているが、この発明は、熱可塑性樹
脂を使用する射出成形にも適用できるものである。Further, in the above embodiments, the method of the present invention is applied to transfer molding, but the present invention can also be applied to injection molding using thermoplastic resin.
（へ）発明の効果
この発明の樹脂成形方法は、金型の分割面の両側に、そ
れぞれ独立して設けられたゲートより同時にキャビティ
内に樹脂を流入させるものであるから、キャビティ内に
流入した樹脂の流れが乱されず、その結果、空気を巻込
むことにより生じる気泡の発生を有効に防止できる利点
を有し、またゲートのキャビティへの開ゴ面積が小さく
て済むので、ゲート片と製品を切離す際に製品が欠けた
り、製品に大きなパリが残らず、製品の外観が損なわれ
ない利点をも有する。(F) Effects of the Invention The resin molding method of the present invention allows resin to simultaneously flow into the cavity through gates provided independently on both sides of the dividing surface of the mold, so that the resin can flow into the cavity simultaneously. It has the advantage that the flow of resin is not disturbed, and as a result, it can effectively prevent the generation of bubbles caused by air entrainment.Also, since the opening area of the gate to the cavity is small, the gate piece and the product can be easily It also has the advantage that the product will not be chipped or large cracks will be left on the product when it is separated, and the appearance of the product will not be damaged.
第１図は、この発明の一実施例において使用される上型
と下型を合わせた状態での断面図、第２図は、同下型分
割面の一部を示す斜視図、第３図は、同上型分割面の一
部を示す下方より見た斜視図、第４図は、同上型及び同
下型より取出された直後のトランジスタ素子を示す斜視
図、第５図は、従来の樹脂成形方法において使用される
上型と下型とを合わせた状態での断面図である。
２：ランナ部、３：キャビティ、
１１：下型、 １４・３４：ゲート、２５：放熱板、
３１：上型。
特許出願人 ローム株式会社代理人
弁理士 中 村 茂 信第２図
第３図
スフ
ｊ］−よ’ｆFIG. 1 is a cross-sectional view of the combined upper and lower molds used in one embodiment of the present invention, FIG. 2 is a perspective view showing a part of the dividing surface of the lower mold, and FIG. 3 4 is a perspective view showing a part of the dividing surface of the upper mold as seen from below, FIG. 4 is a perspective view showing the transistor element immediately after being taken out from the upper mold and the lower mold, and FIG. 5 is a conventional resin FIG. 2 is a cross-sectional view of an upper mold and a lower mold used in a molding method in a combined state. 2: Runner part, 3: Cavity, 11: Lower mold, 14/34: Gate, 25: Heat sink,
31: Upper mold. Patent applicant ROHM Co., Ltd. agent
Patent Attorney Shigeru Nakamura (Figure 2, Figure 3)
Claims (1)
ビティ及びランナ部を形成し、このキャビティ内には被
封止物を支持すると共に、前記ランナ部に注入された可
塑化した樹脂をこのランナ部と前記キャビティ内を連通
するゲートを通して、キャビティ内に充填させる樹脂成
形方法において、前記金型の分割面の両側にそれぞれ独
立して設けられたゲートより、同時に前記キャビティ内
に樹脂を流入させることを特徴とする樹脂成形方法。(1) A cavity and a runner part are formed by combining at least two molds, and the object to be sealed is supported in the cavity, and the plasticized resin injected into the runner part is mixed with the runner part. The resin molding method is characterized in that the resin is filled into the cavity through a gate that communicates with the cavity, and the resin is simultaneously caused to flow into the cavity through gates that are independently provided on both sides of the dividing surface of the mold. Resin molding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27003385A JPS62128721A (en) | 1985-11-29 | 1985-11-29 | Molding of resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27003385A JPS62128721A (en) | 1985-11-29 | 1985-11-29 | Molding of resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62128721A true JPS62128721A (en) | 1987-06-11 |
| JPH0531448B2 JPH0531448B2 (en) | 1993-05-12 |
Family
ID=17480595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27003385A Granted JPS62128721A (en) | 1985-11-29 | 1985-11-29 | Molding of resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62128721A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02165644A (en) * | 1988-12-20 | 1990-06-26 | Sanyo Electric Co Ltd | Resin molding device for electronic parts its manufacture, and mold for molding |
| US5266259A (en) * | 1991-09-17 | 1993-11-30 | Ford Motor Company | Molding a reinforced plastics component |
| US5275546A (en) * | 1991-12-30 | 1994-01-04 | Fierkens Richard H J | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
| US5445995A (en) * | 1991-12-20 | 1995-08-29 | Sgs-Thomson Microelectronics, S.R.L. | Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink |
| US5578261A (en) * | 1993-05-17 | 1996-11-26 | Lucent Technologies Inc. | Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling |
| US5637273A (en) * | 1993-11-30 | 1997-06-10 | Anam Industrial Co., Ltd. | Method for molding of integrated circuit package |
| JP2018192760A (en) * | 2017-05-22 | 2018-12-06 | 三菱電機株式会社 | Insert resin-molded article |
-
1985
- 1985-11-29 JP JP27003385A patent/JPS62128721A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02165644A (en) * | 1988-12-20 | 1990-06-26 | Sanyo Electric Co Ltd | Resin molding device for electronic parts its manufacture, and mold for molding |
| US5266259A (en) * | 1991-09-17 | 1993-11-30 | Ford Motor Company | Molding a reinforced plastics component |
| US5445995A (en) * | 1991-12-20 | 1995-08-29 | Sgs-Thomson Microelectronics, S.R.L. | Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink |
| US5275546A (en) * | 1991-12-30 | 1994-01-04 | Fierkens Richard H J | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
| US5578261A (en) * | 1993-05-17 | 1996-11-26 | Lucent Technologies Inc. | Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling |
| US5637273A (en) * | 1993-11-30 | 1997-06-10 | Anam Industrial Co., Ltd. | Method for molding of integrated circuit package |
| JP2018192760A (en) * | 2017-05-22 | 2018-12-06 | 三菱電機株式会社 | Insert resin-molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0531448B2 (en) | 1993-05-12 |
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